• Title/Summary/Keyword: Si delta doping

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Threshold Voltage Control of a-Si TFT by Delta Doping of Phosphorous

  • Soh, Hoe-Sup;Kim, Cheol-Se;Kim, Eung-Do
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08b
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    • pp.1165-1167
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    • 2007
  • Delta doping method can separate the threshold voltage control region from the charge transport region in a-Si TFT, whereby the threshold voltage of a TFT could be modified. Threshold voltage could be changed by delta doping, while field effect mobility was estimated to be 80% of that of standard TFT.

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Molecular beam epitaxial growth and characterization of Sb .delta.-doped Si layers using substrate temperature modulation technique (저온 변조 성장 기법을 이용하여 Sb가 ${\delta}$ 도핑된 다층 구조의 Si 분자선 박막 성장과 특성 분석)

  • Le, Chan ho
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.12
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    • pp.142-148
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    • 1995
  • Sb ${\delta}$-doped Si layers were grown by Si MBE (Molecular Beam Epitaxy) system using substrate temperature modulation technique. The Si substrate temperatures were modulated between 350$^{\circ}C$ and 600$^{\circ}C$. The doping profile was as narrow as 41$\AA$ and the doping concentration of up to 3.5${\times}10^{20}cm^{3}$ was obtained. The film quality was as good as bulk material as verified by RHEED (Reflected High Energy Electron Diffraction), SRP (Spreading Resistance Profiling) and Hall measurement. Since the film quality is not degraded after the growth a Sb ${\delta}$-doped Si layer, the ${\delta}$-doped layers can be repeated as many times as we want. The doping technique is useful for many Si devices including small scale devices and those which utilize quantum mechanical effects.

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Electron Distribution in the GaAs-AlxGa1-x Quantum Well with the Si δ-doping Layer in a Non-central Position under the External Electric Field (비 중심 Si δ-doping 층을 갖는 GaAs-AlxGa1-x 양자우물에서 전계에 따른 전자 분포)

  • Choi, Jun-Young;Chun, Sang-Kook
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.1
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    • pp.14-18
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    • 2007
  • The electric property in the $GaAs-Al_{x}Ga_{1-x}$ quantum well with the Si ${\delta}-doping$ layer in a non-central position is studied through the effect of the electric field intensity on the electron distribution. The finite difference method is used for the calculation of the subband energy level and its wavefunction. In order to account for the change of the potential energy due to the charged particles, the self consistent method is employed. As the Si ${\delta}-doping$ layer becomes closer to the heterojunction interface, the electrons less affected by Coulomb scattering are greatly increased under the external electric field. Therefore, the high speed device is suggested due to the fact that the high mobility electrons can be increased by positioning the ${\delta}-doping$ layer in the quantum well and by applying the electric field intensity.

Inclusion of Silicon Delta-doped Two-dimensional Electron Gas Layer on Multi-quantum Well Nano-structures of Blue Light Emitting Diodes

  • Kim, Keun-Joo
    • Transactions on Electrical and Electronic Materials
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    • v.5 no.5
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    • pp.173-179
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    • 2004
  • The influence of heavily Si impurity doping in the GaN barrier of InGaN/GaN multi-quantum well structures of blue light emitting diodes were investigated by growing samples in metal-organic chemical vapor deposition. The delta-doped sample was compared to the sample with the undoped barrier. The delta-doped sample shows the tunneling behavior and forms the energy level of 0.32 eV for tunneling and the photoemission of the 450-nm band. The photo-luminescence shows the blue-shifted broad band of the radiative transition due to the inclusion of Si delta-doped layer indicating that the delta doping effect acts to form the higher energy level than that of quantum well. The dislocation may provide the carrier tunneling channel and plays as a source of acceptor. During the tunneling of hot carrier, there was no light emission.

