• Tribology and Lubricants
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• 제35권5호
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• 한국광학회지
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• 제14권5호
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• pp.504-508
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• 2003

최근 전자산업계에 새롭게 널리 생산되는 마이크로 전자부품들은 왜곡이 최소화된 정밀한 외관 형상을 갖도록 제조되고 관리되지만, 측정 대상의 표면이 가시광 영역에서 광산란되는 특징을 가짐으로 인해, 기존의 피죠나 마이켈슨 형태의 비교간섭법으로는 고정밀의 삼차원 형상측정이 용이하지 아니하였다. 본 논문에서는 광섬유를 이용한 새로운 개념의 점회절 간섭계를 제안하고, 이를 광산란 거친표면의 대표적인 제품인 칩패키지와 실리콘 웨이퍼의 삼차원 형상 측정에 적용하였다. 측정결과 66 mm 측정영역에서 측정 형상오차 PV(peak-to-valley value) 5.6 $\mu\textrm{m}$, 분산값($\sigma$) 1.5 $\mu\textrm{m}$를 획득함으로써 기존의 비교 간섭 측정법에 비해 더욱 향상된 측정 정밀도를 획득하였다.

• 대한소아치과학회지
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• 제23권2호
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• pp.357-364
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• 1996

소아치과 임상에서 자주 사용되는 3 종의 광중합형 GIC의 아말감에 대한 접착능을 평가 할 목적으로 60 개의 아말감 부착시편을 이용하여 중간결합제인 Scotchbond 의 사용여부에 따른 경화된 아말감에 대한 광중합 GIC의 전단결합강도를 측정하고 경계부의 파절양상을 관찰한 결과, 다음과 같은 결론을 얻었다. 1. 아말감에 대한 광중합형 GIC의 전단강도는 Fuji II LC, Vitremer, Vitrebond의 순으로 높게 나타났다 (p<0.05). 2. 중간결합제인 Scotchbond를 사용하지 않은 경우에서 Scotchbond 를 사용한 경우에 비해 전단결합강도가 높게 나타났다(p<0.05). 3. 결합파절면은 Scotchbond를 사용한 경우의 대부분에서 Scotchbond와 아말감의 경계부에서 시편의 탈락이 나타났다. 아말감과 광중합 GIC의 결합을 시도할 경우에는 Scotchbond는 사용하지 않는 것이 바람직할 것으로 사료되었다.

• 대한소아치과학회지
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• 제23권2호
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• pp.489-501
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• 1996

This study was to evaluate shear bond strength of fluoride-releasing sealant and nonfluoride releasing sealant to enamel surface of bovine tooth. 80 extracted bovine teeth were randomly assigned to four groups, and four kinds of sealants including Teethmate-A(Kuraray Co.), Teethmate-F(Kuraray Co.), Helioseal(Vivadent Co.), Helioseal-F(Vivadent Co.) were bonded to exposed enamel surfaces using silicon plate. Shear bond strength was determined in an instron universal testing machine at a crosshead speed of 1mm/min. Then, the fracture surfaces of test specimens were investigated with scanning electron microscope. The obtained results were as follows; 1. The shear bond strength decreased in the following order : Teethmate-A(18.31MPa), Teethmate-F(11.90MPa), Helioseal (11.74 MPa), Helioseal-F(10.64MPa). 2. The shear bond strength of Teethmate-A showed significantly higher than that of Teethmate-F(P<0.05), but Helioseal and Helioseal-F didn't showed statistically different(P<0.05). 3. According to the SEM, Teethmate-A group showed cohesive failure, and Teethmate-A group & Helioseal group showed mixed pattern of cohesive and adhesive failure and Helioseal-F group showed adhesive failure.

