Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)

Materials Research Society of Korea (한국재료학회)
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A STUDY ON HIGH RELIABILITY BGA PACKAGE WITH OVAL TYPE SOLDER BALL LAND DESIGN

  • Kim, S.J. (Design & Simulation Team, R&D Center, Anam Semiconductor Inc.) ;
  • Lee, S.G. (Design & Simulation Team, R&D Center, Anam Semiconductor Inc.) ;
  • Lee, C.H. (Design & Simulation Team, R&D Center, Anam Semiconductor Inc.)
  • Published : 1998.08.01
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Abstract

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