• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.96-96
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• 2007

Low voltage organic TFTs (OTFTs) and ZnO based TFTs (<5V), utilizing room temperature deposited $Bi_{1.5}Zn_{1.0}Nb_{1.5}O_7$ (BZN) thin films were recently reported, pointing to high-k gate insulators as a promising route for realizing low voltage operating flexible electronics. $Bi_{1.5}Zn_{1.0}Nb_{1.5}O_7$ (BZN) thin film is one of the most promising materials for gate insulator because of its large dielectric constant (~60) at room temperature. However their tendency to suffer from relatively high leakage current at low electric field (>0.3MV/cm) hinder the application of BZN thin films for gate insulator. In order to improve leakage current characteristics of BZN thin film, we mixed 30mol% MgO with 70mol% BZN and their dielectric and electric properties were characterized. We fabricated field-effect transistors with transparent oxide semiconductor ZnO serving as the electron channel and high-k $(Bi_{1.5}Zn_{1.0}Nb_{1.5}O_7)_{0.7}(MgO)_{0.3}$ as the gate insulator. The devices exhibited low operation voltages (<4V) due to high capacitance of the $(Bi_{1.5}Zn_{1.0}Nb_{1.5}O_7)_{0.7}(MgO)_{0.3}$ dielectric.

• Journal of Electrical Engineering and Technology
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• v.11 no.4
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• pp.939-942
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• 2016

One of the most important characteristic curves of a solar cell is its current density-voltage (J-V) curve under AM1.5G insolation. Solar cell can be considered as a semiconductor diode, so a diode equivalent model was used to estimate its parameters from the J-V curve by numerical simulation. Active layer plays an important role in operation of a solar cell. We investigated the effect thicknesses and defect densities (N_d) of the active layer on the J-V curve. When the active layer thickness was varied (for N_d = 8×10¹⁷ cm^-3) from 800 nm to 100 nm, the reverse saturation current density (J_o) changed from 3.56×10^-5 A/cm² to 9.62×10^-11 A/cm² and its ideality factor (n) changed from 5.28 to 2.02. For a reduced defect density (N_d = 4×10¹⁵ cm^-3), the n remained within 1.45≤n≤1.92 for the same thickness range. A small increase in shunt resistance and almost no change in series resistance were observed in these cells. The low reverse saturation current density (J_o = 9.62×10^-11 A/cm²) and diode ideality factor (n = 2.02 or 1.45) were observed for amorphous silicon based solar cell with 100 nm thick active layer.

• Journal of the Korean Vacuum Society
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• v.20 no.3
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• pp.165-175
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• 2011

This paper introduces statistical features observed from measured batch data from the multiple operation state variables of dry vacuum pumps running in the semiconductor processes. The amplitude distribution characteristics of such state variables as inlet pressures, supply currents of the booster and dry pumps, and exhaust pressures are shown to be divided into two or three distinctive regions. This observation gives an idea of using an adaptive parametric model (APM) chosen to describe their statistical features. This modelling, in comparison to the traditional dynamic time wrapping algorithm, is shown to provide superior performance in computation time and memory resources required in the preprocessing stage of sampled batch data for the diagnosis of running dry vacuum pumps. APM model-based batch data are demonstrated to be very appropriate for monitoring and diagnosing the running conditions of dry vacuum pumps.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.180-180
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• 2010

