• 제목/요약/키워드: Silicon single crystal ingot

검색결과 22건 처리시간 0.025초

TRIZ(6SC)를 활용한 잉곳 인상모듈 및 실리콘 단결정 잉곳 제조장치의 창의적 설계 (A Study on the Creative Design of Pulling Module for Silicon Ingot and an Apparatus of Manufacturing Silicon Single Crystal Ingot by using TRIZ(6SC))

  • 홍성도;허용정
    • 반도체디스플레이기술학회지
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    • 제11권2호
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    • pp.39-43
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    • 2012
  • This paper presents a study on the design of a pulling module for silicon ingot and an apparatus of manufacturing silicon single crystal ingot using the same method. The pulling module is conceptually designed by using TRIZ. Czochralski method(CZ) is representative way to manufacture single crystal ingot for wafers. The seed can be broken by high tension which is caused by large weight of a silicon ingot. The solution of this problem has been derived using 6SC(6 steps creativity)TRIZ. The pulling module is actuated by DC motor and rollers. High tension in the seed is removed by the rotate-elevate motion of rollers in the pulling module. A rubber belt is included in the rotate-elevate mechanism for increasing friction between rollers and silicon ingot.

단결정 실리콘 잉곳 결정성장 속도에 따른 고-액 경계면 형성 및 Defect 최적화 (Melt-Crystal Interface Shape Formation by Crystal Growth Rate and Defect Optimization in Single Crystal Silicon Ingot)

  • 전혜준;박주홍;블라디미르 아르테미예프;정재학
    • Current Photovoltaic Research
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    • 제8권1호
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    • pp.17-26
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    • 2020
  • It is clear that monocrystalline Silicon (Si) ingots are the key raw material for semiconductors devices. In the present industries markets, most of monocrystalline Silicon (Si) ingots are made by Czochralski Process due to their advantages with low production cost and the big crystal diameters in comparison with other manufacturing process such as Float-Zone technique. However, the disadvantage of Czochralski Process is the presence of impurities such as oxygen or carbon from the quartz and graphite crucible which later will resulted in defects and then lowering the efficiency of Si wafer. The heat transfer plays an important role in the formation of Si ingots. However, the heat transfer generates convection in Si molten state which induces the defects in Si crystal. In this study, a crystal growth simulation software was used to optimize the Si crystal growth process. The furnace and system design were modified. The results showed the melt-crystal interface shape can affect the Si crystal growth rate and defect points. In this study, the defect points and desired interface shape were controlled by specific crystal growth rate condition.

RADIAL UNIFORMITY OF NEUTRON IRRADIATION IN SILICON INGOTS FOR NEUTRON TRANSMUTATION DOPING AT HANARO

  • KIM MYONG-SEOP;LEE CHOONG-SUNG;OH SOO-YOUL;HWANG SUNG-YUL;JUN BYUNG-JIN
    • Nuclear Engineering and Technology
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    • 제38권1호
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    • pp.93-98
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    • 2006
  • The radial uniformity of neutron irradiation in silicon ingots for neutron transmutation doping (NTD) at HANARO is examined by both calculations and measurements. HANARO has two NTD holes named NTD1 and NTD2. We have been using the NTD2 hole for 5 in. NTD commercial service, and we intend to use two holes for 6 in. NTD. The objective of this study is to predict the radial uniformity of 6 in. NTD at the two holes. The radial neutron flux distributions inside single crystal and noncrystal silicon loaded at the NTD2 hole are calculated by the VENTURE code. For NTD1, the radial distributions of the reaction rate for a 6 in. NTD with a neutron screen are calculated by MCNP, and measured by gold wire activation. The results of the measurements are compared with those of the calculations. From the VENTURE calculation, it is confirmed that the neutron flux distribution in the single crystal silicon is much flatter than that in the non-crystal silicon. The non-uniformities of the measurements for radial neutron irradiation are slightly larger than those of the calculations. However, excluding local dips in the measurements, the overall trends of the distributions are similar. The radial resistivity gradient (RRG) for a 5 in. silicon ingot is estimated to be about $1.5\%$. For a 6 in. ingot, the RRG of a silicon ingot irradiated at HANARO is predicted to be about $2.1\%$. Also, from the experimental results, we expect that the RRG would not be larger than $4.4\%$.

