• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.422-422
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• 2009

Photocurable inorganic-organic hybrid materials were prepared from colloidal-silica nanoparticles synthesized through the solgel process and using acryl resin. The synthesized colloidal-silica nanoparticles had uniform diameters of around 20 nm, and they were organically modified, using methyl and methacryl functional silanes, for efficient hybridization with acryl resin. The organically modified and stabilized colloidal-silica nanoparticles could be homogeneously hybridized with aeryl resin without phase separation. The successfully fabricated hybrid materials exhibit efficient photocurability and simple film formation due to the photopolymerization of the organically modified colloidal-silica nanoparticles and acryl resin upon UV exposure. The fabricated hybrid films exhibit an excellent optical transmission of above 90% in the visible region as well as an enhanced surface smoothness of around 1 nm RMS roughness. In addition, the hybrid films exhibit improved thermal and mechanical characteristics, much better than those of acryl resin. More importantly, these photocurable hybrid materials fabricated through the synergistic combination of colloidal-silica nanoparticles with acryl resin are candidates for optical and electrical applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.6
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• pp.472-476
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• 1998

The surface reactions of silica film($SiO_2-P_2O_5-B_2O_3-GeO_2$) with fluorocarbon plasma has been studied by using angle -resolved x-ray photoelectron spectroscopy(XPS). It has been confirmed that residual carbon consists of C-C and C-CFx bonds and fluorine mainly binds silicon in the case of etched silica by using $CF_4$ gas plasma. The surface reaction of silica with various fluorocarbon gases, such as $CF_4,C_2F_6 and CHF_3$ were investigated. XPS results showed that though the etching gases were changed, the elements and binding states of the residual layers on the etched silica by using various fluorocarbon gas plasma were nearly the same . This seems to be due to the high volatility of byproducts, that is, $SiF_4 and CO_2$ etc..

• Korean Chemical Engineering Research
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• v.55 no.6
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• pp.754-761
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• 2017

UV-curable hydrophilic coating solutions were prepared by mixing colloidal silica dispersed in alcohol with an acrylic monomer, pentaerythritol triacrylate (PETA). Hydrophilic coating films were also prepared by spin coating the hydrophilic coating solutions on PC substrates and UV curing for 10 minutes subsequently. The effect of the amount of colloidal silica in the coating solutions, which was varied from 10 g to 50 g, was investigated on the hydrophilic properties of UV-cured coating films. The results showed that the amount of colloidal silica had a great influence on the hydrophilic properties of UV-cured coating films and the coating film prepared with 30 g of colloidal silica showed a lowest contact angle of $37^{\circ}$ and an excellent pencil hardness of H.

• Journal of Sensor Science and Technology
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• v.15 no.3
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• pp.173-178
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• 2006

Silica aerogel with ultra low density and high porosity has been focused on versatile application due to its fascinating properties. Ambient drying process of waterglass, in this study was researched to fabricate a crack-free monolith body in the point view of cost effective way. Wet gel was obtained by removing of $Na^{+}$ ions in waterglass, which contains 8 wt% of $SiO_{2}$. Xylene, which has a low vapor pressure, was used as a solution substitutor to prevent the formation a cracks during drying. Various surface modifiers like as hexamethyldisilazane (HMDSZ), trimethylchlorosilane (TMCS), methyltriethoxylsilane (MTES), methyltrimethoxysilane (MTMS) and phenyltriethoxysilane (PTES) were used in order to improve hydrophobicity of the waterglass Silica aerogel. Some physical properties of the surface modified aerogels were investigated by FT-IR, TGA, BET and SEM. Hydrophobicity and hydrophilicity of Silica aerogel is attributed to the Si-OH bond and the non-polar C-H bond groups on the surface of aerogel. Crack-free waterglass aerogel with >90 % of porosity, 17 nm of pore size and <0.15 $g/cm^{3}$ of density was prepared. HMDSZ and TMCS are effective as a surface modifier

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.622-624
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• 2001

