• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.353.1-353.1
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• 2016

다공성 물질은 동공의 크기에 따라 미세동공(Micropore), 메조동공(Mesopore), 거대동공(Macropore)으로 나누어 분류한다. 다공성 재료의 장점은 높은 비표면적으로써, 촉매, 센서, 연료전지 전극, 에너지 저장장치 등으로의 이용 가능성을 보여주는 연구가 활발히 보고되고 있다. 종래의 연구는 두 가지 이상의 원소로 구성된 박막을 제작한 후 전기화학적 분해법, 선택적 용해법 등 습식공정을 통해 다공성 구조체를 제작하였다. 하지만 본 연구에서는 Au, Ag 타겟과 $CH_4$ gas를 이용해 ICP-assisted reactive magnetron sputtering 장비를 활용하여 450 nm 두께의 Au-C, Ag-C 박막을 제작하였다. 이후 연속적으로 RF 250 W를 ICP antenna 에 인가하여 $O_2$ plasma dealloying 공정을 통해 탄소(Carbon) 만을 선택적으로 제거함으로써, 건식 공정만으로 Si wafer ($10{\times}10mm^2$) 기판 위에 250 ~ 300 nm 두께의 다공성 Au, Ag 박막을 제작하였다. SEM (Scanning Electron Microscopy)를 활용하여 표면, 단면 형상을 관찰해 다공성 구조를 확인하였으며, AES (Auger Electron Spectroscopy)를 통해 plasma dealloying 전 후 박막의 조성변화를 관찰하였다. 따라서 plasma dealloying 공정으로 제작된 다공성 Au, Ag 박막은 기존의 습식 공정 대비 청결하고 신속한 공정이 가능하며 높은 재현성을 통해 위의 적용분야에 보다 쉽게 사용될 수 있을 것으로 기대된다.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.8
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• pp.15-23
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• 1998

Single crystalline I $n_{x}$G $a_{1-x}$ N thin film was grwon by MOCVD on (001) sapphire substrate for the blue light emitting devices. A good quality of I $n_{0.13}$G $a_{0.87}$N/GaN heterostructure grwon above 700.deg. C was confiremed by various characterization techniques of AFM, RHEED and DC-XRD. Through PL measurement at room temperautre for the Si-Zn co-doped I $n_{x}$G $a_{a-x}$N/GaN structure grwon at 800.deg. C to obtain blue wavelength emission, 460-470 nm and 425 nm emission peak were observed, which are believed to be from donor-to-acceptor pair transition and band edge emission of In/x/G $a_{1-x}$ N, respectively. The result of PL measurement of the undoped MQW I $n_{x}$G $a_{1-x}$ N layer at low temperature confirmed that the strong MQW peak was resulted by exciton from the GAN barrier and carrier of DA pair confined into the well layer.ll layer.yer.r.

• Journal of the Korean Ceramic Society
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• v.36 no.9
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• pp.893-900
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• 1999

Silica films were prepared on Si single crystal substrates by sol-gel process using TEOS as starting materials. Films were fabricated by a spin coating technique. Sol solutions were prepared by varying the compositions of CH3OH, H2O and DMF with fixed molar ratio of TEOS=1, HCl=0.05(mol). Wetting behavior viscosity of solutions gelation time thickness of films and cracking behavior were investigated with the various solution compositions. Wetting behaviors of solutions depended on the solution compositions mixing method and mixing rate. The optimum composition of sol was TEOS : DMF ; CH3OH: H2O :HCl=1:2:4:4:0.05(mol) and the mixing rate of solution was optimized at 1 ml/min. Viscosity of solutions were controlled by choosing a reaction time(elapsed time after mixing) at a room temperature so that we could get up to 800nm thick film The surface roughness was getting poor when thickness of films was thicker than 500nm. Thickness of coated films were increased with decreasing amount of CH3OH. The best surface roughness was obtained at the content of CH3OH 4 mol. The shortest gelation time was obtained with the content of CH3OH 8 mol. Crack-free filkms were fabricated when sintered at 500$^{\circ}C$ for 1 hr with heating rate of 0.6$^{\circ}C$/min.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.907-910
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• 1997

