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A Study on the Characteristics of Silicon Micro-hole machining  

Chae, Seung-Su (Mechanical Design of Kumoh University)
Lee, Sang-Min (Mechanical Design of Kumoh University)
Park, Hwi-Keun (Mechanical Design of Kumoh University)
Cho, Jun-Hyun (Mechanical Design of Kumoh University)
Lee, Jong-Chan (Mechanical Design of Kumoh University)
Heo, Chan (Worldex)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.12, no.2, 2013 , pp. 75-80 More about this Journal
Abstract
Cathode is an essential component used in plasma etching process which is to make micro pattern on the silicon wafer. The currently used cathodes produce particles at the high temperature plasma etching process. To overcome this problem, a 'Silicon Only Cathode' was developed. This 'Silicon Only Cathode' requires manufacturing process changes due to the change of shapes, material features, and machining characteristics of work materials. This research investigates the small hole drilling process. The conclusion is that PCD drills with twist angles of $20^{\circ}$ and $25^{\circ}$ were tested for small hole drilling and the experimental results indicate that the drill with $25^{\circ}$ twist angle drill causes less thrust force.
Keywords
Point angle; Twist angle; Micro-hole machining; Thrust Force;
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  • Reference
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