• Title/Summary/Keyword: Sidewall Angle

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Quantitative Evaluation Method for Etch Sidewall Profile of Through-Silicon Vias (TSVs)

  • Son, Seung-Nam;Hong, Sang Jeen
    • ETRI Journal
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    • v.36 no.4
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    • pp.617-624
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    • 2014
  • Through-silicon via (TSV) technology provides much of the benefits seen in advanced packaging, such as three-dimensional integrated circuits and 3D packaging, with shorter interconnection paths for homo- and heterogeneous device integration. In TSV, a destructive cross-sectional analysis of an image from a scanning electron microscope is the most frequently used method for quality control purposes. We propose a quantitative evaluation method for TSV etch profiles whereby we consider sidewall angle, curvature profile, undercut, and scallop. A weighted sum of the four evaluated parameters, nominally total score (TS), is suggested for the numerical evaluation of an individual TSV profile. Uniformity, defined by the ratio of the standard deviation and average of the parameters that comprise TS, is suggested for the evaluation of wafer-to-wafer variation in volume manufacturing.

A Study on Stamp Process Life Time in Thermal NIL (Thermal NIL 용 스탬프 공정 수명에 관한 연구)

  • Cho, Cheon-Soo;Lee, Moon-Jae;Oh, Ji-In;Lim, O-Kaung;Jeong, Myung-Yung
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.2
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    • pp.239-244
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    • 2011
  • Nano Imprint Lithography(NIL) is technique for copying a pattern from stamp with nano size pattern in order to replicated the materials. It is very important to demold in order to make NIL process effectively. Self Assembled Monolayers(SAM) coater is manufactured by means of decreasing surface energy with the stamp surface treatment to improve release characteristics. Manufactured device contains tilting and rotation option for increasing process life time by coating on the sidewall of the pattern in stamp. The stamp coated with optimized tilting angle $30^{\circ}$ and rotation speed of 10rpm has more imprinting cycles than the stamping coated without tilting and rotation. Effective SAM coating on the sidewall of the pattern in stamp will improve by 50% of process life time.

Near-field Optical Lithography for High-aspect-ratio Patterning by Using Electric Field Enhanced Postexposure Baking (전기장이 적용된 노광후굽기 공정에 의한 고종횡비 근접장 광 리소그래피)

  • Kim, Seok;Jang, Jin-Hee;Kim, Yong-Woo;Jung, Ho-Won;Hahn, Jae-Won
    • Korean Journal of Optics and Photonics
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    • v.21 no.6
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    • pp.241-246
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    • 2010
  • In this paper, we propose an electric field enhanced postexposure baking (EFE-PEB) method to obtain deep and high aspect ratio pattern profile in near-field recording. To describe the photoacid distribution under an external electric field during the PEB, we derived the governing equations based on Fick's second law of diffusion. From the results of the numerical calculations, it is found that the vertical movement of photoacid increases while the lateral movement is stationary as electric field varies from 0 to $8.0{\times}10^6\;V/m$. Also, it is proven that the profile of near-field recording is improved by using the EFE-PEB method with increased depth, higher aspect ratio and larger sidewall angle.

Impacts of Trapezoidal Fin of 20-nm Double-Gate FinFET on the Electrical Characteristics of Circuits

  • Ryu, Myunghwan;Kim, Youngmin
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.15 no.4
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    • pp.462-470
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    • 2015
  • In this study, we analyze the impacts of the trapezoidal fin shape of a double-gate FinFET on the electrical characteristics of circuits. The trapezoidal nature of a fin body is generated by varying the angle of the sidewall of the FinFET. A technology computer-aided-design (TCAD) simulation shows that the on-state current increases, and the capacitance becomes larger, as the bottom fin width increases. Several circuit performance metrics for both digital and analog circuits, such as the fan-out 4 (FO4) delay, ring oscillator (RO) frequency, and cut-off frequency, are evaluated with mixed-mode simulations using the 3D TCAD tool. The trapezoidal nature of the FinFET results in different effects on the driving current and gate capacitance. As a result, the propagation delay of an inverter decreases as the angle increases because of the higher on-current, and the FO4 speed and RO frequency increase as the angle increases but decrease for wider angles because of the higher impact on the capacitance rather than the driving strength. Finally, the simulation reveals that the trapezoidal angle range from $10^{\circ}$ to $20^{\circ}$ is a good tradeoff between larger on-current and higher capacitance for an optimum trapezoidal FinFET shape.

Coating Characteristics of Photo Resist in a Slit-Coater (Slit-Coater내의 Photo Resist의 코팅 특성)

  • 김장우;정진도;김성근
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.3
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    • pp.41-44
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    • 2004
  • The aim of this study is the confirmation of the coating uniformity affected by the surface tension and wall attachment angle in a slit-coater model. In this work, we use the commercial code (Fluent) to solve the two-phase flow formed with air and photo resist numerically. The results show that the surface tension is the most important factor to determine the coating efficiency in the view of coating uniformity, and the coating uniformity is 2% for our slit-coater model and conditions. To improve the coating uniformity, it is in need of minimization of the sidewall effect of slit-coater.

