• Journal of the Korean Ceramic Society
• /
• v.31 no.7
• /
• pp.795-803
• /
• 1994

Ferroelectric BaTiO3 thin film was produced using BaTi-ethoxide sol. This sol was prepared from BaTi-ethoxide by a partial hydrolysis with ammonia as a basic catalyst and ethylene glycol as a chelating agent. BaTiO3 thin film was prepared from three continuous spin-coating layers of the sol on bare Si(100) wafer at 2500 rpm followed by pyrolysis at $700^{\circ}C$ for 30 min. After the heat treatment, the film was 0.200$\pm$0.010 ${\mu}{\textrm}{m}$ thick and its grain size was 0.059 ${\mu}{\textrm}{m}$. On the other hand, electrical properties were measured for BaTiO3 thin film separately prepared on Au-deposited silicon wafer. The dielectric constant and loss of the BaTiO3 thin film at room temperature was 150~160 and 0.04 respectively, which was measured at 10 kHz and oscillation level of 0.1 V. In the measurements of the dielectric properties at high temperatures, it was observed that the capacitance of the thin film increases steeply, while the dielectric loss reaches maximum around 1$25^{\circ}C$, which corresponds a phase transition from tetragonal to cubic BaTiO3.

• Journal of the Korean Vacuum Society
• /
• v.2 no.4
• /
• pp.416-423
• /
• 1993

Hydrogen depth profiling was performed by H(19F, $\alpha$${\gamma}$) nuclear resonance reactin . A cesium sputtering ion sorce and 1.7MV Tandem Van de Graaff accelerator was used for the production of 6.5MeV 19F ion. The ${\gamma}$ rays produced by the reaction were measure dby 3" $\times$3" and 6" $\times$8" Nal detectors . A test measurement was done for hydrogen contaminatin layer of a bare silicon wafer, Si3N4(H) and Zr(O)a-Si/Si for the purpose of verifying the applicability , detection limit and the reliability of the method.ility of the method.

• Journal of the Korean institute of surface engineering
• /
• v.46 no.4
• /
• pp.145-152
• /
• 2013

The growth behavior of nanocrystalline diamond (NCD) film has been studied for three different substrates, i.e. bare Si wafer, 1 ${\mu}m$ thick W and Ti films deposited on Si wafer by DC sputter. The surface roughness values of the substrates measured by AFM were Si < W < Ti. After ultrasonic seeding treatment using nanometer sized diamond powder, surface roughness remained as Si < W < Ti. The contact angles of the substrates were Si ($56^{\circ}$) > W ($31^{\circ}$) > Ti ($0^{\circ}$). During deposition in the microwave plasma CVD system, NCD particles were formed and evolved to film. For the first 0.5h, the values of NCD particle density were measured as Si < W < Ti. Since the energy barrier for heterogeneous nucleation is proportional to the contact angle of the substrate, the initial nucleus or particle densities are believed to be Si < W < Ti. Meanwhile, the NCD growth rate up to 2 h was W > Si > Ti. In the case of W substrate, NCD particles were coalesced and evolved to the film in the short time of 0.5 h, which could be attributed to the fact that the diffusion of carbon species on W substrate was fast. The slower diffusion of carbon on Si substrate is believed to be the reason for slower film growth than on W substrate. The surface of Ti substrate was observed as a vertically aligned needle shape. The NCD particle formed on the top of a Ti needle should be coalesced with the particle on the nearby needle by carbon diffusion. In this case, the diffusion length is longer than that of Si or W substrate which shows a relatively flat surface. This results in a slow growth rate of NCD on Ti substrate. As deposition time is prolonged, NCD particles grow with carbon species attached from the plasma and coalesce with nearby particles, leaving many voids in NCD/Ti interface. The low adhesion of NCD films on Ti substrate is related to the void structure of NCD/Ti interface.

• Proceedings of the KIEE Conference
• /
• 1993.07b
• /
• pp.1295-1297
• /
• 1993

Properties of oxynitride films oxidized by $N_2O$ gas after thermal oxidation and $N_2O$ oxide films directly oxidized using $N_2O$ gas on the bare silicon wafer have been studied. Through the AES analysis, Nitrogen pile-up at the interface of Si/oxynitride and Si/$N_2O$ oxide has observed. Also, it could be presumed that there are differences in the mechanism of the growth of film by observing film growth. $N_2O$ oxide and oxynitride films have the self-limited characteristics. Therefore, it will be possible to obtain ultra-thin films. Nitrogen pile-up at the interfaces Si/oxynitride and Si/$N_2O$ oxide strengthens film structure and improves dielectric reliability. Although fixed charge densities and interface trap densities of $N_2O$ oxide and oxynitride films has somewhat higher than those of thermal $SiO_2,\;N_2O$ oxide and oxynitride films showed improved I-V characteristics and constant current stress.

