• 대한치과보철학회지
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• 제27권1호
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• pp.49-54
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• 1989

The purpose of this study was to investigate the interfacial elemental change when solding the Ni-Co-Cr dental removable partial denture alloy and Fe-Cr-Ni wrought wire alloy with Ag-Cu-Zu Silver solder, by EDXA, EPMA, to investigate the appropriateness of clinical usefullness for repair the fractured clasps of removable partial dentive. The result of this study was as follows: 1. The Ni element of major component of Ticonium penetrate into the silver solder 2. The movement Age element of silver solder into Fe-Cr-Ni wire was not significant, by EDXA and EPMA.

• Safety and Health at Work
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• 제11권2호
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• pp.235-240
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• 2020

Background: Cadmium exposure may induce chronic intoxication with renal damage. Silver soldering may be a source of cadmium exposure. Methods: We analyzed working environment measurement data and periodic health screening data from a small-scale silver soldering company with ten workers. Concentrations of cadmium in air from working environment measurement data were obtained. Concentrations of blood and urinary cadmium, urine protein, and urine β2-microglobulin (β2M) were obtained. The generalized linear model was used to identify the association between blood and urine cadmium and urine β2M concentrations. Clinical features of chronic cadmium intoxication focused with toxicological renal effects were described. Results: The mean duration of work was 8.5 years (standard deviation [SD] = 6.9, range = 3-20 years). Cadmium concentrations in air were ranged from 0.006 to 0.015 mg/㎥. Blood cadmium concentration was elevated in all ten workers, with a highest level of 34.6 ㎍/L (mean = 21.288 ㎍/L, SD = 11.304, range = 9.641-34.630 ㎍/L). Urinary cadmium concentration was elevated in nine workers, with a highest level of 62.9 ㎍/g Cr (mean = 22.151 ㎍/g creatinine, SD = 19.889, range = 3.228-62.971 ㎍/g creatinine). Urine β2M concentration was elevated in three workers. Urinary cadmium concentration was positively associated with urine protein concentration (beta coefficient = 10.27, 95% confidence interval = [4.36, 16.18]). Other clinical parameters were compatible with renal tubular damage. Conclusion: Cadmium intoxication may occur at quite low air concentrations. Exposure limit may be needed to be lowered.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.58.1-58.1
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• 2010

In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.

• 헤리티지:역사와 과학
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• 제49권2호
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• pp.172-189
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• 2016

본 연구에서는 "오주서종박물고변(五洲書種博物考辯)", "천공개물(天工開物)" 등 고문헌에 기록된 오동 재료와 합금비, 주조 시설, 주조법 등을 확인하고 이를 기초자료로 활용하여 오동상감기법으로 장도를 제작하였다. 오동상감기법 장도 제작은 크게 오동 합금, 은땜 합금, 오동판과 은판 제작, 칼자루와 칼집 제작, 장도의 장석인 두겁 및 부속품 제작, 오동 상감, 조립의 순으로 진행하였다. 오동의 합금은 "오주서종박물고변"에 보이는 상품(上品)으로 전통방식의 진오동(眞烏銅) 합금비인 구리와 금을 20:1의 중량비로 하였다. 은땜의 합금은 상감된 문양에 사용한 경우 은과 황동(Cu 7 : Zn 3)을 중량비 5:1로, 단순 접합 사용한 경우에는 은과 황동을 중량비 5:2로 합금하여 은땜판을 제작하였다. 칼집과 칼자루 제작은 진오동 합금비로 만든 오동 괴를 풀림과 단조작업을 실시하여 오동판의 두께를 0.6mm로, 오동의 뒷면인 은판도 두께 0.6mm로 제작한 뒤, 오동판과 은판 접합, 풀림과 단조, 오동판에 문양 새기기, 은 상감하기, 오동판으로 칼집과 칼자루 모양잡기, 은땜으로 접합하기, 연마 및 광택내기 등의 과정을 거쳐 완성하였다. 붉은색의 오동판 표면을 검은색으로 부식시키는 '오동 살리기(발색하기)'는 오동 합금의 품위에 따라 발색 효과가 차이가 난다. 한지를 30일 정도 썩힌 인뇨(人尿)에 적셔 칼집과 칼자루 등에 감아 따뜻한 곳($25^{\circ}C$ 이상)에 두고 2~3시간이 경과하면 오동판의 겉면만 검은색으로 발색되고 은이 상감된 문양은 그대로 있어 오동상감기법을 재현할 수 있었다. 오동상감 복원에 사용했던 오동판, 은판, 은땜판의 합금성분과 오동의 표면 발색성분을 알기 위해 과학분석을 실시하였다. 오동 합금 분석(시료 2개)결과 고문헌 기록(Cu 95wt%, Au 5wt%)과 평균성분비가 유사한 Cu 95.57wt%, Au 4.16wt%과 차이가 있는 Cu 98.04wt%, Au 1.95wt%로 검출되었는데, 전자는 오동판 가공에 성공률이 높은 반면, 후자는 가공과정에서 터지는 등의 실패가 있었다. 오동판과 은판이 부착된 시료의 성분분석 결과 은판 부분은 Ag 100wt%로 검출되었고, 오동판과 은판이 접합된 부분은 Cu, Ag, Au가 모두 검출되어 접합이 잘 되었음을 확인할 수 있었다. 은과 황동을 합금한 은땜판은 분석결과 Ag 성분이 다양하게 검출되고 있어 성분비와 관계없이 매우 불균질하게 섞여있음을 관찰하였다. 오동판에 검은색으로 발색된 부분의 성분분석 결과 소지 금속에서 검출되지 않았던 S의 함량이 검출되어 S의 함량이 오동 색상에 영향을 미친 것으로 판단되었다. 향후 발색에 대한 정확한 메커니즘을 밝히기 위해서는 추가적인 화합물, 색도 및 재현 연구 등 추가연구가 필요하다. 이번 연구를 통해 시도 및 확인된 고문헌 속의 오동합금 실험 및 재현, 오동상감기법에 의한 장도제작, 오동판 검은색 발색 메커니즘의 과학 분석결과 등은 오동상감기법의 복원을 위한 중요한 기초자료로 활용될 수 있을 것이다.

