• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.53-57
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• 2013

Sn-3.0Ag-0.5Cu 무연솔더에서 Ag 함량의 감소는 기계적 충격 신뢰성 향상에 도움이 되는 반면 솔더링성을 저하시키는 것으로 알려져 있다. 본 연구에서는 저 Ag함유 무연솔더의 솔더링성 향상을 위해 In을 첨가한 Sn-1.2Ag-0.7Cu-0.4In 4원계 조성과 여기에 미량의 Mn 및 Pd을 첨가한 무연솔더 조성에 대하여 솔더 젖음성을 평가하고, 보드 레벨 BGA 패키지의 열싸이클링 및 기계적 충격 신뢰성을 평가하였다. Sn-1.2Ag-0.7Cu 조성에 0.4 wt% In을 첨가한 합금의 젖음성은 Sn-3.0Ag-0.5Cu에 근접한 수준으로 향상되었으나, 패키지의 열싸이클링 신뢰성은 Sn-3.0Ag-0.5Cu에 미치지 못하는 것으로 나타났다. Sn-1.2Ag-0.7Cu-0.4In 조성에 0.03 wt% Pd의 첨가는 솔더 젖음성 및 패키지 신뢰성을 저하시킨 반면에 0.1 wt% Mn을 첨가한 합금은 특히 기계적 충격 신뢰성이 Sn-3.0Ag-0.5Cu는 물론 Sn-1.0Ag-0.5Cu보다도 우수한 수준으로 향상되었는데, 이는 Mn 첨가가 합금의 모듈러스를 감소시킨 데에 기인하는 것으로 생각된다.

• 한국군사과학기술학회지
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• 제20권1호
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• pp.98-107
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• 2017

Electric components equipped with naval shipboards must endure mechanical shock caused by various mechanical impulsive sources. Thus the components must be designed carefully and reliability test is an essential procedure before use. In this study, a new design technology applicable to a large and heavy shock generation system which can generate various specific real mechanical shocks in specified time domain was introduced. Commonly, the shock transmitted through the wall of naval shipboard consists of dual shocks. The primary shock is of a very high amplitude and very short period half-sine form. The following shock is of an exponentially decaying harmonic form of relatively longer period. Based on the different dynamic characteristics of two shocks, we proposed a sequential design procedure to determine spring and damping coefficients of the generation system. Some numerical simulation results showed the feasibility of the proposed method.

• 산업경영시스템학회지
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• 제34권1호
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• pp.90-96
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• 2011

The shock absorber base assembly is one of the parts in the shock absorber equipment that controls the vehicle movement. It absorbs the shock and vibration to guarantee riding stability and comfort. It demands strength, reliability and strict airtightness of the welded section because the shock absorber base assembly is a container which resists pressure and needs durability by being filled with gas and oil. However, the current engineering needs a lot of production time, has a high cost and shows a low production rate. These problem due to the eight production processes, four of which are spot welding, reinforcement welding like metal active welding (MAG), prior process of the base assembly cap and tube for precision and pressing. We will analyze the manufacturing processes of the base assembly and suggest an improved manufacturing method that uses frictional welding. The results will show that the new method of the frictional welding is better than the previous welding technique. Through the use of this concept of frictional welding, the welding conjunction will be strengthened, measurements will be more precise, and the cost and the number of processes will be reduced.

• 한국정밀공학회지
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• 제23권7호
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• pp.130-137
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• 2006

TFT-LCD(Thin Film Transistor Liquid Crystal Display) module is representative commercial product of FPD(Flat Panel Display). Thickness of TFT-LCD module is very thin. It is adopted for major display unit for IT devices such as Cellular Phone, Camcorder, Digital camera and etc. Due to the harsh user environment of mobile IT devices, it requires complicated structure and tight assembly. And user requirements for the mechanical functionalities of TFT-LCD module become more strict. However, TFT-LCD module is normally weak to high level transient mechanical shock. Since it uses thin crystallized panel. Therefore, anti-shock performance is classified as one of the most important design specifications. Traditionally, the product reliability against mechanical shock is confirmed by empirical method in the design-prototype-drop/impact test-redesign paradigm. The method is time-consuming and expensive process. It lacks scientific insight and quantitative evaluation. In this article, a systematic design evaluation of TFT-LCD module for mobile IT devices is presented with combinations of FEA and testing to support the optimal shock proof display design procedure.

• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• 한국신뢰성학회지:신뢰성응용연구
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• 제13권3호
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• pp.207-216
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• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

• 한방재활의학과학회지
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• 제30권2호
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• pp.95-103
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• 2020

Objectives This report aimed to review literatures using extracorporeal shock wave with syndrome differentiation theory. Methods By March 3, 2020, five foreign electronic databases (PubMed, Web of Science, Cochrane Library, EMBASE, CAJ) and six Korean medical electronic databases (KMBASE, KISTI, KISS, NDSL, DBpia, RISS) were reviewed with the key word 'extracorporeal shock wave' and 'syndrome differentiation'. We did not impose restrictions on age, gender, treatment methods, duration, results and the design of the paper. Results Twelve papers met the inclusion criteria. Seven papers used extracorporeal shock wave lithotripsy with syndrome differentiation theory and six out of seven papers treated urologic stones using extracorporeal shock wave lithotripsy. The other five papers used extracorporeal shock wave therapy with syndrome differentiation theory and four of them treated musculoskeletal disorders. However, the data of the characteristics of extracorporeal shock wave was insufficient. Conclusions After thorough review, it is considered to be meaningful to treat urologic stones and musculoskeletal disorders using extercorporeal shock wave with syndrome differentiation theory. However, some of the literatures were limited in their feasibility and reliability in terms of research design. In addition, the data regarding the strength of the extracorporeal shock wave applied on each acupoints was insufficient. Therefore, further study on the use of extracorporeal shock wave on acupoints should be conducted.

• 전기학회논문지
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• 제66권7호
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• pp.1155-1161
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• 2017

This study examines environmental performance of the arcing measurement module according to international standards. The module assesses the collected current performance using a computer system. The module is required to assess environmental impact resulting from electromagnetic waves, shock and temperature change during train operation. The test includes testing EMI/EMC, vibration, shock and temperature cycling for interface between trains and the arcing measurement module. The module test items were determined in compliance with the standards suggested by the International Electrotechnical Commission (IEC) and Europaische Norm (EN). This study describes the method of test, test equipment operation and how to choose relevant performance standards. The analysis and test results of environmental performance for the module based on computer system are described in this study.

• International Journal of Reliability and Applications
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• 제17권2호
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• pp.107-119
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• 2016

A new concept of aging classes namely new better (worse) than used at age $t_0$ in moment generating function order, $NBU_{mgf}-t_0$ ($NWU_{mgf}-t_0$) is introduced. For the classes $NBU_{mgf}-t_0$ ($NWU_{mgf}-t_0$), preservation under convolution, mixture, mixing and the homogeneous Poisson shock model are studied. In the sequel, nonparametric test is proposed, the asymptotic normality of the class is established and the asymptotic null variance is estimated. The percentiles and powers of this test are tabulated. The asymptotic efficiencies for some alternatives distributions are derived. Finally sets of real data are used as examples to elucidate the use of the proposed test in practical application.

• 한국신뢰성학회지:신뢰성응용연구
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• 제14권4호
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• pp.236-242
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• 2014

Since permanent magnet coupling transfers power by magnetic force without contact, it has little shock, vibration, noise. In case of overload, it protects a pump or a motor which is relatively important by slipping internally. In this study, failure analysis and test evaluation on the permanent magnet coupling have been proposed and the process that reliability of the product improves through design improvement has been presented. And failure cause of typical failure case has been investigated and improvement plan has been presented. Finally, reliability improvement is established by analysis of the test results of before and after acceleration test.