• 한국기계가공학회지
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• 제15권1호
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• pp.26-33
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• 2016

In this study, a new method to develop a fixed diamond wire for silicon wafer machining by the multi-wire cutting method was developed. The new twist diamond wire has improved performance with high breaking strength and chip flutes structure. According to these characteristics, the new twist diamond wire can be used in the higher speed multi-wire cutting process with a long lifetime. Except the design of the new structure, the twist diamond wire is coating by electroless-electroplating process. It is good for reducing breakage and the falling-off of diamond grains. Based on the silicon material removal mechanism and performance of the wire-cutting machine, the optimal processing condition of the new twist diamond wire has been derived via mathematical analysis. At last, through the tensile testing and the machining experiments, the performance of the twist diamond wire has been obtained to achieve the development goals and exceed the single diamond wire.

• 한국기계가공학회지
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• 제12권2호
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• pp.75-80
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• 2013

Cathode is an essential component used in plasma etching process which is to make micro pattern on the silicon wafer. The currently used cathodes produce particles at the high temperature plasma etching process. To overcome this problem, a 'Silicon Only Cathode' was developed. This 'Silicon Only Cathode' requires manufacturing process changes due to the change of shapes, material features, and machining characteristics of work materials. This research investigates the small hole drilling process. The conclusion is that PCD drills with twist angles of $20^{\circ}$ and $25^{\circ}$ were tested for small hole drilling and the experimental results indicate that the drill with $25^{\circ}$ twist angle drill causes less thrust force.

• 한국정밀공학회지
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• 제26권5호
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• pp.48-56
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• 2009

In this paper, laser-assisted machining(LAM) has been employed to machine hot isostatically pressed (HIPed) Si3N4 work pieces. Due to little residual flaws and porosity, HIPed $Si_3N_4$ work pieces are more difficult to machine compared to normally sintered $Si_3N_4$ workpieces. In LAM, the intense energy of laser was used to enhance machinability by locally heating the workpiece and thus reducing yield strength. In experiments, the laser power ranges from 200W to 800W and the diameter of work pieces is 16mm. While machining, the surface temperature was kept nearly constant by laser heating except for a short period of rise time of max. 58 seconds. Results showed as feed rate increases the surface temperature of $Si_3N_4$ workpieces decreases slightly, whereas the effect of depth of cut is disregardable. With a laser power of 800W, achievable maximal depth of cut as 0.7mm and feed rate was 0.03mm/rev.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.127-127
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• 2004

입자분사 가공(abrasive jet machining)은 과거에는 녹(rust) 도색(painting)의 제거 흑은 디버링(deburring), 표면 처리 등의 용도에 국한되어 사용되어졌다. 한편 최근 들어 반도체 제작공정이나 MEMS 공정 등에 적용되는 실리콘(silicon) 등의 세라믹 재료의 미세가공분야가 주목받고 있으며, 따라서 이와 관련된 많은 연구가 진행되고 있다. 한편, 세라믹 재료는 파괴인성이 매우 낮고 취성이 강하기 때문에 크랙발생 후 큰 응력이 연속적으로 주어지면 크랙은 음속으로 진행되어 파단 되는 특성이 있어서 일반적인 기계가공이 매우 어렵다.(중략)

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.861-862
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• 2006

The suitable tools for CGI material has not been developed yet because of high hardness, high toughness and very low machininability compared to the grey cast iron. And the tool life has been decreased as the contents of Ti in CGI material. From this research, we were able to do the high speed machining by using high toughness silicon nitride ceramic tools. The silicon nitride ceramic tool grade was specially designed and prepared with microstructure of elongated grains with higher aspect ratio (c/a) than conventional one.

• Journal of Advanced Marine Engineering and Technology
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• 제34권7호
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• pp.963-970
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• 2010

This study makes an estimate of the laser-assisted machining (LAM) of an economically viable process for manufacturing precision silicon nitride ceramic parts using a high-power diode laser (HPDL). The surface is locally heated by an intense laser source prior to material removal, and the resulting softening and damage of the workpiece surface simplify the machining of the ceramics. The most important advantage of LAM is its ability to produce much better workpiece surface quality compared to conventional machining. Also important are its larger material removal rates and longer tool life. The cutting force and surface temperature were measured on-line using a pyrometer and a dynamometer, respectively. Tool wear, chips and the surface of the workpiece were measured using optical microscopy, and the surface and fractured cross-section of $Si_3N_4$ were measured by SEM. During the LAM process, the cutting force and tool wear were reduced and oxidation of the machined surface was increased according to the increase in the laser power. Moreover, the more the feed rate increased, the more the cutting force and tool wear increased.

• 한국정밀공학회지
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• 제25권10호
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• pp.41-47
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• 2008

This study aims to obtain machining characteristics during AFM (Atomic force Microscope) machining of silicon wafers and to monitor the machining states using acoustic emission. As in micro scale machining, two distinct regimes of deformation, i. e. ploughing regime and cutting regime were observed. First, the transition between the two regimes are investigated by analyzing the "pile-up" during machining. As far as in process monitoring is concerned, in the ploughing repime, no chips have been formed and related AE RMS values are relatively low, In the mean time, in the cutting regime, the RMS values are significantly higher than the ploughing regime, with apparent chip formation. From the results, we found out that the proposed scheme can be used for the monitoring of nanomachining, especially for the characterization of nanocutting mode transition.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.934-937
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• 2001

It is well-known that the micro fabrication technology of micro parts are the high energy beam or silicon-based micro machining method such as LIGA Process, Laser machining, photolithography and etching technology. But, for fabricating complex 3-D structure it is better to use mechanical machining. This machining method by the mechanical machine tool with nanometer accuracy is getting attention in some field-especially micro optics machining such as grating, holographic lens, micro lens array, fresnel lens, encoder disk etc.. In this study, we survey the micro fabrication by mechanical cutting method and set up the mechanical micro machining system. And we carried out micro cutting experiments for micro parts with v-shape groove.

• Journal of Advanced Marine Engineering and Technology
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• 제33권7호
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• pp.1026-1033
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• 2009

Fine ceramics have high strength, excellent wear resistance, chemical stability and high strength at high temperature and are receiving attention in various fields such as construction, engineering, aerospace and marine science. Finish machining process is required to obtain precise ceramics components because sintering process necessary for obtaining high strength and high quality ceramics reduces the dimensions of components and precision of shape. But high strength and brittleness of ceramics materials cause difficulty in processing. So a process for obtaining wanted dimensions is studying using high temperature which makes ceramics softened and thermal affected recently. Laser beam is a very useful optical device for these kinds of processes. Laser process such as laser cutting, laser machining, laser heat treatment and laser-assisted machining(LAM) is researching to manufacture practical ceramics components using intense laser source which can cause local softening and damage of workpiece. In this paper, microstructural and mechanical properties of silicon nitride heated are studied as a basic study for researching of ceramics process by laser beam. The surface variation of HIP and SSN-silicon nitride was analyzed with SEM and EDS. A processing at $1,300^{\circ}C$ or above causes N element to combine into $N_2$ gas and the gas busts from surface. These phenomena make bloat, craters and heat defects on the surface of silicon nitride. Also, oxygen content is largely increased to oxidize the surface and it causes changing of phases and reducing of hardness of surface.

• 한국공작기계학회논문집
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• 제11권5호
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.