• Title/Summary/Keyword: SiN

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Characterization of Nanocomposite Ti-Si-N Films Prepared by a Hybrid Deposition System of A If and Sputtering Techniques (하이브리드 증착 시스템을 이용한 나노복합체 Ti-Si-N 박막의 특성 연구)

  • 윤순영;최성룡;이미혜;김광호
    • Journal of the Korean institute of surface engineering
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    • v.36 no.2
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    • pp.122-127
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    • 2003
  • Ti - Si - N hard films were deposited on SKD11 steel substrates by a hybrid deposition system, where TiN was deposited by AIP method while Si was incorporated by sputtering one. The microstructure of Ti-Si-N films was revealed to be a composite of TiN crystallites and amorphous Si3N4 by instrumental analyses. The highest hardness value of about 45 Gpa was obtained at the Si content of around 7.7 at.%. With increase of Si content, the size of TiN crystallites was reduced and their distribution was changed from aligned to randomly orientated states. Surface roughness of Ti-Si-N film also decreased with increase of Si content.

Microstructure and Mechanical Properties of Cr-Al-Si-N Coatings for Wear Resistant and Structural Applications (내마모 구조 코팅용 Cr-Al-Si-N 코팅막의 미세구조와 기계적 특성에 관한 연구)

  • Kang, Dong-Shik;Kim, Kwang-Ho
    • Korean Journal of Materials Research
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    • v.15 no.11
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    • pp.730-734
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    • 2005
  • Cr-Al-Si-N coatings were deposited on WC-Co substrates by a hybrid coating system of arc ion plating and DC magnet :on sputtering technique in $N_2/Ar$ mixture. The Cr-tll-Si-N coatings were synthesized with different Si contents. Their microstructure and mechanical properties were systematically investigated. The average size of crystallites largely decreases with the increase of Si content compared with Cr-Al-N. The microhardness of Cr-Al-Si-N coatings largely increases from 24 to 55 GPa. The enhanced hardness is believed to originate from the microstructural change by the fine composite microstructure of Cr-Al-N coatings with Si addition. The average friction coefficient of Cr-Al-Si-N coatings decreases from 0.84 to 0.45 with increasing Si content up to $16\;at.\%$.

Microstructure and Mechanical Properties of Mo-Si-N Coatings Deposited by a Hybrid Coating System (하이브리드 코팅시스템에 의해 제조된 Mo-Si-N 박막의 미세구조 및 기계적 특성연구)

  • Heo, Su-Jeong;Yun, Ji-Hwan;Kang, Myung-Chang;Kim, Kwang-Ho
    • Journal of the Korean institute of surface engineering
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    • v.39 no.3
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    • pp.110-114
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    • 2006
  • In this work, comparative studies on microstructure and mechanical properties between $Mo_2N$ and Mo-Si-N coatings were conducted. Ternary Mo-Si-N coatings were deposited on AISI D2 steel substrates by a hybrid method, where AIP technique was combined with a magnetron sputtering technique. Instrumental analyses of XRD, HRTEM, and XPS revealed that the Mo-Si-N coatings must be a composite consisting of fine $Mo_2N$ crystallites and amorphous $Si_3N_4$. The hardness value of Mo-Si-N coatings significantly increased from 22 GPa of $Mo_2N$ coatings to about 37 GPa with Si content of 10 at.% due to the refinement of $Mo_2N$ crystallites and the composite microstructure characteristics. The average friction coefficient of the Mo-Si-N coatings gradually decreased from 0.65 to 0.4 with increasing Si content up to 15 at.%. The effects of Si content on microstructure and mechanical properties of Mo-N coatings were systematically investigated.