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A Study on Optical Condition and preprocessing for Input Image Improvement of Dented and Raised Characters of Tires (타이어 음,양각 문자의 입력영상 개선을 위한 전처리와 광학조건에 관한 연구)

  • 류한성;최중경;구본민;박무열;윤경섭
    • Proceedings of the IEEK Conference
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    • 2001.06d
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    • pp.93-96
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    • 2001
  • In this paper, we present a vision algorithm and method for input image improvement and preprocessing of dented and raised characters on the sidewall of tires. we define optical condition between reflect coefficient and reflectance by the physical vector calculate. On the contrary this work will recognize the engraved characters using the computer vision technique. Tire input images have all most same grey levels between the characters and backgrounds. The reflectance is little from a tire surface. therefore, it's very difficult segment the characters from the background. Moreover, one side of the character string is raised and the other is dented. So, the captured images are varied with the angle of camera and illumination. For optimum input images, the angle between camera and illumination was found out to be with in 90。 .In addition, We used complex filtering with low-pass and high-pass band filters to improve input images, for clear input images. Finally we define equation reflect coefficient and reflectance. By doing this, we obtained good images of tires for pattern recognition.

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Refilled mask structure for Minimizing Shadowing Effect on EUV Lithography

  • Ahn, Jin-Ho;Shin, Hyun-Duck;Jeong, Chang-Young
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.4
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    • pp.13-18
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    • 2010
  • Extreme ultraviolet (EUV) lithography using 13.5 nm wavelengths is expected to be adopted as a mass production technology for 32 nm half pitch and below. One of the new issues introduced by EUV lithography is the shadowing effect. Mask shadowing is a unique phenomenon caused by using mirror-based mask with an oblique incident angle of light. This results in a horizontal-vertical (H-V) biasing effect and ellipticity in the contact hole pattern. To minimize the shadowing effect, a refilled mask is an available option. The concept of refilled mask structure can be implemented by partial etching into the multilayer and then refilling the trench with an absorber material. The simulations were carried out to confirm the possibility of application of refilled mask in 32 nm line-and-space pattern under the condition of preproduction tool. The effect of sidewall angle in refilled mask is evaluated on image contrast and critical dimension (CD) on the wafer. We also simulated the effect of refilled absorber thickness on aerial image, H-V CD bias, and overlapping process window. Finally, we concluded that the refilled absorber thickness for minimizing shadowing effect should be thinner than etched depth.

F.E. Analysis of the Radial Tire Inflation Using the Hyperelastic Properties of Rubber Compounds Sampled from a Tire (타이어 고무배합물의 초탄성을 고려한 레이디얼 타이어의 팽창에 관한 유한요소해석)

  • 김용우;김종국
    • Transactions of the Korean Society of Automotive Engineers
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    • v.11 no.4
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    • pp.125-134
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    • 2003
  • In this study, Mooney-Rivlin 1st model and Mooney-Rivlin 3rd model are adopted as strain energy density functions of the rubber compounds of a radial tire. It is shown that the FE analysis using Mooney-Rivlin models for rubber compounds may provide good approximations by employing the appropriate strain range of experimental stress-strain data in a way to describe the stress-strain relationship accurately. Especially, Mooney-Rivlin 3rd model gives an accurate stress-strain relationship regardless of the fitting strain range used within the strain of 100%. The static nonlinear FE analysis of a tire inflation is performed by employing an axisymmetric model, which shows that the outside shapes of the tire before and after inflating the tire agree well with those of the real tire. Additionally, the deformations at crown center and turning point on sidewall, distribution of belt cord force, interlaminar shear strain are predicted in terms of variation of belt cord angle which is known as the most influential factor in inflation behavior of a tire.

Wind tunnel study on fluctuating internal pressure of open building induced by tangential flow

  • Chen, Sheng;Huang, Peng;Flay, Richard G.J.
    • Wind and Structures
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    • v.32 no.2
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    • pp.105-114
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    • 2021
  • This paper describes a wind tunnel test on a 1:25 scale model of TTU building with several adjustable openings in order to comprehensively study the characteristics of fluctuating internal pressures, especially the phenomenon of the increase in fluctuating internal pressures induced by tangential flow over building openings and the mechanism causing that. The effects of several factors, such as wind angle, turbulence intensity, opening location, opening size, opening shape and background porosity on the fluctuating internal pressures at oblique wind angles are also described. It has been found that there is a large increase in the fluctuating internal pressures at certain oblique wind angles (typically around 60° to 80°). These fluctuations are greater than those produced by the flow normal to the opening when the turbulence intensity is low. It is demonstrated that the internal pressure resonances induced by the external pressure fluctuations emanating from flapping shear layers on the sidewall downstream of the windward corner are responsible for the increase in the fluctuating internal pressures. Furthermore, the test results show that apart from the opening shape, all the other factors influence the fluctuating internal pressures and the internal pressure resonances at oblique wind angles to varying degrees.

Etching of Pt Thin Film for SAW Filter Fabrication (표면탄성파 필터 제작을 위한 Pt 박막 식각)

  • Choi, Yong-Hee;Song, Ho-Young;Park, Se-Geun;Lee, Taek-Joo;O, Beom-Hoan;Lee, Seung-Gol;Lee, El-Hang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.103-107
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    • 2003
  • The inductively coupled plasma(ICP) etching process was selected to fabricate RF Surface Acoustic Wave(SAW) filters and a Pt thin film was sputtered on a $LiTaO_3$ substrate applied to electrode materials to reduce the spurious response and improve the power durability. Steep sidewall pattern was achieved employing $C_4F_8/Ar/Cl_2$ gas chemistry. We investigated an etching mechanism and parameter dependence of the Pt thin film about $C_4F_8$ addition. Sidewall etch angle was about $80^{\circ}$ at the $C_4F_8$ 20% mixing ratio. Fabricated SAW filter is consists of some series and parallel arm SAW resonators which work as impedance elements and show capacitance characteristics at out of the passband. It can be modified for $800{\sim}900\;MHz$ RF filters. External matching circuits were unnecessary.

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