• KSTLE International Journal
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• 제6권2호
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• pp.39-44
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• 2005

Friction and wear properties of the Boron carbide ($B_{4}C$) coating 100 nm thickness were studied under various relative humidity (RH). The boron carbide film was deposited on silicon substrate by DC magnetron sputtering method using $B_{4}C$ target with a mixture of Ar and methane ($CH_4$) as precursor gas. Friction tests were performed using a reciprocation type friction tester at ambient environment. Steel balls of 3 mm in diameter were used as counter-specimen. The results indicated that relative humidity strongly affected the tribological properties of boron carbide coating. Friction coefficient decreased from 0.42 to 0.09 as the relative humidity increased from $5\%$ to $85\%$. Confocal microscopy was used to observe worn surfaces of the coating and wear scars on steel balls after the tests. It showed that both the coating surface and the ball were significantly worn-out even though boron carbide is much harder than the steel. Moreover, at low humidity ($5\%$) the boron carbide showed poor wear resistance which resulted in the complete removal of coating layer, whereas at the medium and high humidity conditions, it was not. X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) analyses were performed to characterize the chemical composition of the worn surfaces. We suggest that tribochemical reactions occurred during sliding in moisture air to form boric acid on the worn surface of the coating. The boric acid and the tribochemcal layer that formed on steel ball resulted in low friction and wear of boron carbide coating.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.4-5
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• 2010

The surface phonon is defined as a coherent vibrational excitation of surface atoms propagating along the surface. It is characterized by a phonon dispersion curves, which were extensively studied in 1990's using helium atom scattering and high-resolution electron-energy-loss spectroscopy (HREELS)[1].The understanding is mainly based on the theoretical framework of a classical bond model or cluster calculations. The recent sample preparation and first principles calculations open the naval way to deep insight for surface phonon problems. The surface phonon dispersion on the hydrogen-terminated Si(111)-($1{\times}1$) surface [H:Si(111)] is the typical system and already reported experimentally [2] and theoretically [3], although the understandingis incomplete. The sample contaminated by the oxygen atoms on the surface and the calculations were also classical. In this study, firstly, we have prepared an ultra-clean H:Si(111) surface [4] and measured the surface phonon dispersion curvesusing HREELS. Secondly, we have performed first-principles density functional calculations with the projector augmented wave functionals, as implemented in VASP, using generalized gradient approximations. We used aslab of six silicon layers and both top and bottom surfaces were terminated with hydrogen atoms. Finally, we have compared with the surface phonon dispersion of deuterium-terminatedSi(111)-($1{\times}1$) surface[5] and led to our conclusions. The Si-H stretching and the bending modes are observed at 258.5 and 78.2 meV, respectively. These energies are the same as the previously reported values [2], but the energy-loss peaks at the lower energy regions are dramatically shifted. Through this combination study, we have formulated the procedure of preparing ultra-clean H:Si(111)/D:Si(111), which was confirmed by HREELS vibrational analysis. The Si surface will be utilized for further nano-physics research as well as for the materials for nano-fubrication.

• 한국식품위생안전성학회지
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• 제23권4호
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• pp.291-296
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• 2008

현재 미국 및 유럽에서 공정시험법 중 하나로 인정되고 있는 표면시험법을 사용하여 유기물과 함께 또는 유기물 없이 세균만 건조된 식품접촉 표면에서의 살균소독제 유효성에 대한 정보를 제공하고자 식품접촉표면으로 사용되는 스테인리스, 폴리프로필렌 및 실리콘에 Escherochia coli ATCC 10536 또는 Staphylococcus aureus ATCC 6538을 접종하고 살균소독제로서 염화벤잘코늄, 차아염소산나트륨 또는 에탄올을 $20^{\circ}C$에서 5분간 처리하였다. 그 결과, 각 표면의 종류는 살균소독제의 유효성에 큰 영향을 미치지 않았으며, 200 ppm 농도의 염화벤잘코늄 및 차아염소산나트륨은 유기물질이 존재할 경우 생균수를 $4\;cfu\;\log_{10}$/carrier 이상 감소시키지 못하였으나, 40% 에탄올은 생균수를 $4\;cfu\;\log_{10}$/carrier 이상 감소시키는 것으로 나타났다.

• 한국응용과학기술학회지
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• 제16권1호
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• pp.33-40
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• 1999

