• 제목/요약/키워드: SiC semiconductor

검색결과 653건 처리시간 0.03초

Use of 1.7 kV and 3.3 kV SiC Diodes in Si-IGBT/ SiC Hybrid Technology

  • Sharma, Y.K.;Coulbeck, L.;Mumby-Croft, P.;Wang, Y.;Deviny, I.
    • Journal of the Korean Physical Society
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    • 제73권9호
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    • pp.1356-1361
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    • 2018
  • Replacing conventional Si diodes with SiC diodes in Si insulated gate bipolar transistor (IGBT) modules is advantageous as it can reduce power losses significantly. Also, the fast switching nature of the SiC diode will allow Si IGBTs to operate at their full high-switching-speed potential, which at present conventional Si diodes cannot do. In this work, the electrical test results for Si-IGBT/4HSiC-Schottky hybrid substrates (hybrid SiC substrates) are presented. These substrates are built for two voltage ratings, 1.7 kV and 3.3 kV. Comparisons of the 1.7 kV and the 3.3 kV Si-IGBT/Si-diode substrates (Si substrates) at room temperature ($20^{\circ}C$, RT) and high temperature ($H125^{\circ}C$, HT) have shown that the switching losses in hybrid SiC substrates are miniscule as compared to those in Si substrates but necessary steps are required to mitigate the ringing observed in the current waveforms. Also, the effect of design variations on the electrical performance of 1.7 kV, 50 A diodes is reported here. These variations are made in the active and termination regions of the device.

DC Characteristics of P-Channel Metal-Oxide-Semiconductor Field Effect Transistors with $Si_{0.88}Ge_{0.12}(C)$ Heterostructure Channel

  • Choi, Sang-Sik;Yang, Hyun-Duk;Han, Tae-Hyun;Cho, Deok-Ho;Kim, Jea-Yeon;Shim, Kyu-Hwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제6권2호
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    • pp.106-113
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    • 2006
  • Electrical properties of $Si_{0.88}Ge_{0.12}(C)$ p-MOSFETs have been exploited in an effort to investigate $Si_{0.88}Ge_{0.12}(C)$ channel structures designed especially to suppress diffusion of dopants during epitaxial growth and subsequent fabrication processes. The incorporation of 0.1 percent of carbon in $Si_{0.88}Ge_{0.12}$ channel layer could accomodate stress due to lattice mismatch and adjust bandgap energy slightly, but resulted in deteriorated current-voltage properties in a broad range of operation conditions with depressed gain, high subthreshold current level and many weak breakdown electric field in gateoxide. $Si_{0.88}Ge_{0.12}(C)$ channel structures with boron delta-doping represented increased conductance and feasible use of modulation doped device of $Si_{0.88}Ge_{0.12}(C)$ heterostructures.

Electrical Characteristics of SiO2/4H-SiC Metal-oxide-semiconductor Capacitors with Low-temperature Atomic Layer Deposited SiO2

  • Jo, Yoo Jin;Moon, Jeong Hyun;Seok, Ogyun;Bahng, Wook;Park, Tae Joo;Ha, Min-Woo
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권2호
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    • pp.265-270
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    • 2017
  • 4H-SiC has attracted attention for high-power and high-temperature metal-oxide-semiconductor field-effect transistors (MOSFETs) for industrial and automotive applications. The gate oxide in the 4H-SiC MOS system is important for switching operations. Above $1000^{\circ}C$, thermal oxidation initiates $SiO_2$ layer formation on SiC; this is one advantage of 4H-SiC compared with other wide band-gap materials. However, if post-deposition annealing is not applied, thermally grown $SiO_2$ on 4H-SiC is limited by high oxide charges due to carbon clusters at the $SiC/SiO_2$ interface and near-interface states in $SiO_2$; this can be resolved via low-temperature deposition. In this study, low-temperature $SiO_2$ deposition on a Si substrate was optimized for $SiO_2/4H-SiC$ MOS capacitor fabrication; oxide formation proceeded without the need for post-deposition annealing. The $SiO_2/4H-SiC$ MOS capacitor samples demonstrated stable capacitance-voltage (C-V) characteristics, low voltage hysteresis, and a high breakdown field. Optimization of the treatment process is expected to further decrease the effective oxide charge density.