• Journal of Welding and Joining
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• 제23권3호
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.45-47
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• 2001

Due to pressure from threatened legislation in Europe, consumer and governmental pressure in Japan, and glob머 market considerations in the US, there is a rapidly growing interest in lead-free solderinger, Although the move to lead free soldering seems inevitable, many problems will arise in production assembly. It is generally acknowledged that the lead-free solders available offer a much s smaller process window than lead/tin, related mainly to the higher soldering temperatures which naturally result from increases of liquidus temperatures of at least 300 C. However, raising reflow temperatures from the current 220-2300 C to 250 2600 C will lead to problems with the boards and components as well as i increasing oxidation effects. There is a need to keep reflow temperatures low without reducing solderablity. Some results on benefits of inert atmospheres are discussed in this paper. For example, testing in a nitrogen atmosphere, with 300 ppm oxygen, by the N National Physical Laboratory (NPU has revealed clear benefits for ine$\pi$mg lead-free alloys, by restoring the solderability to lead/tin levels, by enabling lower soldering temperatures. However, there has been little testing over a range of oxygen levels in nitrogen and this is an important issue in determining n nitrogen supply and oven costs. Some results are reported here from work by NPL conducted for BOC in w which solderability was evaluated for tin기ead and tin/silver/copper eutectic a alloys in a wetting balance over a range of oxygen levels form 10 ppm to 21% ( (air). The studies confirm that acceptable wetting times occur in inert atmospheres a at soldering temperatures 20 to 300 C lower than are possible in air.

• 한국재료학회지
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• 제13권1호
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• pp.18-23
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• 2003

Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

• 보존과학회지
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• 제26권1호
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• pp.13-24
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• 2010

부여 능산리사지 출토 누금세공 유물 4점을 대상으로 기초적인 재질특성과 미세조직을 분석하여 각각에 대한 제작방법을 살펴보았다. 이 결과 모두 22.7K 이상의 비교적 높은 순도를 나타냈으며 일부 유물에서는 금과 은이 일정 비율로 합금된 상태를 보였다. 표면을 장식한 금선은 0.2~0.8mm 두께를 보이고 다양한 단면형태를 나타냈다. 금입자는 2개 또는 3개가 접합되어 부착된 상태로, 0.3~0.8mm의 직경을 나타냈다. 금세선과 금입자의 표면 접합부에서는 땜의 잔재가 관찰되었으며 성분분석을 통해 금 땜의 사용 가능성을 확인하였다. 또한 진사(HgS), 먹과 같은 안료를 감장하여 표면을 장식한 모습도 보였다.

• 마이크로전자및패키징학회지
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• 제13권1호통권38호
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• pp.23-29
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• 2006

Si-웨이퍼와 FR-4 기판을 상온에서 초음파 접합한 후, 접합부의 신뢰성을 평가하였다. Si-웨이퍼 상의 UBM(Under Bump Metallization)은 위에서부터 Cu/ Ni/ Al을 각각 $0.4{\mu}m,\;0.4{\mu}m,\;0.3{\mu}m$의 두께로 전자빔으로 증착하였다. FR-4 기판위의 패드는 위에서부터 Au/ Ni/ Cu를 각각 $0.05{\mu}m,\;5{\mu}m,\;18{\mu}m$의 두께로 전해 도금하여 형성하였다. 접합용 솔도로는 Sn-3.5wt%Ag을 두께 $100{\mu}m$으로 압연하여 사용하였다. 시편의 초음파 접합을 위하여 초음파 접합 시간을 0.5초에서 3.0초까지 0.5초 단위로 증가시키면서 상온에서 접합하였으며, 이 때 출력은 1,400W로 하였다. 실험 결과, 상온 초음파 접합법에 의해 신뢰성 있는 'Si-웨이퍼/솔더/FR-4기판' 접합부를 얻을 수 있었다. 접합부의 전단 강도는 접합 시간에 따라 증가하여 접합 시간 2.5초에서 65N으로 가장 높게 측정되었다. 이 후 접합 시간 3.0초에서는 전단 강도가 34N으로 감소하였는데, 이는 초음파 접합시간이 과도해지면서 Si-웨이퍼와 솔더 사이의 계면을 따라 균열이 발생되었기 때문으로 판단된다. 초음파 접합에 의해 Si-웨이퍼와 솔더 사이에서 생성된 금속간 화합물은 ($(Cu,Ni)_{6}Sn_{5}$)으로 확인되었다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.61-65
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• 2009

Window integrated solar collector is to simply install inside of the existing double glass window frame. Double glass window frame is consist of inner glass of Low-E coating and Silver coating, and outer glass of low iron reinforced glass. In order to secure natural lighting in a room, only 50% of window frame is covered with solar collectors. Solar absorption or transmission rate varies seasonally depending on sun angles. Part of inner glass where right behind of the solar plate is covered with silver coating to increase absorption rate of solar plate. The collector is made of a copper serpentine where aluminum fins are soldering. To improve the effect of insulation of inside of the window frame is recommend vacuum. As a result, we are making the 3th sample and will archieve below $F_RU_L=7.5W/m^2^{\circ}C$ that is the account of heat lossed, and above $F_R({\tau}{\alpha})=0.45$.