• Tribology and Lubricants
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• v.35 no.5
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• Korean Journal of Optics and Photonics
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• v.14 no.5
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• pp.504-508
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• 2003

We present a new point-diffraction interferometer, which has been devised for the three-dimensional profile measurement of light scattering rough surfaces. The interferometer system has multiple sources of two-point-diffraction and a CCD camera composed of an array of two-dimensional photodetectors. Each diffraction source is an independent two-point-diffraction interferometer made of a pair of single-mode optical fibers, which are housed in a ceramic ferrule to emit two spherical wave fronts by means of diffraction at their free ends. The two spherical wave fronts then interfere with each other and subsequently generate a unique fringe pattern on the test surface. A He-Ne source provides coherent light to the two fibers through a 2${\times}$l optical coupler, and one of the fibers is elongated by use of a piezoelectric tube to produce phase shifting. The xyz coordinates of the target surface are determined by fitting the measured phase data into a global model of multilateration. Measurement has been performed for the warpage inspection of chip scale packages (CSPs) that are tape-mounted on ball grid arrays (BGAs) and backside profile of a silicon wafer in the middle of integrated-circuit fabrication process. When a diagonal profile is measured across the wafer, the maximum discrepancy turns out to be 5.6 ${\mu}{\textrm}{m}$ with a standard deviation of 1.5 ${\mu}{\textrm}{m}$.

• Journal of the korean academy of Pediatric Dentistry
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• v.23 no.2
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• pp.357-364
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• 1996

The purpose of this study was to asses the shear bond strengths of 3 types of light-curing Glass Ionomer cement to dental amalgam with or without an intermediary agent. 60 amalgam adherent specimens were prepared and aged in water at $37^{\circ}C$ for 3 days. Before bonding, the amalgam surfaces were finished flat on 600-grit silicon carbide paper. 30 specimens among 60 were used for bonding in this condition, and the other 30 were covered with a thin layer of light-curing intermediary agent. Shear bond strengths were measured with universal testing machine (Instron, Model 4301) and statistically processed by ANOVA and t-test. On completion of bond test, the fracture surfaces were examined under light microscope so that the mode of bond failure could be assessed The results were as follows : 1. Bond strength of Fuji II LC group showed the hightest value and was followed by Vitremer, Vitrebond groups (p<0.05). 2. The bond strengths achieved without an intermediary agent were higher than those obtained with intermediary agent (p<0.05). 3. For the specimens bonded with intermediary agent, bond failures occured mostly at the agent-amalgam interface. So, the use of intermediary bonding agent was thought not recommendable at glass ionomer-amalgam interface.

• Journal of the korean academy of Pediatric Dentistry
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• v.23 no.2
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• pp.489-501
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• 1996

This study was to evaluate shear bond strength of fluoride-releasing sealant and nonfluoride releasing sealant to enamel surface of bovine tooth. 80 extracted bovine teeth were randomly assigned to four groups, and four kinds of sealants including Teethmate-A(Kuraray Co.), Teethmate-F(Kuraray Co.), Helioseal(Vivadent Co.), Helioseal-F(Vivadent Co.) were bonded to exposed enamel surfaces using silicon plate. Shear bond strength was determined in an instron universal testing machine at a crosshead speed of 1mm/min. Then, the fracture surfaces of test specimens were investigated with scanning electron microscope. The obtained results were as follows; 1. The shear bond strength decreased in the following order : Teethmate-A(18.31MPa), Teethmate-F(11.90MPa), Helioseal (11.74 MPa), Helioseal-F(10.64MPa). 2. The shear bond strength of Teethmate-A showed significantly higher than that of Teethmate-F(P<0.05), but Helioseal and Helioseal-F didn't showed statistically different(P<0.05). 3. According to the SEM, Teethmate-A group showed cohesive failure, and Teethmate-A group & Helioseal group showed mixed pattern of cohesive and adhesive failure and Helioseal-F group showed adhesive failure.