차세대 전력반도체 SiC MOSFET의 스위칭 특성 및 효율에 관한 연구 (The Switching Characteristic and Efficiency of New Generation SiC MOSFET)

  • 최원묵;안호균
    • 한국정보통신학회논문지
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    • 제21권2호
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    • pp.353-360
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    • 2017
  • 최근 Si기반 전력반도체의 물성적 한계로 인해 스위칭 반도체의 발전 속도가 떨어지고, 더 이상의 성능향상을 기대하기 어려운 실정이지만 Si기반보다 우수한 물성을 가진 SiC 기반 전력반도체가 개발되고 있다. 하지만 실제 시스템에 적용하기 위해서는 아직 뚜렷한 방법이 제시되지 못하고 있다. SiC기반 전력반도체의 시스템 설계에 대한 타당성과 솔루션을 제안하기 위하여, 1kW급의 DC-DC컨버터를 설계 및 제작하고 스위칭 주파수, 듀티비, 전압, 전류의 변화 조건 속에서 Si기반 전력반도체와 실험을 통해 비교 분석하였다. 각 시스템 부하별 입․출력을 통한 효율을 분석 및 Si MOSFET 대비 SiC MOSFET의 우수한 스위칭 성능을 확인하였고, 이를 통해 동일한 구동 조건에서 SiC MOSFET의 우수성을 검증하였다.

혼합 소스 HVPE 방법에 의한 4H-SiC 기판 위의 육각형 Si 에피층 성장 (Growth of hexagonal Si epilayer on 4H-SiC substrate by mixed-source HVPE method)

  • 김경화;박선우;문수현;안형수;이재학;양민;전영태;이삼녕;이원재;구상모;김석환
    • 한국결정성장학회지
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    • 제33권2호
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    • pp.45-53
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    • 2023
  • 4H-SiC 기판 위의 Si 성장은 전력 반도체, 바이폴라 접합 트랜지스터 및 광전자 공학에서 매우 유용한 재료로서 광범위한 응용 분야를 가지고 있다. 그러나 Si와 4H-SiC 사이에 약 20 %의 격자 불일치로 인해 4H-SiC에서 매우 양질의 결정 Si를 성장시키는 것은 상당히 어렵다. 본 논문에서는 혼합 소스 수소화물 기상 에피택시 방법을 이용하여 4H-SiC 기판에서 성장한 Al 관련 나노 구조체 클러스터에 의한 육각형 Si 에피층의 성장을 보고한다. 4H-SiC 기판 위에 육각형 Si 에피층을 성장시키기 위해 먼저 Al 관련 나노 구조체 클러스터가 형성되고 Si 원자를 흡수하여 육각형 Si 에피층이 형성되는 과정을 관찰하였다. Al 관련 나노 구조체 클러스터와 육각형 Si 에피층에 대하여 FE-SEM 및 라만 스펙트럼 결과로부터 육각형 Si 에피층은 일반적인 입방정계 Si 구조와 다른 특성을 가지는 것으로 판단된다.

C54구조의 $TiSi_2$와 As 이온 주입된 다결정 Si계에서 고온 열처리에 의한 표면상태 거칠어짐과 TiAs 침전물 형성에 관한 연구 (Investigation of TiAs Precipitate Formation and Morphology Degradation between $TiSi_2$ with C54 Structure and Poly Silicon Doped with Arsenic)

  • 박형호;조경익;이희태;성명모;이상환;권오준;남기수
    • 대한전자공학회논문지
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    • 제27권11호
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    • pp.55-61
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    • 1990
  • 비로소 높게 이온주입된 다결정 실리콘에 대한 C54 구조를 갖는 $TiSi_{2}$의 열적 안정성과 $TiSi_{2}{\times}As{\longrightarrow}TiAs{\times}2Si$의 TiAs 석출물 형성반응이 다결정 실리콘 박막의 표면 상태 거칠어짐에 미치는 영향을 살펴보았다.

