Research on Ultra-precision Grinding Work of Silicon Carbide

실리콘 카바이드의 초정밀 연삭 가공에 관한 연구

  • Park, Soon-Sub (Honam Technology Division, Korea Institute of Industrial Technology) ;
  • Won, Jong-Ho (Department of Mechanical Engineering, Chungnam National University)
  • 박순섭 (한국생산기술연구원 호남권기술지원본부) ;
  • 원종호 (충남대학교 기계공학과)
  • Published : 2009.09.01

Abstract

Silicon carbide (SiC) has been used for many engineering applications because of their high strength at high temperatures and high resistances to chemical degradation. SiC is very useful especially for a glass lens mold whose components demanded to the machining with good surface finish and low surface damage. The performance and reliability of optical components are strongly influenced by the surface damage of SiC during grinding process. Therefore, the severe process condition optimization shall be necessary for the highly qualified SiC glass lens mold. Usually the major form of damage in grinding of SiC is a crack occurs at surface and subsurface. The energy introduced in the layers close to the surface leads to the formation of these cracks. The experimental studies have been carried out to get optimum conditions for grinding of silicon carbide. To get the required qualified surface finish in grinding of SiC, the selection of type of the wheel is also important. Grinding processes of sintered SiC work-pieces is carried out with varying wheel type, depth of cut and feed using diamond wheel. The machining result of the surface roughness and the number of flaws, have been analyzed by use of surface profilers and SEM.

Keywords

References

  1. CVD Silicon Carbide. At: http://www.cvdmaterials.com/
  2. Padture,N.P.,Evans,C.J.,Xu,H.K.andLawn,B.R., 'LowDamageEnhancedMachinability of SiliconCarbide via Microstructural Design,' J. Am. Ceram.Soc., Vol. 78, No. 1, pp. 215-217, 1995 https://doi.org/10.1111/j.1151-2916.1995.tb08386.x
  3. Xu, H. K., Padture, N. P. and Jahanmir, S., 'Effect ofMicrostructure on Material-RemovalMechanismsandDamageToleranceinAbrasivMachiningofSiliconCarbidem. Ceram. Soc., Vol. 78, No. 9,pp. 2443-2448, 1995 https://doi.org/10.1111/j.1151-2916.1995.tb08683.x
  4. Lawn,B.R.,Padture,N.P.,Cai,HandGuiberteau,F., 'MakingCeramics 'Ductile',' Science, Vol. 263,No. 5150, pp. 1114-1116, 1994 https://doi.org/10.1126/science.263.5150.1114
  5. Padture, N. P. and Lawn, B. R., 'Contact Fatigue of a Silicon Carbide with a Heterogeneous Grain Structure,' J. Am. Ceram. Soc., Vol. 78, No. 6, pp.1431-1438, 1995 https://doi.org/10.1111/j.1151-2916.1995.tb08834.x
  6. Suziki, H., Kodera, S., Nakasuji, T., Ohta, T. andSyoji, K., ''Precision Grinding of Aspherical CVDSiCMolding Die,'' JSPE, Vol. 32, No. 1, pp. 25-30,1998