Effect of Co Interlayer on the Interfacial Reliability of SiNx/Co/Cu Thin Film Structure for Advanced Cu Interconnects (미세 Cu 배선 적용을 위한 SiNx/Co/Cu 박막구조에서 Co층이 계면 신뢰성에 미치는 영향 분석)

  • Lee, Hyeonchul;Jeong, Minsu;Kim, Gahui;Son, Kirak;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.41-47
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    • 2020
  • The effect of Co interlayer on the interfacial reliability of SiNx/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiNx/Cu thin film structure was 0.90 J/㎡. This value of the SiNx/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiNx/Co/Cu structure was around 10 times higher than SiNx/Cu structure due to CoSi2 reaction layer formation at SiNx/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiNx/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiNx/Co interface. Therefore, it is required to control the CoO and Co3O4 formation during the environmental storage of the SiNx/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

Syntheses of SiC and $SiC-Si_3N_4$ Powder from Jecheon Quartz (제천규석으로부터 SiC 및 $SiC-Si_3N_4$계 분말 합성)

  • 이홍림;배철훈;문준화
    • Journal of the Korean Ceramic Society
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    • v.23 no.1
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    • pp.67-73
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    • 1986
  • SiC and $SiC-Si_3N_4$ powder were synthesized via the carbiding and carbiding-nitriding reaction of Jecheon quartz respectively using graphite as a reducing agent. $\beta$-SiC+($\alpha$+$\beta$)-$Si_3N_4$ composite was obtained by the carbiding-nitriding reaction of Jecheon quartz-graphite mixture at 1, 35$0^{\circ}C$ in $H_2$ atmosphere. $\beta$-SiC+($\alpha$+$\beta$)-$Si_3N_4$ composite was obtained by the carbidint-nitriding reaction of Jecheon quartz-graphite mixture at 1, 35$0^{\circ}C$ in $N_2-H_2$ atmosphere. The ratio of $\beta$-SiC+($\alpha$+$\beta$)-$Si_3N_4$ content in a produced composite could be controlled by adjusting the reaction time and gaseous mixture.

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High Strength $Si_3N_4/SiC$ Structural Ceramics (고강도 $Si_3N_4/SiC$ 구조세라믹스에 관한 연구)

  • 김병수;김인술;장윤식;박홍채;오기동
    • Journal of the Korean Ceramic Society
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    • v.30 no.12
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    • pp.999-1006
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    • 1993
  • Si3N4(p)-SiC(p) composites were prepared by gas pressure sintering at 190$0^{\circ}C$ for 1 hour. $\alpha$-SiC with average particle size of 0.48${\mu}{\textrm}{m}$ were dispersed from zero to 50vol% in $\alpha$-Si3N4 with average particle size of 0.5${\mu}{\textrm}{m}$. Y2O3-Al2O3 system was used as sintering aids. When 10vol% of SiC was added to Si3N4, optimum mechanical properties were observed; relative density of 98.8%, flextural strength of 930MPa, fracture toughness of 5.9MPa.m1/2 and hardness value of 1429kg/$\textrm{mm}^2$. Grain growth of $\beta$-Si3N4 was inhibited as the amount of added SiC was increased. SiC particles were found inside the $\beta$-Si3N4 intragrains in case of 10, 20 and 30vol%SiC added composites.

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Microstructure and Cutting Characteristics of SiC-$Si_3N_4$ Ceramic Cutting Tool (SiC-$Si_3N_4$ 세라믹 절삭공구의 미세구조 및 절삭특성)

  • Gwon, Won-Tae;Kim, Yeong-Uk
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.12
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    • pp.1944-1949
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    • 2001
  • Four SiC-Si$_3$N$_4$ceramic cutting tools with different composition have been fabricated by hot-pressing. Correlations among the annealing time, the corresponding microstructure and the mechanical properties of resulting ceramics have been investigated. The fracture toughness and the grain size of both SiC and Si$_3$N$_4$in SiC-Si$_3$N$_4$composites increased with the annealing time. 1\`he hardness of SiC-Si$_3$N$_4$composites was relatively independent of the grain size and the sintered density. These ceramic cutting tools were tested under various cutting conditions and compared with the commercial Si$_3$N$_4$ceramic cutting tools. The experimental results were compared in terms of tool life and cutting force. The performance of SiC-Si$_3$N$_4$ceramic cutting tool shows the possibility to be a new ceramic tool.

