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Study on Ductile Machining Technology for Manufacturing Nano-Patterns on Single Crystal Silicon through Quantitative Analysis of Thrust Force

배분력의 정량적인 분석을 통한 단결정실리콘의 나노패턴 연성가공법 연구

  • Choi, Dae-Hee (Department of Nano Mechatronics, University of Science and Technology) ;
  • Jeon, Eun-chae (Department of Nano Mechatronics, University of Science and Technology) ;
  • Yoon, Min-Ah (Department of Nano Mechatronics, University of Science and Technology) ;
  • Kim, Kwang-Seop (Department of Nano Mechatronics, University of Science and Technology) ;
  • Je, Tae-Jin (Department of Nano Mechatronics, University of Science and Technology) ;
  • Jeong, Jun-Ho (Department of Nano Mechatronics, University of Science and Technology)
  • 최대희 (과학기술연합대학원대학교 나노메카트로닉스 전공) ;
  • 전은채 (과학기술연합대학원대학교 나노메카트로닉스 전공) ;
  • 윤민아 (과학기술연합대학원대학교 나노메카트로닉스 전공) ;
  • 김광섭 (과학기술연합대학원대학교 나노메카트로닉스 전공) ;
  • 제태진 (과학기술연합대학원대학교 나노메카트로닉스 전공) ;
  • 정준호 (과학기술연합대학원대학교 나노메카트로닉스 전공)
  • Received : 2015.06.29
  • Accepted : 2015.10.01
  • Published : 2016.01.01

Abstract

Lithography techniques are generally used to manufacture nano-patterns on silicon, however, it is difficult to make a V-shaped pattern using these techniques. Although silicon is a brittle material, it can be treated as a ductile material if mechanically machined at extremely low force scale. The manufacturing technique of nano-patterns on single crystal silicon using a mechanical method was developed in this study. First, the linear pattern was machined on the silicon with increasing thrust force. Then, the correlation between measured cutting force and machined pattern was analyzed. Based on the analysis, the critical thrust force was quantitatively determined, and then the silicon was machined at a force lower than the critical thrust force. The machined pattern was observed using SEM and AFM to check for the occurrence of brittle fractures. Finally, the sharp V-shaped nano-pattern was manufactured on the single crystal silicon.

Keywords

References

  1. Zhang, W. and Chou, S. Y., "Fabrication of 60-nm Transistors on 4-in. Wafer Using Nanoimprint at All Lithography Levels," Applied Physics Letters, Vol. 83, No. 8, pp. 1632-1634, 2003. https://doi.org/10.1063/1.1600505
  2. Bogaerts, W., Wiaux, V., Taillaert, D., Beckx, S., Luyssaert, B., et al., "Fabrication of Photonic Crystals in Silicon-on-Insulator Using 248-nm Deep UV Lithography," IEEE Journal of Selected Topics in Quantum Electronics, Vol. 8, No. 4, pp. 928-934, 2002. https://doi.org/10.1109/JSTQE.2002.800845
  3. Revzin, A., Russel, R. J., Yadavalli, V. K., Koh, W. G., Deister, C., et al., "Fabrication of Poly(ethylene glycol) Hydrogel Microstructures Using Photolithography," Langmuir, Vol. 17, pp. 5440-5447, 2001. https://doi.org/10.1021/la010075w
  4. Choi, Y. K., Zhu, J., Grunes, J., Bokor, J., and Somorjai, G. A., "Fabrication of Sub-10-nm Silicon Nanowire Arrays by Size Reduction Lithography," The Journal of Physical Chemistry, Vol. 107, pp. 3340-3343, 2003. https://doi.org/10.1021/jp0222649
  5. Ahn, S. W., Lee, K. D., Kim, J. S., Kim, S. H., Park, J. D., et al., "Fabrication of a 50nm Half-Pitch Wire Grid Polarizer Using Nanoimprint Lithography," Nanotechnology, Vol. 16, No. 9, pp. 1874-1877, 2005. https://doi.org/10.1088/0957-4484/16/9/076
  6. Hung, N. P. and Fu, Y. Q., "Effect of Crystalline Orientation in the Ductile-Regime Machining of Silicon," The International Journal of Advanced Manufacturing Technology, Vol. 16, No. 12, pp. 871-876, 2000. https://doi.org/10.1007/s001700070004
  7. Leung, T. P., Lee, W. B., and Lu, X. M., "Diamond Turning of Silicon Substrates in Ductile-Regime," Journal of Materials Processing Technology, Vol. 73, No. 1, pp. 42-48, 1998. https://doi.org/10.1016/S0924-0136(97)00210-0
  8. Tanaka, H., Shimada, S., and Anthony, L., "Requirements for Ductile-Mode Machining Based on Deformation Analysis of Mono-Crystalline Silicon by Molecular Dynamics Simulation," CIRP Annals-Manufacturing Technology, Vol. 56, No. 1, pp. 53-56, 2007. https://doi.org/10.1016/j.cirp.2007.05.015
  9. Fang, F. Z. and Venkatesh, V. C., "Diamond Cutting of Silicon with Nanometric Finish," CIRP Annals-Manufacturing Technology, Vol. 47, No. 1, pp. 45-49, 1998. https://doi.org/10.1016/S0007-8506(07)62782-6
  10. Cheng, J. and Gong, Y. D., "Experimental Study of Surface Generation and Force Modeling in Micro-Grinding of Single Crystal Silicon Considering Crystallographic Effects," International Journal of Machine Tools and Manufacture, Vol. 77, pp. 1-15, 2014. https://doi.org/10.1016/j.ijmachtools.2013.10.003
  11. Liu, K., Li, X. P., Rahman, M., Neo, K. S., and Liu, X. D., "A Study of the Effect of Tool Cutting Edge Radius on Ductile Cutting of Silicon Wafers," The International Journal of Advanced Manufacturing Technology, Vol. 32, No. 7-8, pp. 631-637, 2006. https://doi.org/10.1007/s00170-005-0364-7
  12. Chao, C. L., Ma, K. J., Liu, D. S., Bai, C. Y., and Shy, T. L., "Ductile Behaviour in Single-Point Diamond-Turning of Single-Crystal Silicon," Journal of Materials Processing Technology, Vol. 127, No. 2, pp. 187-190, 2002. https://doi.org/10.1016/S0924-0136(02)00124-3
  13. Schroeder, P. T., "Widening Interest in Twist Drills," Modern Mechanical Shop, Vol. 71, No. 4, pp. 106-113, 1998.
  14. Zhang, S. J., To, S., and Zhu, Z. W., "A Review of Surface Roughness Generation in Ultra-Precision Machining," International Journal of Machine Tools and Manufacture, Vol. 91, pp. 76-95, 2015. https://doi.org/10.1016/j.ijmachtools.2015.02.001