• Journal of Sensor Science and Technology
• /
• v.24 no.4
• /
• pp.264-269
• /
• 2015

An infrared (IR) bolometer measures the change of resistance by absorbing incident IR radiation and generates a signal as a function of the radiation intensity. Since a bolometer requires temperature stabilization and light filtering except for the infrared rays, it is essential for the device to be packaged meeting conditions that above mentioned. Minimization of heat loss is needed in order to stabilize temperature of bolometer. Heat loss by conduction or convection requires a medium, so the heat loss will be minimized if the medium is a vacuum. Therefore, vacuum packaging for bolometer is necessary. Another important element in bolometer packaging is germanium (Ge) window, which transmits IR radiation to heat the bolometer. To ensure a complete transmittance of IR light, anti-reflection (AR) coatings are deposited on both sides of the window. Although the transmittance of Ge window is high for IR rays, it is difficult to use frequently in low-price IR bolometer because of its high price. In this paper, we fabricated IR window by utilizing silicon (Si) substrate instead of Ge in order to reduce the cost of bolometer packaging. To enhance the IR transmittance through Si substrate, it is textured using Reactive Ion Etching (RIE). The texturing process of Si substrate is performed along with the change of experimental conditions such as gas ratio, pressure, etching time and RF power.

• Tribology and Lubricants
• /
• v.18 no.4
• /
• pp.267-272
• /
• 2002

Nano adhesion between SPM(scanning probe microscope) tips and DDPO$_4$(octadecylphosphoric acid ester.) and ODPO$_4$(octadecylphosphoric acid ester) SAM(self-assembled monolayer.) was experimentally studied. Tests were performed to measure the nano adhesion and friction in both AFM(atomic force microscope) and LFM(lateral force microscope) modes with the applied normal load. DDPO$_4$ and ODPO$_4$ SAM were formed on Ti and TiOx surfaces. Ti and TiOx were coated on the Si wafer by ion sputtering. Adhesion and friction of DDPO$_4$ and ODPO$_4$ SAM surfaces were compared with those of OTS(octadecyltrichlorosilane) SAM and DLC surfaces. DDPO$_4$ and ODPO$_4$ SAM converted the Ti and TiOx surfaces to be hydrophobic. When the surface was hydrophobic, the adhesion and friction forces were found lower than those of bare surfaces. Work of adhesion was also discussed to explain how the surface was converted into hydrophobic Results also showed that tribological characteristics of DDPO$_4$ and ODPO$_4$ SAM had good properties in the adhesion, friction, wetting angle and work of adhesion. DDPO$_4$ and ODPO$_4$ SAM could be one of the candidates for the bio-MEMS elements.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.37 no.4
• /
• pp.467-473
• /
• 2013

In this study, two-dimensional finite element models were developed and experiments were conducted using an atomic force microscope to investigate the tribological characteristics of an SU-8 layer coated on a patterned wafer for microsystem applications. The results revealed that both the adhesion and the friction forces measured by the atomic force microscope were lower for the SU-8 coated surface than for the bare silicon surface. This is attributed to the hydrophobicity of SU-8. Another important result derived from the finite element analysis was the critical load required to fracture the SU-8 film with respect to the thickness. The critical loads for thicknesses of 200, 400, and 800 nm were approximately 13, 22, and 28 mN, respectively, which corresponded to a Hertzian contact pressure of 1.2-1.8 GPa. These results will aid in the design of a suitable SU-8 thickness for microsystem components that are in contact with one another.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2002.05a
• /
• pp.207-214
• /
• 2002

Nano adhesion between SPM (scanning probe microscope) tips and $DDPO_{4}$ (dodecylphosphoric acid ester) and $ODPO_{4}$ (octadecylphosphoric acid ester) SAM (self-assembled monolayer) was experimentally studied. Tests were performed to measure the nano adhesion and friction in both AFM(atomic force microscope) and LFM(lateral force microscope) modes with the applied normal load. $DDPO_{4}$ and $ODPO_{4}$ SAM were formed on TiMe and TiOx surfaces. TiMe and TiOx were coated on the Si wafer by ion sputtering. Adhesion and friction of $DDPO_{4}$ and $ODPO_{4}$ SAM surfaces were compared with those of OTS (octadecyltrichlorosilane) SAM and DLC surfaces. $DDPO_{4}$ and $ODPO_{4}$ SAM converted the TiMe and TiOx surfaces to be hydrophobic. When the surface was hydrophobic, the adhesion and friction forces were found lower than those of bare surfaces. Work of adhesion was also discussed to explain how the surface was converted into hydrophobic. Results also showed that tribological characteristics of $DDPO_{4}$ and $ODPO_{4}$ had good properties in the adhesion, friction, wetting angle and work of adhesion. $DDPO_{4}$ and $ODPO_{4}$ SAM could be one of the candidates for the bio-MEMS elements.

