• 한국표면공학회지
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• 제34권5호
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• pp.503-509
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• 2001

Thin films of hydrogenated amorphous silicon (a-Si : H) and hydrogenated amorphous silicon carbide (a-SiC:H) of different compositions were deposited on Si(100) wafer and glass by RF plasma-enhanced chemical vapor deposition (RF-PECVD). In the present work, we have investigated the effects of the RF power on the properties, such as optical band gap, transmittance and crystallinity. The Raman data show that the a-Si:H material consists of an amorphous and crystalline phase for the co-presence of two peaks centered at 480 and $520 cm^{-1}$ . The UV-VIS data suggested that the optical energy band gap ($E_{g}$ ) is not changed effectively with RF power and the obtained $E_{g}$(1.80eV) of the $\mu$c-Si:H thin film has almost the same value of a-Si:H thin film (1.75eV), indicating that the crystallity of hydrogenated amorphous silicon thin film can mainly not affected to their optical properties. However, the experimental results have shown that$ E_{g}$ of the a-SiC:H thin films changed little on the annealing temperature while $E_{g}$ increased with the RF power. The Raman spectrum of the a-SiC:H thin films annealed at high temperatures showed that graphitization of carbon clusters and microcrystalline silicon occurs.

• 한국진공학회지
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• 제10권3호
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• pp.361-367
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• 2001

CMP(Chemical Mechanical Polishing)는 반도체 소자 제조공정 중 다층 배선구조의 평탄 경면화에 널리 이용되고 있다. 차세대 웨이퍼로 각광받는 SOI(Silicon On Insulator) 웨이퍼 제조공정 중 웨이퍼 표면 미소 거칠기를 개선하기 위해서 본 논문에서는 여러 가지 가공변수(슬러리와 연마패드)에 따른 CMP 연마능률과 표면 미소 거칠기 변화에 대해 연구하였다. 결과적으로 연마능률은 슬러리의 입자 크기가 증가할수록 이에 따라 증가하였으며, 미소 거칠기는 슬러리의 연마입자보다는 연마패드에 영향이 더욱 지배적이다. AFM(Atomic Force Microscope)에 의한 평가에서 표면 미소 거칠기가 27 $\AA$ Rms에서 0.64 $\AA$ Rms로 개선됨을 확인할 수 있었다.

• 대한기계학회논문집A
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• 제30권11호
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• pp.1335-1347
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• 2006

Surface energies calculated from measured contact angles between several solutions and test samples, such as Si wafer, $Al_2O_3$, $SiO_2$, PTFE(Polytertrafluoroethylene), and DLC(Diamond Like Carbon) films, based on geometric mean method and Lewis acid base method. In order to relate roughness to adhesion force, surface roughness of test samples were scanned large area and small by AFM(Atomic Force Microscopy). Roughness was representative of test samples in large scan area and comparable with AFM tip radius in small scan area. Adhesion forces between AFM tip and test samples were matched well with order of roughness rather then surface energy. When AFM tips having different radius were used to measure adhesion force on DLCI film, sharper AFM tip was, smaller adhesion force was measured. Therefore contact area was more important factor to determine adhesion force.

• 청정기술
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• 제24권3호
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• pp.157-165
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• 2018

본 연구에서는 초임계 이산화탄소와 공용매 첨가물을 이용하여 실리콘 웨이퍼 표면의 $Si_3N_4$ 파티클을 제거하는 기술을 조사하였다. 우선, 몇 가지 계면활성제와 첨가제에 관한 초임계 이산화탄소 용해도 및 파티클 분산성 평가를 통하여 초임계 공정에 대한 적합성을 확인하였다. 다양한 변수를 조정하여 파티클 세정 실험을 진행하여 최적의 제거 조건을 확립하였다. 실험에 사용된 계면활성제는 파티클 제거 효과가 떨어졌으며, 실험 후 이차 오염물이 형성됨을 확인하였다. 반면 trimethyl phosphate는 IPA공용매와 미량의 HF와 혼합된 세정 첨가제로서 초임계 이산화탄소에 5 wt%로 포함한 유체로 온도 $50^{\circ}C$, 압력 2000 psi에서 $15mL\;min^{-1}$의 유속으로 4분 간 세정한 결과, 85%의 파티클 제거 효율을 나타내었다.