With increasing the needs for micro and precision parts, micro machining technology has been studied to fabricate a small part with high density such as electronics, optics, communications, and medicine industry more than before. But there are many problems to be solved requiring a high-level technology. So this research presents the new method to fabricate a small part through applying chemical mechanical micro machining (C3M) for the Al wafer. Al(thickness I ,u m) was sputtered on the Si substrate. Al is widely used as a lightweight material. However form defect such as burr has a bad effect on products. To improve machinability of ductile material, oxide layer was formed on the surface of AI wafcr before grooving by chemical reaction with HN03(10wt%). And then workpieces were machined to compare conventional micro-machining process with newly suggested method at different machining condition such as load and feed rate. To evaluate whether or not the machinability was improved by the effect of chemical condition, such as the size, the width of grooves 'and burr generation were measured. Finally, it is confirmed that C3M is one of the feasible tools for micro machining with the aid of effect of the chemical reaction.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.5
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• pp.239-243
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• 2012

$SnO_2$ thin films were prepared on the Si substrate by radio frequency (RF) magnetron sputtering and then post deposition vacuum annealed to investigate the effect of annealing temperature on the structural properties and hydrogen gas sensitivity of the films. The films that annealed at $300^{\circ}C$ show the higher sensitivity than the other films annealed at $150^{\circ}C$. From atomic force microscope observation, it is supposed that post deposition annealing promotes the rough surface and also, increase gas sensitivity of $SnO_2$ films for hydrogen gas. These results suggest that the vacuum annealed $SnO_2$ thin films at optimized temperatures are promising for practical high-performance hydrogen gas sensors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.452-455
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• 2003

[ $ZrO_2$ ] dielectric layers were grown on the p-type Si (100) substrate by metalorganic molecular beam epitaxy(MOMBE). Zrconium t-butoxide, $Zr(O{\cdot}t-C_4H_9)_4$ was used as a Zr precursor and Argon gas was used as a carrier gas. The thickness of the layers was measured by scanning electron microscopy (SEM) and the properties of the $ZrO_2$ layers were evaluated by X-ray diffraction, high frequency capacitance-voltage measurement. and HF C-V measurements have shown that $ZrO_2$ layer grown by MOMBE has a high dielectric constant (k=18-19). The growth rate is affected by various process variables such as substrate temperature, bubbler temperature, Ar, and $O_2$ gas flows.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.32.1-32.1
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• 2018

Novel soft magnetic materials can be achieved by altering material properties such as morphology, composition, crystallinity, and grain size of soft magnetic alloys. Especially, magnetic properties (i.e., saturation magnetization, coarcivity) of soft magnetics are significantly affected by grain boundaries which act as a control of magnetic domain wall movement. Thus, we herein develop a two-step electroless plating method to control morphology and grain size of FeCo films for excellent magnetic properties. Accordingly, the chemical composition to control the degree of polarization of FeCo alloys was altered by electroless deposition parameters; for example, electrolyte concentration and temperature. The grain size and crystallinity of FeCo alloys was dramatically affected by the reaction temperature because the grain growth mechanism dominantly occurs at $90^{\circ}C$ where as the neucleation only happens at $50^{\circ}C$. By simply controlling the temperature, the micron-sized FeCo grains embedded FeCo film was synthesized where the large grains allow high magnetization originated from larger magnetic domain with low corecivity and the nano-sized grains allow excellent soft magnetic properties due to the magnetic correlation length.

