References
- Woo-Sun Lee, Sang-Youg Kim, Youg- Jin Sea, and jong-Kook Lee, 'An optimization of tungsten plug chemical mechanical polishing (CMP) using different con sumabies', Journal of Materials Science : Materials in Electronics, Vol. 12, No. 1, p. 63, 2001
- Yong- Jin Seo and Sang-Yong Kim, 'Effects of various facility factors on chemical mechanical polishing process defects', Japanese Journal of Applied Physics, Vol. 41, No. 11A, p. 6310, 2002
- Yong- Jin Seo, Woo-Sun Lee, Sang-Yang Kim, Jin-Sung Park, and Eui-Goo Chang, 'Optimization of post-CMP cleaning process for elimination of CMP slurry induced metallic contaminations', Journal of Materials Science : Materials in Electronics, Vol. 12, No.7, p. 411, 2001
- Yong- Jin Seo, Woo-Sun Lee, Jin-Seong Park, and Sang-Yang Kim, 'Motor-current-based real-time end point detection of shallow-trench-isolation chemical mechanical polishing process using high-selectivity slurry', Japanese Journal of Applied Physics, Vol. 42, No. 10, p. 6396, 2003 https://doi.org/10.1143/JJAP.42.6396
-
이우선, 최권우, 김남훈, 박진성, 서용진, '가스센서 적용을 위한
$SnO_2$ 박막의 CMP 특성 연구', 전기전자재료학회논문지, 17권, 12호, p. 1296, 2004 -
이우선, 고필주, 김남훈, 서용진, '산화제 첨가에 따른
$WO_3$ 박막의 CMP 평탄화 특성', 전기전자재료학회논문지, 18권1호, p. 12, 2005 - 서용진, 정헌상, 김상용, 이우선, 이강현, 장의구, 'STI-CMP 공정에서 torn oxide 결함 해결에 관한 연구', 전기전자재료학회논문지, 14 권, 1호, p. 1, 2001
- 김상용, 서용진, 김태형, 이우선, 김창일, 장의구, 'Chemical mechanical polishing(CMP) 공정을 이용한 multilevel metal 구조의 광역평탄화에 관한 연구', 전기전자재료학회논문지, 11권, 12호, p. 1084, 1998
- 이우선, 최권우, 이영식, 최연옥, 오용택, 서용진 '텅스텐 슬러리를 사용한 Cu-CMP 특성에서 산화제 첨가의 영향', 전기전자재료학회논문지, 17권, 2호, p. 156, 2004
- I. Kim, K. Murella, and J. Schlueter, 'A detailed look at oxide CMP pad-to-pad consistency', Proceedings of the 2nd International CMP-MIC Conference, p. 335, 1997
- I. Ali and S. R. Roy, 'Pad conditioning in interlayer dielectric CMP', Solid State Technology, Vol. 40, Iss. 6, p. 185, 1997
- Yong-Jin Seo, Sang-Yang Kim, Yean-Ok Choi, Yong-Taek Oh, and Woo-Sun Lee, 'Effects of slurry filter size on the chemical mechanical polishing(CMP) defect density', Materials Letters, Vol. 58, Iss. 15, p. 2091, 2004
- G. B. Basim, J. J. Adler, U. Mahajan, R. K. Singh, and B. M. Moudgil, 'Effect of particle size of chemical mechanical poli shing slurries for enhanced polishing with minimal defects', J. Electrochem. Soc., Vol. 147, Iss. 9, p. 3523, 2000
- J. M. Steigerwald, S. P. Murarka, and R. J. Gutman, 'Chemical Mechanical Planarization of Microelectronic Materials', John Wiley & Sons, p. 40, 1997
-
Weidan Li, Dong Wook Shin, Minoru Tomozawa, and Shyam p. Murarka, 'The effect of the polishing pad treatments on the chemical-mechanical polishing of
$SiO_2$ films' ,Thin Solid Films, Vol. 270, Iss. 1-2, p. 601, 1995 https://doi.org/10.1016/0040-6090(95)06833-3 - H. J. Kim, H. Y. Kim, H. D. Jeong, E. S. Lee, and Y. J. Shin, 'Friction and thermal phenomena in chemical mechanical polishing', Journal of Materials Processing Technology, Vol. 130-131, p. 334, 2002
- I. J. Malik, T. Mallon, B. Withers, R. Emami, D. Mordo, and I. Goswami, 'CMP of FSG : Issue in process integration', Proceedings of the 2nd International CMP-MIC Conference, p, 209, 1997
-
Yong- Jin Seo and Woo-Sun Lee, 'Chemical mechanical polishing of
$Ba_{0.6}Sr_{0.4}TiO_3$ film prepared by sol - gel method' , Microelectronic Engineering, Vol. 75, Iss. 2, p. 149, 2004 - Sung-Woo Park, Chul-Bok Kim, SangYong Kim, and Yong-Jin Seo, 'Design of experimental optimization for ULSI CMP process applications' , Microelectronic Engineering' ,Vol. 66, Iss. 1-4, p. 488, 2003 https://doi.org/10.1016/S0167-9317(03)00016-9
- J. M. Steigerwald, S. P. Murarka, and R. J. Gutman, 'Chemical Mechanical Planarization of Microelectronic Materials', John Wiley & Sons, p, 150, 1997
- R. Jairath, M. Desai, M. Stell, R. Tolles, and D. Scherber-Brewer, 'Consumables for the chemical mechanical polishing (CMP) of dielectrics and conductors', Mat. Res. Soc. Symp, Proc., Vol. 337, p. 121, 1994
- H. Hodne and A. Saasen, 'The effect of the cement zeta potential and slurry conductivity on the consistency of oil-well cement slurries', Cement and Concrete Research, Vol. 30, Iss. 11, p. 1767, 2000
- G. W. Castellan, 'Physical Chemistry', Benjamin/Cummings Publishing, p. 783, 1983
- M. R. Oliver, 'Chemical-mechanical Planarization of Semiconductor Materials', Springer-Verlag, p. 239, 2004
- S. Vallar, D. Houivet, J. El Fallah, D. Kervadec, and J.-M. Haussonne, 'Oxide slurries stability and powders dispersion: optimization with zeta potential and rheological measurements', Journal of the European Ceramic Society, Vol. 19, Iss. 6-7, p. 1017, 1999