• Journal of Powder Materials
• /
• v.22 no.5
• /
• pp.321-325
• /
• 2015

The triboelectric property of a material is important to improve an efficiency of triboelectric generator (TEG) in energy harvesting from an ambient energy. In this study, we have studied the TEG property of a semiconducting $SnO_2$ which has yet to be explored so far. As a counter triboelectric material, PET and glass are used. Vertical contact mode is utilized to evaluate the TEG efficiency. $SnO_2$ thin film is deposited by atomic layer deposition on bare Si wafer for various thicknesses from 5.2 nm to 34.6 nm, where the TEG output is increased from 13.9V to 73.5V. Triboelectric series are determined by comparing the polarity of output voltage of 2 samples among $SnO_2$, PET, and glass. In conclusion, $SnO_2$, as an intrinsic n-type material, has the most strong tendency to be positive side to lose the electron and PET has the most strong tendency to be negative side to get the electron, and glass to be between them. Therefore, the $SnO_2$-PET combination shows the highest TEG efficiency.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1998.02a
• /
• pp.179-179
• /
• 1998

실리콘 집적회로 제조시 sub-micron 의 contact 형성 공정은 질연막 형성 후 이의 식각 및 세정, c contact 실리사이드, 획산방지막, 배선 금속층의 형성 과정올 거치게 된다. 본 연구팀에서는 C.F야f2 헬리 콘 플라즈마훌 이용한 고선택비 contact 산화막 식각공정시 형성된 잔류막충과 오염 손상올 관찰하고 산소 플라즈마 처리와 후속 열처리에 따른 이들의 제거 정도를 관찰하여 이에 대한 결과를 발표하였다. 본 연구메서는 식각 및 후처리에 따라 잔류하는 잔류막과 손상층이 후속 공정인 contact 실리사이드 형 섬에 미치는 영향올 관찰하였다. C C.F바f2 웰리콘 풀라즈마률 이용한 식각시 공정 변수로는 수소가스 첨가, bias voltage 와 과식각 시간 의 효과를 관찰하였으며 다른 조건은 일정하게 하였다 .. Contact 실리사이드로는 Ti, Co-싫리사이드를 선 택하였으며 Piranha cleaning, 산소 플라즈마 처리, 산소 풀라즈마+600 'C annealing으로 각각 후처리된 시 편을 후처리하지 않은 시펀돌과 함께 실리사이드 형성용‘시펀으로 이용하였다 각각 일정 조건에서 동 일 두께의 실리사이드훌 형성시킨 후 4-point probe룰 이용하여 면저황올 측정하였다 후처리하지 않은 시편의 경무 실리사이드 형성은 아주 시펀의 일부분에서만 형성되었으며 후속 세정 및 얼처리훌 황에 따라 실리사이드의 면저항은 감소하여 식각 과정을 거치지 않은 깨끗한 실리콘 웨이퍼위에 실리사이드 를 형성시킨 값(control 값)에 접근하였다. 실리사이드의 면저항값은 식각시 노훌된 실리콘 표면 위에 형 성된 손상충보다는 잔류막에 큰 영향을 받았으며 수소 가스가 첨가된 식각 가스로 식각한 시편으로 형 성한 실리사이드의 면저항값이 손상이 상대적으로 적은 것으로 관찰된 수소훌 첨가하지 않은 식각 가 스로 식각한 시펀 위에 형성된 실리사이드의 면저황에 비해 낮은 값을 나타내었다. 실리사이드의 전기적 륙성에 미치는 손상층의 영향올 좀더 면밀히 관찰하고자 bare 실리콘 wafer 에 잔류막이 거의 없이 손상층을 유발시키는 식각 조건들 (100% HBr, 100%H2, 100%Ar, Cl싸fz)에 대하여 실 리콘 식각을 수행한 후 Co-실리사이드률 형성하여 이의 면저황을 측정한 걸과 100% Ar 가스로 식각된 시편을 이용하여 형성한 실리사이드의 면저항은 control 에 기까운 면저항값올 지니고 따라서 손상층이 실리사이드 형섬메 미치는 영향은 크지 않음을 알 수 있었다. 이상의 연구 결과훌 통해 손상층이 실리사이드의 형성이나 전기적 톡섬에 미치는 영황은 잔류막층 에 의한 영향보다 적다는 것을 알 수 았으며 잔류막층의 두께보다는 성분이나 걸합상태, 특히 식각 및 후처리 후 잔류하는 탄소 싱분과 C-Si 결함에 큰 영향올 받는 것올 알 수 있었다.