• Restorative Dentistry and Endodontics
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• 제13권2호
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• pp.207-220
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• 1988

The purpose of this study was to measure roughness on the polished surfaces of composite resin, and was to observe the polished surfaces under Scanning Electron Microscope. The surface roughness tester (Surfcom 700A Semitsu Profilometer Tokyo. Japan) was used to measure roughness of polished surfaces. In this study, 4 brands of composite resin were examined, Pyrofil bond anterior Bell-Feel anterior Clearfil F II and Microrest A.P. White point, Silicone point, Super snap, and Sof-Lex medium disc as cutting instrument, and celluloid matrix were used. The results obtained were as follows. 1) The celluloid matrix produced the smoothest surfaces. 2) Microrest composite resin had smoother surface than any other composite resins after polishing. 3) The values of surface roughness made by White point, Silicon point and Super snap were similar. 4) The surfaces made by Sof-Lex medium disc was smoother than the surfaces made by any other polishing instruments.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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• pp.128.1-128.1
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• 2011

In amorphous silicon and crystalline silicon(a-Si:H/c-Si) heterojuction solar cells, intrinsic hydrogenated amorphous silicon(a-Si:H) films play an important role to passivate the crystalline silicon wafer surfaces. We have studied the correlation between the surface passivation quality and nature of the Si-H bonding at the a-Si:H/c-Si interface. The samples were obtained by VHF-CVD under different deposition conditions. The passivation quality and analysis of all structures studied was performed by means of quasi steady state photoconductance(QSSPC) methods and fourier transform infrared spectrometer(FTIR) measurements respectively.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.207-208
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• 2002

In the present study, the friction and wear properties of boundary lubricated textured surfaces were investigated. The capability of textured surfaces to feed lubricant into the interface of a sliding contact and to isolate wear partices was studied and related to the properties of the textured surfaces. Well-defined surface textures were produced by lithography and anisotropic etching of silicon wafers. Different widths and distributions of parallel groves were manufactured and subsequently the wafers were PVD coated with thin wear resistant TiN or DLC coatings, retaining the substrate texture. The surfaces were evaluated in reciprocating sliding against a ball bearing steel ball under starved or boundary lubricated conditions.

• Restorative Dentistry and Endodontics
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• 제16권2호
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• pp.197-212
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• 1991

The purpose of this study was to roughness on the polished surface of visible light composite resins and was to observe the polished surfaces under Scanning Electrom Microscope(ISI DS 130 AKASHI Co. JAPAN). The surface roughness tester(Surfcom 700A Seimtsu profilometer Tokyo, Japan) was used to measure roughness of polished surfaces. In this study, 5 brands of visible of composite resins were examined, Pyrofile light bond Anterior Lite fil anterior Photo clearfil anterior & posterior Palfique light Anterior and posterior Silux Anterior. White point, Silicure point, Super snap Sof-Lex medium disk as cutting instrument, and celluloid matrix were used. The results obtained were as follows. 1. The Celluloid matrix produced the smoothest surfaces. 2. The surfaces made by Soflex medium disk was smoother than the surfaces made by any other polishing instruments. 3. The values of surface roughness made by White point, Silicon point and Super snap were similer. 4. Palfique light (AP) visible light composite resin showed the smoothest surface after polishing with Silicone point, Super snap disk and Soflex mediuem disk in all tested materials.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.369-369
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• 2012

The present work deals with selective deposition of copper on fluoropolymers patterned silicon (111) surfaces. The pattern of fluoropolymer was fabricated by nanoimprint lithography (NIL) and plasma reactive ion etching (RIE) was used to remove the residuals layers. Copper was electrochemically deposited in bare Si regions which were not covered with fluoropolymers. The patterns of fluoropolymers and copper have been investigated by scanning electron microscopy (SEM). In this work, we used two deposition methods. One is galvanic displacement method and another is electrodeposition. Selective deposition works in both cases and it shows applicability to other materials. By optimization of the deposition conditions can be achieved therefore this process represents a simple approach for a direct high resolution patterning of silicon surfaces.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.148-153
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• 2007

The effect of silicon carbide (SiC) and graphite fillers incorporation on the abrasive wear behaviour of glass-vinyl ester (G-V) composites have been investigated. The three-body abrasive wear behaviour was assessed by rubber wheel abrasion tests (RWAT). The worn surfaces were examined using scanning electron microscopy (SEM). The addition of SiC and graphite fillers in G-V composite improves the abrasion resistance under different loads/abrading distances. The SEM studies indicate the reasons for failure of composites and influencing parameters.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.81-84
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• 1995

A reliable bonding between two silicon wafers, regularly grooved and non-grooved, was done by the direct boning technology, It is Presented that high structural duality was realized not only at the bended interface but in the bulk, commensurate with the filling of artificial grooves, which would be attributed to the dislocation-gettering capability of groove free-surfaces during annealing. The groove filling would be explained with mass-transport phenomena assisted by the dislocation movement from initial contact boundaries toward groove surfaces. Intrinsic voids can be easily removed by aid of the grooves. The proposed method yielded also an intimate bonding not only between {111} wafers strongly misoriented and slightly inclined to {111} basal plane but even between {111} and {100} orientation wafers.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.332-333
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• 2006

The properties of a cable Insulate capacity between surfaces with the variation of the interfacial breakdown, the addition of silicon oil, the variation of pressure and interfacial roughness were investigated. The Insulate trouble of a power cable is out of the interfacial parts, which breakdown the insulate breakdown capacity in a power cable. In this study, the analysis of electric field and the phenomenon of interfacial breakdown were reported by varying the surfaces condition of silicon rubber, XLPE used for connection materials of a power cable.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.921-926
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• 1997

SOI(Silicon On lnsulator) technology is many advantages in the gabrication of MOS(Metal-Oxide Semiconductor) and CMOS(Complementary MOS) structures. These include high speed, lower dynamic power consumption,greater packing density, increased radiation tolearence et al. In smiple form of bonded SOL wafer manufacturing, creation of a bonded SOI structure involves oxidizing at least one of the mirror polished silicon surfaces, cleaning the oxidized surface and the surface of the layer to which it will be bonded,bringing the two cleanded surfaces together in close physical proximity, allowing the subsequent room temperature bonding to proceed to completion, and than following this room temperature joining with some form of heat treatment step,and device wafer is thinned to the target thickness. This paper has been performed to investigate the possibility of the bonded SOI wafer manufacturing Especially, we focused on the bonding quality and thinning method. Finally,we achieved the bonded SOI wafer that Si layer thickness is below 3 .mu. m and average roughness is below 5.angs.

• 수산해양교육연구
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• 제20권3호
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• pp.410-415
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• 2008

To evaluate the performance of nucleate boiling heat transfer between a plain and micro-fin surfaces, the experimental tests have been carried out under various conditions with fluorinert liquid FC-72, which is chemically and electrically stable. Two kinds of micro fins with the dimensions of $200{{\mu}m}{\times}20{{\mu}m}$ and $100{{\mu}m}{\times}10{{\mu}m}$ (width x height) were fabricated on the surface of a silicon chip. The experiments were performed on the liquid subcooling of 5, 10 and 20K under the atmospheric condition. The presented data showed a similar trend in the comparison with result of Rainey & You. Due to its expanded surface areas, the heat flux properties has been significantly enhanced on micro-fin surface comparing to the plain surface.