Performance enhancement of Si channel MESFET using double $\delta$-doped layers (이중 $\delta$ 도핑층을 이용한 Si 채널 MESFET의 성능 향상에 관한 연구)

  • 이찬호;김동명
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.34D no.12
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    • pp.69-75
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    • 1997
  • A Si-channle MESFET using .delta.-doped layers was designed and the considerable enhancement of the current driving capability of the device was observed by simulation. The channel consists of double .delta.-doped layers separated by a low-doped spacer. Cariers are spilt from the .delta.-doped layers and are accumulated in the spacer. The saturation current is enhanced by the contribution of the carriers in the spacer. Among the design parameters that affect the peformance of the device, the thickness of the spacer and the ratio of the doping concentrations of the two .delta.-doped layers were studied. The spacer thickenss of 300~500.angs. and the doping ratio of 3~4 were shown to be the optimized values. The saturation current was observed to be increased by 75% compared with a bulk-channel MESFET. The performances of transconductance, output resistance, and subthreshold swing were also enhanced.

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Low-frequency Noise Characteristics of Si0.8Ge0.2 pMOSFET Depending upon Channel Structures and Bias Conditions (채널구조와 바이어스 조건에 따른 Si0.8Ge0.2 pMOSFET의 저주파잡음 특성)

  • Choi Sang-Sik;Yang Hun-Duk;Kim Sang-Hoon;Song Young-Joo;Lee Nae-Eung;Song Jong-In;Shim Kyu-Hwan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.1
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    • pp.1-6
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    • 2006
  • High performance $Si_{0.8}Ge_{0.2}$ heterostructure metal-oxide-semiconductor field effect transistors (MOSFETs) were fabricated using well-controlled delta-doping of boron and $Si_{0.8}Ge_{0.2}$/Si heterostructure epitaxal layers grown by reduced pressure chemical vapor deposition. In this paper, we report 1/f noise characteristics of the SiGe pMOSFETs measured under various bias conditions of the gate and drain voltages changing in linear operation regions. From the noise spectral density, we found that the gate and drain voltage dependence of the noise represented same features, as usually scaled with $f^{-1}$ However, 1/f noise was found to be much lower in the device with boron delta-doped layer, by a factor of $10^{-1}_10^{-2}$ in comparison with the device fabricated without delta-doped layer. 1/f noise property of delta-doped device looks important because the device may replace bipolar transistors most commonly embedded in high-frequency oscillator circuits.

Low-Frequency Noise Characteristics of SiGe pMOSFET Depending upon Channel Structures and Bias Conditions (SiGe pMOSFET의 채널구조와 바이어스 조건에 따른 잡음 특성)

  • Choi, Sang-Sik;Yang, Hun-Duk;Kim, Sang-Hoon;Song, Young-Joo;Cho, Kyoung-Ik;Kim, Jeonng-Huoon;Song, Jong-In;Shim, Kyu-Hwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.5-6
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    • 2005
  • High performance SiGe heterostructure metal-oxide-semiconductor field effect transistors(MOSFETs) were fabricated using well-controlled delta-doping of boron and SiGe/Si heterostructure epitaxal layers grown by reduced pressure chemical vapor deposition. In this paper, we report 1/f noise characteristics of the SiGe MOSFETs measured under various bias conditions of the gate and drain voltages changing in linear operation regions. From the noise spectral density, we found that the gate and drain voltage dependence of the noise represented same features, as usually scaled with $f^1$. However, 1/f noise was found to be much lower in the device with boron delta-doped layer, by a factor of $10^{-1}\sim10^{-2}$ in comparion with the device fabricated without delta-doped layer. 1/f noise property of delta-doped device looks important because the device may replace bipolar transistors most commonly embedded in high-frequency oscillator circuits.

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Two Dimensional Boron Doping Properties in SiGe Semiconductor Epitaxial Layers Grown by Reduced Pressure Chemical Vapor Deposition (감압화학증착법으로 성장된 실리콘-게르마늄 반도체 에피층에서 붕소의 이차원 도핑 특성)