We used Cu as a representative of metals to be directly adsorbed on the bare Si surface and studied its removal DHF, DHF-$H_2O_2$ and BHF solution. It has been found that Cu ion in DHF adheres on every Si wafer surface that we used in our study (n, p, n+, p+) especially on the n+-Si surface. The DHF-$H_2O_2$ solution is found to be effective in removing metals featuring high electronegativity such as Cu from the p-Si and n-Si wafers. Even when the DHF-$H_2O_2$ solution has Cu ions at the concentration of 1ppm, the solution is found effective in cleaning the wafer. In the case the n+-Si and p+-Si wafers, however, their surfaces get contaminated with Cu When Cu ion of 10ppb remains in the DHF-$H_2O_2$ solution. When BHF is used, Cu in BHF is more likely to contaminate the n+-Si wafer. It is also revealed that the surfactant added to BHF improve wettability onto p-Si, n-Si and p+-Si wafer surface. This effect of the surfactant, however, is not observed on the n+-Si wafer and is increased when it is immersed in the DHF-$H_2O_2$ solution for 10min. The rate of the metallic contamination on the n+-Si wafer is found to be much higher than on the other Si wafers. In order to suppress the metallic contamination on every type of Si surface below 1010atoms/cm2, the metallic concentration in ultra pure water and high-purity DHF which is employed at the final stage of the cleaning process must be lowered below the part per trillion level. The DHF-$H_2O_2$ solution, however, degrades surface roughness on the substrate with the n+ and p+ surfaces. In order to remove metallic impurities on these surfaces, there is no choice at present but to use the $NH_4OH-H_2O_2-H_2O$ and $HCl-H_2O_2-H_2O$ cleaning.

• Restorative Dentistry and Endodontics
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• 제24권2호
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• pp.416-425
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• 1999

The purpose of this study was to evaluate shear bond strength of glass ionomer cements and compomer according to dentin surface treatment method. The materials used in this study were dentin conditioner and cavity conditioner for dentin treatment: Ketacfil, Fuji II LC, and Dyract for restoration. In this study, 90 sound bovine teeth were selected and then the teeth were embeded in improved stone and were grounded with 400 to 600 grit silicon carbide paper to create a flat dentin surfaces. The teeth were divided into nine groups as follows ; Group 1A : Samples bonded to dentin surface with Ketacfil after no treatment Group 1B : Samples bonded to dentin surface with Ketacfil after applicating dentin conditioner Group 1C : Samples bonded to dentin surface with Ketacfil after applicating cavity conditioner Group 2A : Samples bonded to dentin surface with Fuji II LC after no treatment Group 2B : Samples bonded to dentin surface with Fuji II LC after applicating dentin conditioner Group 2C : Samples bonded to dentin surface with Fuji II LC after applicating cavity conditioner Group 3A : Samples bonded to dentin surface with Dyract after no treatment Group 3B : Samples bonded to dentin surface with Dyract after applicating dentin conditioner Group 3C : Samples bonded to dentin surface with Dyract after applicating cavity conditioner Treated dentin surfaces were observed under SEM. After filling of each materials, shear bond strenth was evaluated and then debonded surfaces were observed under SEM. The following results were obtained; 1. The shear bond strengths obtained were decreased as Fuji II LC, Dyract, Ketacfil in that order and there was statistically significant difference(p<0.05). 2. About Group 1. the shear bond strengths were decreased as 1C, 1B and 1A in that order. But there was no significant difference between group 1B and 1C (p<0.05). 3. About Group 2, the shear bond strengths were decreased as group 2B, 2A and 2C in that order. And there was significant difference between group 2B and 2C (p<0.05). 4. About Group 3, the shear bond strengths were decreased as group 3A, 3C and 3B in that order. And there was signicant difference between group 3A and 3B (p<0.05). 5. As a result of observation under SEM, the fracture patterns of Fuji II LC and Dyract were adhesive failures, but those of Ketacfil were cohesive failure of material and mixture of cohesive and adhesive failure.

• 한국재료학회지
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• 제15권4호
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• pp.246-251
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• 2005

Plasma enhanced chemical vapor deposition(PE-CVD) method has an advantage in synthesizing carbon nanotubes(CNTs) at lower temperature compared with thermal enhanced chemical vapor deposition(TE-CVD) method. In this study, CNTs was prepared by using PE-CVD method. The growth rate of CNT was faster more than 100 times on using Invar alloy than iron as catalyst. It was found that chrome silicide was formed at the interface between chrome layer and silicon substrate which should be considered in designing process. Nanoparticles of Invar catalyst were found oxidized on their surfaces with a depth of 10 m. Microstructure was analyzed by scanning electron microscopy, transmission electron microscopy, scanning transmission electron microscopy, and energy dispersive x-ray spectrometry. Based on the result of analysis, growth mechanism at an initial stage was suggested.