Thin film transistors (TFTs) based on oxide semiconductors have emerged as a promising technology, particularly for active-matrix TFT-based backplanes. Currently, an amorphous oxide semiconductor, such as InGaZnO, has been adopted as the channel layer due to its higher electron mobility. However, accurate and repeatable control of this complex material in mass production is not easy. Therefore, simpler polycrystalline materials, such as ZnO and $SnO_2$, remain possible candidates as the channel layer. Inparticular, ZnO-based TFTs have attracted considerable attention, because of their superior properties that include wide bandgap (3.37eV), transparency, and high field effect mobility when compared with conventional amorphous silicon and polycrystalline silicon TFTs. There are some technical challenges to overcome to achieve manufacturability of ZnO-based TFTs. One of the problems, the stability of ZnO-based TFTs, is as yet unsolved since ZnO-based TFTs usually contain defects in the ZnO channel layer and deep level defects in the channel/dielectric interface that cause problems in device operation. The quality of the interface between the channel and dielectric plays a crucial role in transistor performance, and several insulators have been reported that reduce the number of defects in the channel and the interfacial charge trap defects. Additionally, ZnO TFTs using a high quality interface fabricated by a two step atomic layer deposition (ALD) process showed improvement in device performance In this study, we report the fabrication of high performance ZnO TFTs with a $Si_3N_4$ gate insulator treated using plasma. The interface treatment using electron cyclotron resonance (ECR) $O_2$ plasma improves the interface quality by lowering the interface trap density. This process can be easily adapted for industrial applications because the device structure and fabrication process in this paper are compatible with those of a-Si TFTs.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.239-243
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• 1999

At Present, 200mm wafer technology is being applied for commercial fabrications of 64, 128, and 256 M DRAM devices, and 300mm technology will be evolved for 1G DRAM devices in the early 21th century, recognizing limitations of several process technologies. In particular recognition has been realized in harmful effects of surface contamination of trace metals introduced during devicing processes. Such a guide line for surface metal contamination has been proposed as 1E9 and 1E10 atoms/$\textrm{cm}^2$ of individual metal contamination for wafering and devicing of 1G DRAM, respectively, and so its measurement limit should be at least 1E8 atoms/$\textrm{cm}^2$. The detection limit of present measurement systems is 2E9 atoms/$\textrm{cm}^2$ obtainable with TRXFA(Total Reflection X-Ray Fluorescence Analysis). TRXFA is nondestructive and the simplest in terms of operation, and it maps the whole wafer surfaces but needs detection improvement. X-Ray intensity produced with synchrotron accelerator is much higher than that of conventional X-ray sources by order of 4-5 magnitudes. Hence theoretically its reactivity with silicon surfaces is expected to be much higher than the conventional one, realizing improvement of detection limit. X-ray produced with synchrotron accelerator is illuminated at a very low angle with silicon wafer surfaces such as 0.1 degree and reflects totally. Hence informations only from surface can be collected and utilized without overlapping with bulk informations. This study shows the total reflection phenomenon and quantitative improvement of detection limit for metallic contamination. It is confirmed that synchrotron X-ray can be a very promising alternative for realizing improvement of detection limit for the next generation devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.255-255
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• 2010

Recently, nonvolatile memories (NVM) of various types have been researched to improve the electrical performance such as program/erase voltages, speed and retention times. Also, the charge trap memory is a strong candidate to realize the ultra dense 20-nm scale NVM. Furthermore, the high charge efficiency and the thermal stability of SiC nanocrystals NVM with single $SiO_2$ tunnel barrier have been reported. [1-2] In this study, the SiC charge trap NVM was fabricated and electrical properties were characterized. The 100-nm thick Poly-Si layer was deposited to confined source/drain region by using low-pressure chemical vapor deposition (LP-CVD). After etching and lithography process for fabricate the gate region, the $Si_3N_4/SiO_2/Si_3N_4$ (NON) and $SiO_2/Si_3N_4/SiO_2$ (ONO) barrier engineered tunnel layer were deposited by using LP-CVD. The equivalent oxide thickness of NON and ONO tunnel layer are 5.2 nm and 5.6 nm, respectively. By using ultra-high vacuum magnetron sputtering with base pressure 3x10-10 Torr, the 2-nm SiC and 20-nm $SiO_2$ were successively deposited on ONO and NON tunnel layers. Finally, after deposited 200-nm thick Al layer, the source, drain and gate areas were defined by using reactive-ion etching and photolithography. The lengths of squire gate are $2\;{\mu}m$, $5\;{\mu}m$ and $10\;{\mu}m$. The electrical properties of devices were measured by using a HP 4156A precision semiconductor parameter analyzer, E4980A LCR capacitor meter and an Agilent 81104A pulse pattern generator system. The electrical characteristics such as the memory effect, program/erase speeds, operation voltages, and retention time of SiC charge trap memory device with barrier engineered tunnel layer will be discussed.