  • Shim, Kyu-Hwan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.12
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    • pp.1301-1307
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    • 2004
  • Reduced pressure chemical vapor deposition(RPCYD) technology has been investigated for the growth of SiGe epitaxial films with two dimensional in-situ doped boron impurities. The two dimensional $\delta$-doped impurities can supply high mobility carriers into the channel of SiGe heterostructure MOSFETs(HMOS). Process parameters including substrate temperature, flow rate of dopant gas, and structure of epitaxial layers presented significant influence on the shape of two dimensional dopant distribution. Weak bonds of germanium hydrides could promote high incorporation efficiency of boron atoms on film surface. Meanwhile the negligible diffusion coefficient in SiGe prohibits the dispersion of boron atoms: that is, very sharp, well defined two-dimensional doping could be obtained within a few atomic layers. Peak concentration and full-width-at-half-maximum of boron profiles in SiGe could be achieved in the range of 10$^{18}$ -10$^{20}$ cm$^{-3}$ and below 5 nm, respectively. These experimental results suggest that the present method is particularly suitable for HMOS devices requiring a high-precision channel for superior performance in terms of operation speed and noise levels to the present conventional CMOS technology.

Raman Spectroscopic Deconvolution of Strain and Charge Doping Effects in Graphene on SiO2/Si Substrate

  • Lee, Ji-Eun;Kim, Seon-Ho;Gang, Seong-Gyu;Yang, Seong-Ik;Lee, Yeong-Sik;Ryu, Sun-Min
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.155-155
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    • 2011
  • 그래핀(graphene)은 모든 탄소 원자가 표면에 존재하는 이차원 결정이기 때문에 다른 고체 표면에 고착될 때 인장 및 압축 변형(tensile & compressive strain)과 전하 도핑(charge doping)에 취약하다고 알려져 있다. 본 연구에서는 산화실리콘(SiO2/Si) 기판 위에 기계적으로 박리된 그래핀에 혼재되어 나타나는 기계적 변형과 전하 도핑 현상을 분석할 수 있는 라만 분광법 기술을 개발하고자 하였다. 대부분의 시료에서 기계적 변형으로 인해 라만 G-band와 2D-band의 진동수(${\omega}$)가 특별한 상관관계(${\Delta}{\omega}2D/{\Delta}{\omega}G$ = 2.0 ${\pm}$ 0.2)를 가진다는 사실을 확인하였다. 전자 친화도가 큰 F4-TCNQ (tetrafluorotetracianoquinodimethane)를 증착하여 화학적으로 p-형 전하 도핑을 유도한 그래핀에서는 기계적 변형과는 분명히 구별되는 상관관계(${\Delta}{\omega}2D/{\Delta}{\omega}G$ = 1.0 ${\pm}$ 0.3)가 관찰되었다. 본 연구는 라만 분광법을 통해 그래핀의 기계적 변형과 전하 도핑 정도를 정량적으로 분리해서 분석할 수 있는 방법을 제시해 준다.

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Development of SiGe Heterostructure Epitaxial Growth and Device Fabrication Technology using Reduced Pressure Chemical Vapor Deposition (저압화학증착을 이용한 실리콘-게르마늄 이종접합구조의 에피성장과 소자제작 기술 개발)

  • Shim, K.H;Kim, S.H;Song, Y.J;Lee, N.E;Lim, J.W;Kang, J.Y
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.4
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    • pp.285-296
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    • 2005
  • Reduced pressure chemical vapor deposition technology has been used to study SiGe heterostructure epitaxy and device issues, including SiGe relaxed buffers, proper control of Ge component and crystalline defects, two dimensional delta doping, and their influence on electrical properties of devices. From experiments, 2D profiles of B and P presented FWHM of 5 nm and 20 nm, respectively, and doses in 5×10/sup 11/ ∼ 3×10/sup 14/ ㎝/sup -2/ range. The results could be employed to fabricate SiGe/Si heterostructure field effect transistors with both Schottky contact and MOS structure for gate electrodes. I-V characteristics of 2D P-doped HFETs revealed normal behavior except the detrimental effect of crystalline defects created at SiGe/Si interfaces due to stress relaxation. On the contrary, sharp B-doping technology resulted in significant improvement in DC performance by 20-30 % in transconductance and short channel effect of SiGe HMOS. High peak concentration and mobility in 2D-doped SiGe heterostructures accompanied by remarkable improvements of electrical property illustrate feasible use for nano-sale FETs and integrated circuits for radio frequency wireless communication in particular.