• 한국표면공학회지
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• 제24권4호
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• pp.206-214
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• 1991

In the basic study of selective electroless Ni plating of Si wafers, plating rate and physical properties are investigated to obtain optimum conditions of contact hole filling. Si wafers are excellently activated in the concentration of 0.5M IF, 1mM PdCl2, 2mM EDTA at $70^{\circ}C$, 90sec. The optimum condition of Ni-B deposition on p-type Si wafers is 0.1M NiSO4, 0.11M Citrate, $70^{\circ}C$, pH6.8, 8mM DMAB. The main factor in the sheet resistences variation of films is amorphous and on heat treating matrix was transformed into a stable phase (Ni+Ni3B) at $300-400^{\circ}C$. But pH or DMAB concentration in the plating solution doesn't play role of heat-affected phase change.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.266.2-266.2
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• 2013

According to advanced nanotechnology, the nanostructured materials with various kinds and shape are synthesized easily or produced by process. Recently, researches about interaction between the nanostructured materials and biological system have been progressed actively. The surface topography may influence cellular responses, for example cell adhesion, cell morphology. In this work, we synthesized vertically aligned silicon nanowires (SiNWs) on the Au-covered Si(111) wafer by chemical vapor deposition (CVD) method. We accomplished to control of the SiNWs diameter by regulating thickness of Au film such as 1 nm and 10 nm. These substrates did not isolate cells and just provided surface topography for cell culture. Human Embryonic Kidney 293T cells (HEK 293T cells) were cultured on these substrates for 2 days. We studied the nanotopographical effects on cell morphology, adhesion, and growth which are evaluated on each SiNWs substrate comparing bare glass as control.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1374-1377
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• 2005

Top-emitting organic light-emitting diode (TEOLED) was fabricated on flexible substrate of PES film. Aluminum and Chromium multilayer was used as an anode of TEOLED and the TEOLEDs of Cr(20nm)/Al(100nm)/Cr(20nm)/NPB(60nm)/Alq(60nm)/LiF(1nm)/Al(2nm)/Ag(20nm)/NPB(200nm) has been fabricated on PES film and Si wafer for control device. The TEOLED on PES film which had good anode surface morphology, showed very similar device characteristics to that on Si wafer.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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• pp.237-240
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• 2001

In this paper, we have presented processing technique about wet etching for silicon membrane construction formation. In order to make selective etching of backside silicon wafer, we used Si$_3$N$_4$ layer by PECVD(Plasma Enhanced Chemical Vapor Deposition). We have measured the surface thickness in backside silicon wafer after anisortropic wet etching with KOH:distilled water solutions. Through this experiment, we acquired the etching rate for 1.29${\mu}{\textrm}{m}$/min. The average rough of Si-membrane frontside and backside was 0.26${\mu}{\textrm}{m}$, 0.90${\mu}{\textrm}{m}$, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.364-365
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• 2005

This paper report nanotribological behavior between Si tip and Cu wafer surfaces which was treated various concentration of $H_2O_2$. This experimental approach has proven atomic level insight into Cu CMP. It has been used to study interfacial friction and adhesion force between Si tip and Cu wafer surfaces in air by atomic force microscopy (AFM). Adhesion force of Cu surfaces which was pre-cleaned in diluted HF solution was lager than Cu oxide surfaces. Adhesion force of Cu oxide surface was saturated around 7 nN. Slope of normal force vs lateral signal was increased as increasing concentration of $H_2O_2$ and it was saturated around 24. Friction force of Cu oxide was lager than Cu.

• 통합자연과학논문집
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• 제3권4호
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• pp.219-225
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• 2010

On the surface of mesoporous silica thin films (MSTF) which were fabricated by sol-gel approach there are existences of water and three different silanol types including chained, germinal and isolated silanol. Their amounts changes as a function of aging time of used sol solution, as confirmed by FT-IR. The adsorbed water generates ionic carriers such as H+ and OH- and passivates the Si dangling bonds at the interface of silicon wafer-MSTF. The ionic carriers can not only transport across the thickness of thin film to enhance the leakage current but also diffuse toward the silicon wafer-MSTF interface to depassivate Si dangling bonds. On the other hand, chained silanols or germinal silanols promote the moisture adsorption of MSTF and tend to form strongly hydrogen bonded systems with adsorbed water molecules resulting in very high dielectric constant. Isolated silanol, on the contrary, affects less on electrical properties of thin film.