• KSTLE International Journal
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• v.6 no.2
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• pp.39-44
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• 2005

Friction and wear properties of the Boron carbide ($B_{4}C$) coating 100 nm thickness were studied under various relative humidity (RH). The boron carbide film was deposited on silicon substrate by DC magnetron sputtering method using $B_{4}C$ target with a mixture of Ar and methane ($CH_4$) as precursor gas. Friction tests were performed using a reciprocation type friction tester at ambient environment. Steel balls of 3 mm in diameter were used as counter-specimen. The results indicated that relative humidity strongly affected the tribological properties of boron carbide coating. Friction coefficient decreased from 0.42 to 0.09 as the relative humidity increased from $5\%$ to $85\%$. Confocal microscopy was used to observe worn surfaces of the coating and wear scars on steel balls after the tests. It showed that both the coating surface and the ball were significantly worn-out even though boron carbide is much harder than the steel. Moreover, at low humidity ($5\%$) the boron carbide showed poor wear resistance which resulted in the complete removal of coating layer, whereas at the medium and high humidity conditions, it was not. X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) analyses were performed to characterize the chemical composition of the worn surfaces. We suggest that tribochemical reactions occurred during sliding in moisture air to form boric acid on the worn surface of the coating. The boric acid and the tribochemcal layer that formed on steel ball resulted in low friction and wear of boron carbide coating.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.4-5
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• 2010

The surface phonon is defined as a coherent vibrational excitation of surface atoms propagating along the surface. It is characterized by a phonon dispersion curves, which were extensively studied in 1990's using helium atom scattering and high-resolution electron-energy-loss spectroscopy (HREELS)[1].The understanding is mainly based on the theoretical framework of a classical bond model or cluster calculations. The recent sample preparation and first principles calculations open the naval way to deep insight for surface phonon problems. The surface phonon dispersion on the hydrogen-terminated Si(111)-($1{\times}1$) surface [H:Si(111)] is the typical system and already reported experimentally [2] and theoretically [3], although the understandingis incomplete. The sample contaminated by the oxygen atoms on the surface and the calculations were also classical. In this study, firstly, we have prepared an ultra-clean H:Si(111) surface [4] and measured the surface phonon dispersion curvesusing HREELS. Secondly, we have performed first-principles density functional calculations with the projector augmented wave functionals, as implemented in VASP, using generalized gradient approximations. We used aslab of six silicon layers and both top and bottom surfaces were terminated with hydrogen atoms. Finally, we have compared with the surface phonon dispersion of deuterium-terminatedSi(111)-($1{\times}1$) surface[5] and led to our conclusions. The Si-H stretching and the bending modes are observed at 258.5 and 78.2 meV, respectively. These energies are the same as the previously reported values [2], but the energy-loss peaks at the lower energy regions are dramatically shifted. Through this combination study, we have formulated the procedure of preparing ultra-clean H:Si(111)/D:Si(111), which was confirmed by HREELS vibrational analysis. The Si surface will be utilized for further nano-physics research as well as for the materials for nano-fubrication.

• Journal of Food Hygiene and Safety
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• v.23 no.4
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• pp.291-296
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• 2008

The study was undertaken to provide information on the efficacy of sanitizers against bacteria with and without organic road dried on to food contact surfaces using the surface test method which EU and USA are currently implementing as one of their official test methods. Escherochia coli ATCC 10536 or Staphylococcus aureus ATCC 6538 was inoculated on to food contact surfaces, such as stainless steel, polypropylene, and silicon, which was then treated with benzalkonium chloride, sodium hypochlorite, or ethanol as a sanitizer for 5minutes at $20^{\circ}C$. Results indicated that the type of surface had little affected the efficacy of various sanitizers. In addition, 200 ppm of benzalkonium chloride or 200 ppm of sodium hypochlorite showed no definite reduction of bacterial populations in the present of organic load, while 40% ethanol showed reduction to $4\;cfu\;\log_{10}$/carrier or more in viable count in the organic load.

• Journal of the Korean Applied Science and Technology
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• v.16 no.1
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• pp.33-40
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• 1999