The CVD film of methoxysilane derived from diphenyldimethoxysilane(DPDMS) was formed on the outer surface of a porous ${\alpha}-alumina$ support tube coated(via dipping-drying-calcining) with a boehmite sol(0.3 mol-Al/L). The resulting silica membrane($500^{\circ}C,\;P_{fe}\;=\;130\;Pa$) showed a permeance of $5.18{\times}10^{-8}\;mol\;{\cdot}\;m^{-2}{\cdot}s^{-1}{\cdot}Pa^{-1}\;for\;CO_2$ and a permselectivity of 13.35 for $CO_2/N_2\;at\;30^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.3
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• pp.219-225
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• 2005

To investigate the effects of slurry temperature on the chemical mechanical polishing(CMP) performance of oxide film with silica and ceria slurries, we have studied slurry properties as a function of different slurry temperature. Also, the effects of each input parameter of slurry on the oxide CMP characteristics were investigated. The pH showed a slight tendency of decrease, the conductivity in slurries showed an increased tendency, the mean particle size in slurry decreased, and the zeta potential of slurry decreased with temperature. The removal rates significantly increased and maintained at the specific levels over 4$0^{\circ}C$. The better surface morphology of oxide films could be obtained at 40 $^{\circ}C$ of silica slurry and at 90 $^{\circ}C$ of ceria slurry. It is found that the CMP performance of oxide film could be significantly improved or controlled by change of slurry temperature.

• Journal of the Korean Applied Science and Technology
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• v.18 no.3
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• pp.233-240
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• 2001

The transparent organic-inorganic hybrid films were prepared by the Sol-Gel process. PVP(polyvinylpyrrolidone) was used in organic component and TEOS(tetraethoxysilane) was used in inorganic component. HCI, $CH_{3}COOH$, and $NH_{4}OH$ were used as the Sol-Gel catalyst. The characteristics according to not only the variation of organic and inorganic contents but also the variation of catalyst species and contents were investigated. On the whole, the compatibility was remained between organic and inorganic components, and also as the TEOS contents were increased, mostly the transparency and the mechanical, thermal properties were improved. In addition, as content of catalysts was increased, the films showed characteristics that were closer to PVP than silica. Although the transparency of films was preserved in HCI and $CH_{3}COOH$, only the film containing more than 40wt% TEOS in $NH_{4}OH$ showed different phenomena.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.9
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• pp.759-764
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• 2003

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of roused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity (WIWNU) wore measured as a function of different slurry composition. As an experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt％ contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows , In tile first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saying of high costs of slurry.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.428-432
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• 2012

Polyamidimide (PAI)-colloidal silica (CS) nanohybrid films were synthesized by an advanced sol-gel process. The synthesized PAI-CS hybrid films have a uniform and stable chemical bonding and there is no interfacial defects observed by TEM. The thermal degradation ratio of PAI-CS (10 wt%) hybrid films is delayed by 100 ℃ compared with pure PAI sample determined by on set temperature range in TGA. The dielectric constant of PAI-CS (10 wt%) hybrid films decreases with increasing CS content up to about 5 wt% but increases at higher CS content, which is not explained simply by effective medium therories (EMT). The duration time of PAI-CS (10 wt%) hybrid coil is 38 sec, which is very longer than that of pure PAI coil sample. The PAI-CS (10 wt%) hybrid film has a higher breakdown voltage resistance than the pure PAI film at surge environment and exhibits superior heat resistance. The PAI-CS (10 wt%) sample shows the advanced and stable thermal emission properties in transformer module compared with the pure PAI sample. This result illustrates that the advanced thermal conductivity and expansion properties of PAI-CS sample in the case of appropriate sol-gel processes brings the stable thermal emission in transformer system. Therefore, new PAI-CS hybrid samples with such stable thermal emission properties are expected to be used as a high functional coating application in ET, IT and electric power products.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.331-334
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• 2008

The replica of highly ordered nano-sphere array patterns were fabricated using hot embossing method. First, silica nano-sphere array on Si substrate was transferred to PVC film at $130^{\circ}C$ and 7 bar using hot embossing process. Then, silica nano-sphere array on PVC template was removed by soaking the PVC film in buffered oxide etcher. In order to form anti-stiction layer, the PVC template was coated with silicon dioxide layer and self-assembled monolayer. Through UV nanoimprint lithography with the fabricated flexible PVC template, highly ordered nano-sphere array pattern was imprinted on curved substrates with high fidelity.