Effect of Si on the Microstructure and Mechanical Properties of Ti-Al-Si-C-N Coatings (Si 함량에 따른 Ti-Al-Si-C-N 코팅막의 미세구조와 기계적 특성의 변화에 관한 연구)

  • Hong, Young-Su;Kwon, Se-Hun;Kim, Kwang-Ho
    • Journal of the Korean institute of surface engineering
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    • v.42 no.2
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    • pp.73-78
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    • 2009
  • Quinary Ti-Al-Si-C-N films were successfully synthesized on SUS 304 substrates and Si wafers by a hybrid coating system combining an arc ion plating technique and a DC reactive magnetron sputtering technique. In this work, the effect of Si content on the microstructure and mechanical properties of Ti-Al-C-N films were systematically investigated. It was revealed that the microstructure of Ti-Al-Si-C-N coatings changed from a columnar to a nano-composite by the Si addition. Due to the nanocomposite microstructure of Ti-Al-Si-C-N coatings, the microhardness of The Ti-Al-Si-C-N coatings significantly increased up to 56 GPa. In addition the average friction coefficients of Ti-Al-Si-C-N coatings were remarkably decreased with Si addition. Therefore, Ti-Al-Si-C-N coatings can be applicable as next-generation hard-coating materials due to their improved hybrid mechanical properties.

Fabrication of Electroconductive $Si_3N_4$-TiN Ceramic Composites by In-Situ Reaction Sintering (In-Situ 반응소결에 의한 전도성 $Si_3N_4$-TiN 복합세라믹스 제조)

  • Lee, Byeong-Taek;Yun, Yeo-Ju;Park, Dong-Su;Kim, Hae-Du
    • Korean Journal of Materials Research
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    • v.9 no.6
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    • pp.577-582
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    • 1999
  • In order to make the electroconductive $Si_3N_4$-TiN composities, the Si-Ti(N) compacts were nitrided at $1450^{\circ}C$ for 20hours, and then they were post-sintered by a gas-pressure-sintering technique at 1TEX>$1950^{\circ}C$ for 3.5 hours. As starting powders, commercial si powder of about $10\mu\textrm{m}$, two types of Ti powders of 100 and 325 mesh, and fine-sized TiN of $2.5\mu\textrm{m}$ powders were used. In the $Si_3N_4$-TiN sintered bodies used Ti powders, the relative density and fracture strength and electrical conductivity are low due to the existence of large amounts of coarse pores. However, in the $Si_3N_4$-TiN composite used TiN powder, the fracture toughness, fracture strength and electrical resistivity were $5.0MPa{\cdot}m^{1/2}$, 624MPa and $1400{\omega}cm$, respectively. The dispersion of TiN particles in the composite inhibited the growth of $Si_3N_4$ in the shape of rod and made strong strain field contrasts at the $Si_3N_4$-TiNinterfaces. It was recognized that microstructural control is required to improve the electrical conductivity and mechanical properties of $Si_3N_4$-TiN composites by dispersing TiN particles homogeneously.

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Growth and Characteristic of GaN using In-situ SiN Mask by MOCVD (In-situ SiN Mask를 이용한 GaN 성장 및 특성 연구)

  • Kim, Deok-Kyu;Jeong, Jong-Yub;Park, Choon-Bae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.04b
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    • pp.97-100
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    • 2004
  • We have grown GaN layers with in-situ SiN mask by metal organic chemical vapor deposition (MOCVD) and study the characteristic of the GaN layer. We have changed the deposition time of SiN mask from 45s to 5min and obtain th optimum condition in 45s. The PL intensity of GaN with SiN mask improved 2 times to that without SiN mask and the carrier concentraion increased from $3.5{\times}10^{16}cm^{-3}$ to $1.8{\times}10^{17}cm^{-3}$. We have thus shown that the SiN mask improved significantly the optical properties of the GaN layer.

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