• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.13-18
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• 2004

전력계통 분야에서는 HVDC 전력변환소, BTB, UPFC 및 SVC의 안정성 향상 및 안정적인 운용을 위한 체계적인 유지보수 및 관리가 필요하다. 특히 전력계통에 접속된 대용량 전력반도체 소자인 사이리스터 밸브는 운전중에 열적, 전기적인 스트레스를 받게 되며, 이로 인해 밸브의 수명이 감소하여 전력계통의 안정적인 운용을 어렵게 만드는 요인이 된다. 따라서 전력계통 운용의 안정성을 확보하기 위해서는 대용량 사이리스터 밸브의 열적, 전기적 스트레스에 따른 수명 변화를 예측하는 열화진단 기법의 개발이 중요하다. 본 고에서는 대용량 사이리스터 소자의 열화진단 기법에 대한 국내외 현황과 현재 연구가 진행중인 열화 진단 기법에 대해 서술하였으며, 1500V급 사이리스터 소자의 가속열화 실험을 통해 소자의 수명을 예측한 결과를 나타내었다.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.8
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• pp.1547-1554
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• 2011

As process parameters scale, interconnect width are reduced rapidly while the current flowing through interconnects does not decrease in a proportional manner. This effect increases current density in metal interconnects which may result in poor reliability. Since RMS(root-mean-square) current limits are used to evaluate self-heating and short-time stress failures caused by high-current pluses, RMS current estimation is very important to guarantee the reliability of semiconductor systems. Hence, it is critical to estimate the current limits through interconnects earlier in semiconductor design stages. The purpose of this paper is to propose a fast, yet accurate RMS current estimation technique that can offer a relatively precise estimate by using closed-form equations. The efficiency and accuracy of the proposed method have been verified through simulations using HSPICE for a vast range of interconnect parameters.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.8
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• pp.1406-1415
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• 2010

As process technology for semiconductor goes beyond the ultra-deep submicrometer regime, interconnect reliability on a chip has become a serious design concern. As process parameters scale, interconnect widths are reduced rapidly while the current flowing through the interconnect does not decrease in a proportional manner. This trend increases current densities in metal interconnects which may lead to poor reliability for electromigration. Hence, it is critical to estimate the current amount passing through the interconnects earlier in semiconductor design stages. The purpose of this paper is to propose a fast yet accurate current estimation technique that can offer not only analysis time equivalent to those offered by the previous approximation methods but also a relatively precise estimation by using closed-form equations. The accuracy of the proposed technique was confirmed to be about 8 times better on average when compared to the previous work.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.5
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• pp.507-511
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• 2024

Various process modifications have been used to minimize SiO₂ gate oxide aging in metal-oxide-semiconductor field-effect transistors (MOSFETs). In particular, post-metallization annealing (PMA) with a deuterium ambient can effectively eliminate both bulk traps and interface traps in the gate oxide. However, even with the use of PMA, it remains difficult to prevent high levels of radiation-induced gate oxide damage such as total ionizing dose (TID) during long-term missions. In this context, additional low-temperature heat treatment (LTHT) is proposed to recover from radiation-induced damage. Positive traps in the damaged gate oxide can be neutralized using LTHT, thereby prolonging device reliability in harsh radioactive environments.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.98.1-98
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• 1998

• Aerospace Engineering and Technology
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• v.1 no.2
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• pp.173-178
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• 2002

Traditionally, for space program whose operation environment is severe, high reliability parts, that is class s microcircuit, JANS level semiconductor, and ER passive parts, are reliable choices. But in some case, we must use 'Non-standard Part' which is not verified as high reliability standard part. To use 'Non-standard Part' in space application, the manufacturer should qualify the part and screen potential week part from the flight lot. In this technical memo, I introduce the flight part verification process for KOMPSAT 1 and KOMPSAT 2 program.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.141-145
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• 2021

The brightness of the Organic Light Emitting Diode (OLED) display is controlled by thin-film transistors (TFTs). Regardless of the materials and the structures of TFTs, an OLED suffers from the instable threshold voltage (V_th) of a TFT during operation. When designing an OLED pixel with circuit simulation tool such as SPICE, a designer needs to take V_th shift into account to improve the reliability of the circuit and various compensation methods have been proposed. In this paper, the effect of the compensation circuits from two typical OLED pixel circuits proposed in the literature are studied by the transient simulation with a SPICE tool in which the stretched-exponential time dependent V_th shift function is implemented. The simulation results show that the compensation circuits improve the reliability at the beginning of each frame, but V_th shifts from all TFTs in a pixel need to be considered to improve long-time reliability.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.112-117
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• 2020

NAND flash memory is a non-volatile memory that retains stored data even without power supply. Internal memory used as a data storage device and solid-state drive (SSD) is used in portable devices such as smartphones and digital cameras. However, NAND flash memory carries the risk of electric shock, which can cause errors during read/write operations, so use error correction codes to ensure reliability. It efficiently recovers bad block information, which is a defect in NAND flash memory. BBT (Bad Block Table) is configured to manage data to increase stability, and as a result of experimenting with the error correction code algorithm, the bit error rate per page unit of 4Mbytes memory was on average 0ppm, and 100ppm without error correction code. Through the error correction code algorithm, data stability and reliability can be improved.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.85-90
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• 2022

In this paper, an asynchronous nonvolatile memory module using a self-diagnosis function was designed. For the system to work, a lot of data must be input/output, and memory that can be stored is required. The volatile memory is fast, but data is erased without power, and the nonvolatile memory is slow, but data can be stored semi-permanently without power. The non-volatile static random-access memory is designed to solve these memory problems. However, the non-volatile static random-access memory is weak external noise or electrical shock, data can be some error. To solve these data errors, self-diagnosis algorithms were applied to non-volatile static random-access memory using error correction code, cyclic redundancy check 32 and data check sum to increase the reliability and accuracy of data retention. In addition, the possibility of application to an asynchronous non-volatile storage system requiring reliability was suggested.

• Journal of the Korean institute of surface engineering
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• v.57 no.3
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• pp.208-213
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• 2024

With the development of industry, miniaturization and densification of semiconductor components are rapidly progressing. Particularly, as demand surges across various sectors, efficiency in productivity has emerged as a crucial issue in semiconductor component manufacturing. Maximizing semiconductor productivity requires real-time monitoring of semiconductor processes and continuous reflection of the results to stabilize processes. However, various unexpected variables and errors in judgment that occur during the process can cause significant losses in semiconductor productivity. Therefore, while the development of a reliable manufacturing system is important, the importance of developing sensor technology that can complement this and accurately monitor the process is also growing. In this study, conducted a basic research on the concept of diagnostic sensors for thickness based on the physical changes of thin films due to etching. It observed changes in resistance corresponding to variations in thin film thickness as etching processes progressed, and conducted research on the correlation between these physical changes and thickness variations. Furthermore, to assess the reliability of thin film thickness measurement sensors, it conducted multiple measurements and comparative analyses of physical changes in thin films according to various thicknesses.