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10kW급 HVAC 시스템을 위한 Enhanced Interleaved PFC Boost 컨버터 형태의 650V IPM 개발 (Development of Enhanced Interleaved PFC Boost Converter typed 650V Intelligent Power Module for up to 10kW HVAC Systems)

  • 이기현;홍승현;김태현;정진용;권태성
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2018년도 전력전자학술대회
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    • pp.536-538
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    • 2018
  • This paper introduces an enhanced interleaved (IL) PFC (Power Factor Correction) boost converter typed 650V Intelligent Power Module (IPM), which is fully optimized hybrid IGBT converter modules; Silicon (Si) IGBT and Silicon Carbide (SiC) diode, for up to 10kW HVAC (Heating, Ventilation, and Air Conditioning) systems. It utilizes newly developed $4^{th}$ Generation Field Stop (FS) trench IGBTs, $EXTREMEFAST^{TM}$ anti-paralleled diodes, SiC Junction Barrier Schottky (JBS) diodes, Bridge rectifiers, Multi-function LVIC, and Built-in thermistor provide good reliable characteristics for the entire system. This module also takes technical advantage of DBC (Direct Bonded Copper) substrate for the better thermal performance. It is shown that the Si IGBT/SiC diode hybrid IL PFC module can achieve excellent EMI performance and greatly enhance the power handling capability or switching frequency of various applications compared to the Si IGBT/Diode. This paper provides an overall description of the newly developed 650V/50A Hybrid SiC IL PFC IPM product.

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Bottom Collector와 단일 금속층 구조로 설계된 SiGe HBT의 전기적 특성 (Structure and Electrical Properties of SiGe HBTs Designed with Bottom Collector and Single Metal Contact)

  • 최아람;최상식;윤석남;김상훈;서형기;심규환
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.187-187
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    • 2007
  • This paper presents the electrical properties of SiGe HBTs designed with bottom collector and single metal layer structure for RF power amplifier. Base layer was formed with graded-SiGe/Si structures and the collector place to the bottom of the device. Bottom collector and single metal layer structures could significantly simplify the fabrication process. We studied about the influence of SiGe base thickness, number of emitter fingers and temperature dependence (< $200^{\circ}C$) on electrical properties. The feasible application in 1~2GHz frequency from measured data $BV_{CEO}$ ~10V, $f_r$~14 GHz, ${\beta\simeq}110$, NF~1 dB using packaged SiGe HBTs. We will discuss the temperature dependent current flow through the e-b, b-c junctions to understand stability and performance of the device.

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Aluminium Gate를 적용한 4H-SiC MOSFET의 Design parameter에 따른 전기적 특성 분석 (Electrical characterization of 4H-SiC MOSFET with aluminum gate according to design parameters)

  • 백승환;이정민;서우열;구용서
    • 전기전자학회논문지
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    • 제27권4호
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    • pp.630-635
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    • 2023
  • SiC는 고온, 고전압을 비롯한 악조건에서의 내성이 기존 산업분야의 대다수를 점유하고 있는 Silicon에 비해 우수하여 전력반도체 분야에서 Silicon의 위치를 대체하여 가고 있다. 본 논문은 전력 반도체 소자 중 하나인 4H-SiC Planar MOSFET에 알루미늄으로 Gate를 형성하여 다결정 Si 게이트와 대비, 파라미터 값들이 일관성을 갖도록 하였으며, SiC MOSFET의 채널 도핑 농도에 변화를 주어 문턱전압과 항복전압, IV 특성을 연구하였다.

Z-Source Inverter with SiC Power Semiconductor Devices for Fuel Cell Vehicle Applications

  • Aghdam, M. Ghasem Hosseini
    • Journal of Power Electronics
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    • 제11권4호
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    • pp.606-611
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    • 2011
  • Power electronics is a key technology for electric, hybrid, plug-in hybrid, and fuel cell vehicles. Typical power electronics converters used in electric drive vehicles include dc/dc converters, inverters, and battery chargers. New semiconductor materials such as silicon carbide (SiC) and novel topologies such as the Z-source inverter (ZSI) have a great deal of potential to improve the overall performance of these vehicles. In this paper, a Z-source inverter for fuel cell vehicle application is examined under three different scenarios. 1. a ZSI with Si IGBT modules, 2. a ZSI with hybrid modules, Si IGBTs/SiC Schottky diodes, and 3. a ZSI with SiC MOSFETs/SiC Schottky diodes. Then, a comparison of the three scenarios is conducted. Conduction loss, switching loss, reverse recovery loss, and efficiency are considered for comparison. A conclusion is drawn that the SiC devices can improve the inverter and inverter-motor efficiency, and reduce the system size and cost due to the low loss properties of SiC devices. A comparison between a ZSI and traditional PWM inverters with SiC devices is also presented in this paper. Based on this comparison, the Z-source inverter produces the highest efficiency.