• The Journal of the Korea institute of electronic communication sciences
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• v.14 no.3
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• pp.619-626
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• 2019

The advances of semiconductor and circuitry technology dovetailed with nano processing techniques have further enhanced micro-miniaturization, sensitivity, longevity and reliability in MID(Medical Implant Device). Nevertheless, one of the remaining challenges is whether power can sufficiently and continuously be supplied for the operation of the MID. Self-powered MID that harvest biomechanical energy from human motion, respiratory and muscle movement are part of a paradigm shift. In this paper, we developed a rechargeable pacemaker through self-power generation with the triboelectric nanogenerator. We demonstrate a fully implanted pacemaker based on an implantable triboelectric nanogenerator, which act as a storage as well as active movement on a large-animal(dog) scale. The self-power pacemaker harvested from animal motion is 2.47V, which is higher than the required pacemaker device sensing voltage(1.35V).

• Journal of IKEEE
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• v.24 no.4
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• pp.1058-1063
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• 2020

This paper proposes a 12-bit SAR A/D(Successive Approximation Register Analog-to-Digital) converter that operates at low power for bio-signal and sensor signal processing. The conventional SAR A/D converter utilized the reduction of the dynamic current, which resulted in reducing total power consumption. In order to solve the limitation of the sampling time due to charging/discharging of the capacitor for reducing dynamic current, the different sampling time on the C-DAC bit switch operation was applied to reduce the dynamic current. In addition, lowering the supply voltage of the digital block to 0.6V led to 70% reduction of the total power consumption of the proposed ADC. The proposed SAR A/D was implemented with CMOS 65nm process 1-poly 6-metal, operates with a supply voltage of 1.2V. The simulation results demonstrate that ENOB, DNL/INL, power consumption and FoM are 10.4 bits, ±0.5LSB./±1.2LSB, 31.2uW and 2.8fJ/step, respectively.

• Journal of IKEEE
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• v.24 no.4
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• pp.1074-1080
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• 2020

This paper proposes a digitally controlled buck converter insensitive to process, voltage and temperature and capable of three modes of operation depending on the state of the output voltage. Conventional digital-controlled buck converters utilized A/D converters, counters and delay line circuits for accurate output voltage control, resulting in increasing the number of counter and delay line bits. This problem can be resolved by employing the 8-bit and 16-bit bidirectional shift registers, and this design technique leads a buck converter to be able to control duty ratio up to 128-bit resolution. The proposed buck converter was designed and fabricated with a CMOS 180 nano-meter 1-poly 6-metal process, generating an output voltage of 0.9 to 1.8V with the input voltage range of 2.7V to 3.6V, a ripple voltage of 30mV, and a power efficiency of up to 92.3%. The transient response speed of the proposed circuit was measured to be 4us.

• Asia-Pacific Journal of Business
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• v.10 no.4
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• pp.49-63
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• 2019

The export regulation of semiconductor core materials, which began with the recent revision of the export management regulations of Japan, raises the need for a new cooperation network. A hierarchical management network that was effective in the fast-follower system requires organic cooperation between the public sector and industry through a multilateral network that emphasizes horizontal co-operation among innovation actors. This study focused on the relational capital that exists among members of a business association such as an association that has been relatively marginalized from previous studies. In addition, this study aimed to analyze the effect of network activity characteristics such as industry-university linkage and informal exchange on technological innovation. Through this, I would like to draw implications for enhancing the effectiveness of the government's R & D support and innovation performance of R & D companies. Based on the results of the SMEs R & D survey, this study found that relational capital, informal exchange had a positive effect on technological innovation performance. However, if the relational capital exceeds a certain level, it is analyzed that there is a negative effect due to group think and lock-in effect. This means that informal exchange channels should be expanded for innovation and enhancement, and relational capital should be managed in consideration of the negative effects that may occur when certain levels are exceeded.