We used Cu as a representative of metals to be directly adsorbed on the bare Si surface and studied its removal DHF, DHF-$H_2O_2$ and BHF solution. It has been found that Cu ion in DHF adheres on every Si wafer surface that we used in our study (n, p, n+, p+) especially on the n+-Si surface. The DHF-$H_2O_2$ solution is found to be effective in removing metals featuring high electronegativity such as Cu from the p-Si and n-Si wafers. Even when the DHF-$H_2O_2$ solution has Cu ions at the concentration of 1ppm, the solution is found effective in cleaning the wafer. In the case the n+-Si and p+-Si wafers, however, their surfaces get contaminated with Cu When Cu ion of 10ppb remains in the DHF-$H_2O_2$ solution. When BHF is used, Cu in BHF is more likely to contaminate the n+-Si wafer. It is also revealed that the surfactant added to BHF improve wettability onto p-Si, n-Si and p+-Si wafer surface. This effect of the surfactant, however, is not observed on the n+-Si wafer and is increased when it is immersed in the DHF-$H_2O_2$ solution for 10min. The rate of the metallic contamination on the n+-Si wafer is found to be much higher than on the other Si wafers. In order to suppress the metallic contamination on every type of Si surface below 1010atoms/cm2, the metallic concentration in ultra pure water and high-purity DHF which is employed at the final stage of the cleaning process must be lowered below the part per trillion level. The DHF-$H_2O_2$ solution, however, degrades surface roughness on the substrate with the n+ and p+ surfaces. In order to remove metallic impurities on these surfaces, there is no choice at present but to use the $NH_4OH-H_2O_2-H_2O$ and $HCl-H_2O_2-H_2O$ cleaning.

• Restorative Dentistry and Endodontics
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• v.24 no.2
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• pp.416-425
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• 1999

The purpose of this study was to evaluate shear bond strength of glass ionomer cements and compomer according to dentin surface treatment method. The materials used in this study were dentin conditioner and cavity conditioner for dentin treatment: Ketacfil, Fuji II LC, and Dyract for restoration. In this study, 90 sound bovine teeth were selected and then the teeth were embeded in improved stone and were grounded with 400 to 600 grit silicon carbide paper to create a flat dentin surfaces. The teeth were divided into nine groups as follows ; Group 1A : Samples bonded to dentin surface with Ketacfil after no treatment Group 1B : Samples bonded to dentin surface with Ketacfil after applicating dentin conditioner Group 1C : Samples bonded to dentin surface with Ketacfil after applicating cavity conditioner Group 2A : Samples bonded to dentin surface with Fuji II LC after no treatment Group 2B : Samples bonded to dentin surface with Fuji II LC after applicating dentin conditioner Group 2C : Samples bonded to dentin surface with Fuji II LC after applicating cavity conditioner Group 3A : Samples bonded to dentin surface with Dyract after no treatment Group 3B : Samples bonded to dentin surface with Dyract after applicating dentin conditioner Group 3C : Samples bonded to dentin surface with Dyract after applicating cavity conditioner Treated dentin surfaces were observed under SEM. After filling of each materials, shear bond strenth was evaluated and then debonded surfaces were observed under SEM. The following results were obtained; 1. The shear bond strengths obtained were decreased as Fuji II LC, Dyract, Ketacfil in that order and there was statistically significant difference(p<0.05). 2. About Group 1. the shear bond strengths were decreased as 1C, 1B and 1A in that order. But there was no significant difference between group 1B and 1C (p<0.05). 3. About Group 2, the shear bond strengths were decreased as group 2B, 2A and 2C in that order. And there was significant difference between group 2B and 2C (p<0.05). 4. About Group 3, the shear bond strengths were decreased as group 3A, 3C and 3B in that order. And there was signicant difference between group 3A and 3B (p<0.05). 5. As a result of observation under SEM, the fracture patterns of Fuji II LC and Dyract were adhesive failures, but those of Ketacfil were cohesive failure of material and mixture of cohesive and adhesive failure.

• Korean Journal of Materials Research
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• v.15 no.4
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• pp.246-251
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• 2005

Plasma enhanced chemical vapor deposition(PE-CVD) method has an advantage in synthesizing carbon nanotubes(CNTs) at lower temperature compared with thermal enhanced chemical vapor deposition(TE-CVD) method. In this study, CNTs was prepared by using PE-CVD method. The growth rate of CNT was faster more than 100 times on using Invar alloy than iron as catalyst. It was found that chrome silicide was formed at the interface between chrome layer and silicon substrate which should be considered in designing process. Nanoparticles of Invar catalyst were found oxidized on their surfaces with a depth of 10 m. Microstructure was analyzed by scanning electron microscopy, transmission electron microscopy, scanning transmission electron microscopy, and energy dispersive x-ray spectrometry. Based on the result of analysis, growth mechanism at an initial stage was suggested.