태양전지용 규소 결정 성장 기술 개발의 현황 (The current status in the silicon crystal growth technology for solar cells)

  • 이아영;이동규;김영관
    • 한국결정성장학회지
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    • 제24권2호
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    • pp.47-53
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    • 2014
  • 태양전지용 규소에는 단결정, 다결정, mono-like의 세 가지 재료가 사용 중에 있다. 첫 번째로, 단결정은 수율향상의 과제에 집중되고 있으며, 이것은 고액 계면의 형상이 주요 요인으로 알려지고 있다. 이에 대한 연구가 전산모사 등으로 집중되고 있다. 또한 결정과 도가니의 회전 속도가 고액 계면의 형상에 영향을 미치는 것이 확인 되었다. 다결정의 경우에는 결정립계의 역할이 매우 중요하므로 이에 대한 연구가 진행되는데, 이들을 특히 전기적으로 비활성적인 쌍정 입계로 전환하는 연구가 진행되고 있다. 성장 조건을 변경시켜 쌍정 입계로 바꾸어서 재료의 전기적 성질을 향상시키는 결과를 확인하였다. 또한 성장 공정에서 발생될 수 있는 오염을 줄이기 위한 노력은 상부의 Ar 가스의 흐름을 상향 조절하여 불순물의 용입을 줄임이 확인되었다. 다음으로 mono-like인 경우에는 측면으로부터 성장 되어 들어오는 다결정이 단결정의 분율을 저하 시키는 주요 요인이 되고 있다. 이에 대한 해결책으로 하부의 냉각 속도를 높이고 상부와 측면에 단열재를 보강하는 방안이 제시되고 있고, 하부에 놓는 seed의 orientation을 조절하여 측면으로부터 성장 되어 들어오는 다결정을 억제하는 방안이 효과가 있음이 확인 되고 있다.

Quality evaluation of diamond wire-sawn gallium-doped silicon wafers

  • Lee, Kyoung Hee
    • 한국결정성장학회지
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    • 제23권3호
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    • pp.119-123
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    • 2013
  • Most of the world's solar cells in photovoltaic industry are currently fabricated using crystalline silicon. Czochralski-grown silicon crystals are more expensive than multicrystalline silicon crystals. The future of solar-grade Czochralski-grown silicon crystals crucially depends on whether it is usable for the mass-production of high-efficiency solar cells or not. It is generally believed that the main obstacle for making solar-grade Czochralski-grown silicon crystals a perfect high-efficiency solar cell material is presently light-induced degradation problem. In this work, the substitution of boron with gallium in p-type silicon single crystal is studied as an alternative to reduce the extent of lifetime degradation. The diamond-wire sawing technology is employed to slice the silicon ingot. In this paper, the quality of the diamond wire-sawn gallium-doped silicon wafers is studied from the chemical, electrical and structural points of view. It is found that the characteristic of gallium-doped silicon wafers including texturing behavior and surface metallic impurities are same as that of conventional boron-doped Czochralski crystals.

Pulling rate, rotation speed 및 melt charge level 최적화에 의한 쵸크랄스키 공정 실리콘 단결정의 O2 불순물 최소화 설계 (A Czochralski Process Design for Si-single Crystal O2 Impurity Minimization with Pulling Rate, Rotation Speed and Melt Charge Level Optimization)

  • 전혜준;박주홍;블라디미르 아르테미예프;황선희;송수진;김나영;정재학
    • Korean Chemical Engineering Research
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    • 제58권3호
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    • pp.369-380
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    • 2020
  • 대부분의 단결정 실리콘 잉곳은 초크랄스키(Czochralski(Cz)) 공정으로 제조된다. 그러나 단결정 실리콘 잉곳을 제품화 및 태양 전지 기판으로 가공하였을 때 산소 불순물이 있는 경우 낮은 효율성을 나타내는 경향이 있다. 단결정 Si-잉곳의 생산을 위해서는 용융 Si를 녹인 다음 단결정 Si의 시드(Seed)로 결정화하는 초크랄스키(Cz) 공정을 도입한다. 용융된 다결정 Si-덩어리를 단결정 Si-잉곳으로 결정성장 될 때, 열 전달은 Cz-공정의 구조에서 중요한 역할을 한다. 본 연구에서 고품질 단결정 실리콘 잉곳을 얻기 위해 Cz-공정의 최적화된 설계를 구성하였다. 결정 성장 시뮬레이션로부터 결정성장을 위한 Pulling rate 및 Rotation speed에 최적의 변수값을 형성하기 위해 사용되었으며, 변형된 Cz-공정에 대한 연구 및 해당 결과가 논의되며 결정 성장 시뮬레이션을 사용하여 Cz-공정의 Pulling rate, Rotation speed 및 Melt charge level의 최적화된 설계로 인한 결정성장시 단결정 실리콘으로 유입되는 산소 농도 최소화를 설계하였다.

