• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.110-111
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• 2006

이중 에피층을 가지는 SOI (Silicon-On-Insulator) RESURF(REduced SURface Field) LIGBT(Lateral Insulated Gate Bipolar Transistor) 소자의 에피층 두께에 따른 항복전압 특성을 분석하였다. 이중 에 피층 구조를 가지는 SOI RESURF LIGBT 소자는 전하보상효과를 얻기 위해 기존 LIGBT 소자의 n 에피로 된 영역을 n/p 에피층의 이중 구조로 변경한 소자로 n/p 에피층 영역내의 전하간 상호작용에 의해 에피 영역 전체가 공핍됨으로써 높은 에피 영역농도에서도 높은 항복전압을 얻을 수 있는 소자이다. 본 논문에서는 LIGBT 에피층의 전체 두께와 농도를 고정한 상태에서 n/p 에피층의 두께가 변하는 경우에 항복전압 특성의 변화에 대해 simulation을 통해 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2009.02a
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• pp.121.1-121.1
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• 2009

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.133.3-133
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.05a
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• pp.27-27
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• 1997

• Journal of Semiconductor Engineering
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• v.1 no.1
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• pp.46-56
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• 2020

This article highlights new opportunities of inorganic semiconductor materials for bio-implantable electronics, as a subset of 'transient' technology defined by an ability to physically dissolve, chemically degrade, or disintegrate in a controlled manner. Concepts of foundational materials for this area of technology with historical background start with the dissolution chemistry and reaction kinetics associated with hydrolysis of nanoscale silicon surface as a function of temperature and pH level. The following section covers biocompatibility of silicon, including related other semiconductor materials. Recent transient demonstrations of components and device levels for bioresorbable implantation enable the future direction of the transient electronics, as temporary implanters and other medical devices that provide important diagnosis and precisely personalized therapies. A final section outlines recent bioresorbable applications for sensing various biophysical parameters, monitoring electrophysiological activities, and delivering therapeutic signals in a programmed manner.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.103.2-103
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.98.1-98
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• 1998

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.3
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• pp.241-252
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• 2024

With the recent development of emerging technologies, information acquisition and delivery between users has been actively conducted, and inorganic thin film transfer technology that effectively transfers various materials and devices is being studied to develop flexible electronic devices accordingly. This is aimed at innovative structural changes and functional improvement of electronic devices in the era of the Internet of Things (IoT). In particular, advanced technologies such as microLEDs are used to realize high-resolution flexible displays, and the possibility of heterogeneous integrated technologies can be presented by precisely transferring materials to substrates through various transfer process. This paper introduced physical, chemical, and self-assembly transfer methods based on inorganic thin film materials to implement heterogeneous integrated flexible semiconductor systems and introduces the results of application studies of semiconductor devices obtained through different transfer technologies. These studies are expected to bring about innovative changes in the field of smart devices, medical technology, and user interfaces in the future.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.162.1-162
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• 2003

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.1 no.1
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• pp.17-25
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• 1991

The construction details of VGF apparatus with a DM(direct monitoring) furnace for the growth of low defect crystal and characteristics of GaAs crystal grown by this apparatus are described. The average dislocation densities and EL2 concentration of as-grown undoped GaAs along the different solidified fractions exhibit $4{\times}10^{2}-7{\times}10^{3}cm^{-2}$ and $6{\times}10^{14}-4{\times}10^{15}cm^{-3}$, which are less than those observed for liquid encapsulated Czochralski(LEC) or high-pressure vertical gradient freeze(VGF) crystals. These remarkable reduction of the dislocation densities and EL2 concentrations were explained by the lower temperature gradient ($dT/dx-10^{\circ}/cm$) and slower rates of post - growth cooling ($20^{\circ}C/hr:1240-1000^{\circ}C,\;30^{\circ}C/hr:1000-700^{\circ}C$). Also, The Hall mobilities, carrier concentrations show uniform distribution throughtout 80% of the ingot length.