• Journal of Magnetics
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• v.8 no.1
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• pp.32-35
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• 2003

Magnetic funnel Junctions (MTJs) were fabricated on thermally oxidized Si (100) wafers using DC magnetron sputtering. The film Structures were Ta(50 ${\AA}$)/CU(100 ${\AA}$)$Ni_{80}Fe_{20}(20 $ ${\AA}$)/Cu(50 ${\AA}$)/$Mn_{75}Ir_{25}(100 $ ${\AA}$)/$Co_{70}Fe_{30}(25$ ${\AA}$)/Al-O(15 ${\AA}$)/$Co_{70}Fe_{30}(25 $ ${\AA}$)/$Ni_{80}Fe_{20}(t)/Ta(50 $ ${\AA}$), with t=0 ${\AA}$, 100 and 1000 ${\AA}$, respectively. X-ray diffraction has shown improvement of (111) texture of IrMn$_3$ and Cu by annealing. The exchange-biased energy is almost inversely proportional to temperature. The difference between the coercivity H$_c$ and the exchange biased field H$_E$ for t = 0 $_3$ sample is smaller than that for t = 1000 ${\AA}$. For the pinned layer, the decreasing rate of the coercivity with the temperature is higher compared to that of the exchange field, but variation of H$_c$ is similar to that of the exchange field for free layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.207-207
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• 2013

기존의 그래핀 성장에 관한 연구는 열화학기상증착법(Chemical vapor deposition; CVD)을 이용한다. 그래핀 성장 제어 요소로는 촉매 기판인 전이 금속[Ru, Ir, Co, Re, Pt, Pd, Ni, Cu], 기판 전처리 과정, 수소/메탄 가스 혼합비, 작업 진공 상태, 기판온도[$800{\sim}1,000^{\circ}C$, 냉각 속도 등으로 보고 되고 있다. 그래핀 성장 원리는 Cu 촉매 기판에 메탄 가스를 $1,000^{\circ}C$ 온도에서 분해해서 탄소를 고용 시킨 후 급랭하는 도중에 석출되는 탄소에 의해 그래핀 시트가 형성되는 것으로 알려져 있다. 기존의 CVD를 열원을 이용할 경우 내부 챔버에 생기는 잠열에 의해 cooling profile의 제어가 용이하지 않다. 본 연구에서는 근적외선(Near Infrared; NIR) 열원을 이용한 CVD로 챔버 내부 잠열을 최소화하고, 냉각 공정을 Natural, Linear, Convex cooling type으로 디자인해서 cooling profile 제어가 그래핀 성장에 미치는 영향을 연구 하였다. 이렇게 성장된 그래핀을 임의의 기판(SiO2, Glass, PET film) 위에 습식방법으로 전이 시킨 후, 전기적 구조적 및 광학적 특성을 면저항(four-point probe), 전계방사 주사전자현미경(Field Emission Scanning Electron Microscope; FE-SEM), 마이크로 라만 분광법(Micro Raman spectroscopy) 및 광학현미경(optical microscope), 투과도(UV/Vis spectrometer)의 측정으로 잠열이 최소화된 NIR-CVD에서 cooling profile에 따른 그래핀 성장을 평가하였다.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1490-1492
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• 1994

Diamond thin films were deposited on Si substrate from $CH_4-H_2-O_2$ system by MWPECVD at the condition of power of 800W, pressure of 80torr, $H_2$ flow rate of $75{\sim}81sccm$, $O_2$ flow rate of $0{\sim}3.8sccm$, $CH_4$ flow rate of $4.8{\sim}9sccm$, substrate temp, of $950{\sim}1010^{\circ}C$ and deposition time of 5hr. The deposited films were characterized by SEM, XRD and Raman spectroscopy. The growth rates of thin films and particles was measured. Good quality were synthesized at 40% of oxygen concentration which 6% of fixed metane concentration, and at 50%. Its deposition rates were $2.4{\mu}m/h$ respectively. As oxygen concentration increased, it was known that the broad peak of $1350 cm^{-1}$ was shifted to $1332cm^{-1}$ due to etching of carbon component.