실리콘 단결정 성장 기술개발 동향 (Technical Trend of Silicon Single Crystal Growth)

  • 조한식
    • 한국결정성장학회지
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    • 제1권1호
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    • pp.117-126
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    • 1991
  • 실리콘 단결정은 반도체 소자 제조에 널리 쓰이는 중요한 재료로서 이 결정 성장 기술은 결정의 고품질화, 대구경화를 이룩하기 위하여 꾸준히 발전되어 왔다. 본 보는 생산성의 경제적인 효율 측면에서 각종 결정 인상 기술이 장, 단점을 간략히 소개하고, 이 기술 및 공정의 장래에 대하여 기술하였다.

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무결정결함영역을 유지하면서 에너지를 절감하는 초크랄스키 실리콘 단결정 성장로 수냉관 최적 설계 (Optimal Water-cooling Tube Design for both Defect Free Process Operation and Energy Minimization in Czochralski Process)

  • 채강호;조나영;조민제;정현준;정재학;성수환;육영진
    • Current Photovoltaic Research
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    • 제6권2호
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    • pp.49-55
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    • 2018
  • Recently solar cell industry needs the optimal design of Czochralski process for low cost high quality silicon mono crystalline ingot. Because market needs both high efficient solar cell and similar cost with multi-crystalline Si ingot. For cost reduction in Czochralski process, first of all energy reduction should be completed because Czochralski process is high energy consumption process. For this purpose we studied optimal water-cooling tube design and simultaneously we also check the quality of ingot with Von mises stress and V(pull speed of ingot)/G(temperature gradient to the crystallization) values. At this research we used $CG-Sim^{(R)}$ S/W package and finally we got improved water-cooling tube design than normally used process in present industry. The optimal water-cooling tube length should be 200mm. The result will be adopted at real industry.

DESIGN OF A NEUTRON SCREEN FOR 6-INCH NEUTRON TRANSMUTATION DOPING IN HANARO

  • Kim, Hak-Sung;Oh, Soo-Youl;Jun, Byung-Jin;Kim, Myong-Seop;Seo, Chul-Gyo;Kim, Heon-Il
    • Nuclear Engineering and Technology
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    • 제38권7호
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    • pp.675-680
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    • 2006
  • The neutron transmutation doping of silicon (NTD), as a method to produce a high quality semiconductor, utilizes the transmutation of a silicon element into phosphorus by neutron absorption in a silicon single crystal. In this paper, we present the design of a neutron screen for a 6' Si ingot irradiation in the NTD2 hole of HANARO. The goal of the design is to achieve an even flat axial distribution of the resistivity, or $Si^{30}(n,{\gamma})Si^{31}$ reaction rate, in the irradiated Si ingot. We used the MCNP4C code to simulate the neutron screen and to calculate the reaction rate distribution in the Si ingot. The fluctuations in the axial distribution were estimated to be within ${\pm}2.0%$ from the average for the final neutron screen design; thus, they satisfy the customers' requirement for uniform irradiation. On the other hand, we determined the optimal insertion depths of the Si ingots by varying the critical control rod position, which greatly affects the axial flux distribution.

Study on Recycling of Scraps from Process of Silicon-single-crystal for Semiconductor

  • Lee, Sang-Hoon;Lee, Kwan-Hee;Hiroshi Okamoto
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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    • pp.705-710
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    • 2001
  • So for the quartz-glassy crucible wastes which was used for pulling up silicon-single-crystal ingot have simply reused for refractory raw-materials, or exhausted. This study is concerned on the advanced recycling-technology that is obtained by the proper micro-particle preparation process in order to fabricate fine amorphous silica filler for EMC (Epoxy Molding Compound). Therefore, this paper will deal with the physical, chemical and thermal pre-treatment process for efficient impurity removal and with the proper micro-particle process for producing the amorphous silicafiller. In view of the results, if the chemical, physical and thermal pre-treatment process for efficient elimination of impurity was passed, the purity of wasted fused glassy crucible is almost equal to the its of first anhydrous quartz glass. Thus, it was understood that this wasted fused glassy crucible was sufficient value of recycling, though it was damaged. When the ingot was fabricated, Phase transformation of crystallization by heat treatment (heat hysteresis phenomenon) was not changed. So, it was understood that as fused silica in the amorphous state, as It is, recycling possibility was very high

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