• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• 반도체디스플레이기술학회지
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• 제17권4호
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• pp.46-50
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• 2018

The purpose of this study is to analyze effects of filtering system of cutting fluid which is used for machining silicon electrode. For the research, different sizes of filter clothes are applied to check grain size of sludge of cutting fluid. Surface roughness of machined workpiece, depth of damage inside of silicon electrode, and suspended solids of cutting fluid are experimented and analyzed. From these experiments, it is verified that filtering system of cutting fluid is very important factor for machining. Results of this study can affect various benefits to the semiconductor industry for better productivity and better atmospheric pollution in workplace.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.1058-1062
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• 1997

Development of laser induced chemical etching technologt with KrF laser are carried out in this study for micromachining of silicon wafer. The paper is devoted to experimental identification of excimer laser induced mechanism of silicon under chlorine pressures(0.02~500torr). Experimental results on pulsed KrF excimer laser etching of silicon in chorine atmosphere are presented. Etching rate dependency on laser fluence and chlorine pressure are discussed on the basis of experimental analysis, it is concluded that accurate digital micro machining process of silicon wafer can achieved by KrF laser induced chemical etching technology.

• 한국정밀공학회지
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• 제27권2호
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• pp.7-12
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• 2010

Due to the extremely short interaction time (< $10\times10^{-12}$sec) between laser pulse and material, which enables the minimization of heat affection, ultrafast laser micro-machining has rapidly widened its applications. In this paper, the characteristics of ultrafast laser micro-machining have been reviewed and experimentally demonstrated in laser drilling of silicon wafer and in laser cutting of rigid PCB.

• 한국정밀공학회지
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• 제33권1호
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• pp.11-16
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• 2016

Lithography techniques are generally used to manufacture nano-patterns on silicon, however, it is difficult to make a V-shaped pattern using these techniques. Although silicon is a brittle material, it can be treated as a ductile material if mechanically machined at extremely low force scale. The manufacturing technique of nano-patterns on single crystal silicon using a mechanical method was developed in this study. First, the linear pattern was machined on the silicon with increasing thrust force. Then, the correlation between measured cutting force and machined pattern was analyzed. Based on the analysis, the critical thrust force was quantitatively determined, and then the silicon was machined at a force lower than the critical thrust force. The machined pattern was observed using SEM and AFM to check for the occurrence of brittle fractures. Finally, the sharp V-shaped nano-pattern was manufactured on the single crystal silicon.

• 대한기계학회논문집A
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• 제31권10호
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• pp.1039-1045
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• 2007

Ultrasonic machining (USM) is suitable for machining hard, brittle and non-conductive materials such as silicon, glass and ceramics. Usually, when micro holes are machined on glass by USM, roundness of hole entrance is poor and cracks appear around the hole exit. In this paper the machining characteristics were studied for roundness improvement and exit crack prevention. From experiments, the tool bending and the shape of tool tip affect hole roundness. When the tool tip is hemispherical, good roundness of holes was obtained. The feedrate and the rotational speed of the tool affect the exit crack. With the machining conditions of 150 rpm in spindle speed and $0.5\;{\mu}m/s$ in feedrate, micro holes with less than $100\;{\mu}m$ in diameter were machined without an exit crack.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.739-742
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• 2000

Micro machining technology has been studied to fabricate small size and high accuracy milli-structure products. To perfectly overcome the conventional mechanical machining methods, the chemical mechanical micro machining(C3M) process was developed. The mechanism of C3M process is that chemical solution etches the material and results in the generation of the chemical reacted layer, and the mechanical micro tool subsequently removes the layer. From the fundamental experiments, the C3M process has been founded to have the advantages of lower machining resistance, tool wear, and higher surface quality and form accuracy than conventional methods. This study focuses on the micro grooving of both the metallic material(SKDII, A1) and hard brittle silicon oxide.

• 한국공작기계학회논문집
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• 제15권4호
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• pp.15-21
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• 2006

Recently, atomic force microscope(AFM) with suitable tips is being used for nano fabrication/nanometric machining purposes. In this paper, acoustic emission(AE) was introduced to monitor the nanometric machining of brittle materials(silicon) using AFM. In the experiments, AE responses were sampled, as the tip load was linearly increased(ramped load), to investigate the machining characteristics during a continuous movement. By analyzing the experimental results, it can be concluded that measured AE energy is sensitive to changes in the mechanism of material removal including the ductile-brittle transition during the nanometric machining. The critical depth of cut value for the transition is evaluated and discussed.

• 한국정밀공학회지
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• 제21권3호
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• pp.163-170
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• 2004

Atomic force microscope (AFM) techniques are increasingly used fur tribological studies of engineering surfaces at scales ranging from atomic and molecular to micro-scale. Recently, AFM with suitable tips is being used for nano fabrication/nano machining purposes. In this paper, machining characteristics of silicon were investigated by nano indentation and nano scratch. Nano-scale material removal mechanisms are studied and the Taguchi method was introduced to acquire optimum parameters for nano machining. Also, Acoustic Emission (AR) is used for the monitoring of nano machining.

• 한국정밀공학회지
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• 제26권9호
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• pp.58-63
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• 2009

Silicon carbide (SiC) has been used for many engineering applications because of their high strength at high temperatures and high resistances to chemical degradation. SiC is very useful especially for a glass lens mold whose components demanded to the machining with good surface finish and low surface damage. The performance and reliability of optical components are strongly influenced by the surface damage of SiC during grinding process. Therefore, the severe process condition optimization shall be necessary for the highly qualified SiC glass lens mold. Usually the major form of damage in grinding of SiC is a crack occurs at surface and subsurface. The energy introduced in the layers close to the surface leads to the formation of these cracks. The experimental studies have been carried out to get optimum conditions for grinding of silicon carbide. To get the required qualified surface finish in grinding of SiC, the selection of type of the wheel is also important. Grinding processes of sintered SiC work-pieces is carried out with varying wheel type, depth of cut and feed using diamond wheel. The machining result of the surface roughness and the number of flaws, have been analyzed by use of surface profilers and SEM.