• Journal of the Korean Graphic Arts Communication Society
• /
• v.28 no.1
• /
• pp.51-63
• /
• 2010

Ink-jet is part of the non impact printing that shooting the ink drop from the nozzle to paper. It is very silence and express good color. There are two types of printing that continuous and drop on demand. But drop on demand process is becoming the mainstream. these days, LCD, PDP is passed more than semiconductor industry. And we expect organic EL, FED as a next display. But product equipment, main component and technology have a gap between an advanced country and us nevertheless physical development. Expecially, previous process part is depended on imports. Ink-jet printing technology that there isn't complicated photo lithography process is attracted, so ink-jet printing resolution is more embossed. But there were not many of ink-jet resolution thesis but ink-jet head or nozzle. Because, to out of the ink from the nozzle is unseeable and hard to experiment. Therefore this thesis was experimented and simulated how can ink-jet printer improved resolution by flow-3d simulation package program.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.1380-1383
• /
• 2004

The scanning type XY stage is frequently used these days as precision positioning system in equipment for semiconductor or display element. It is requested higher velocity and more precise accuracy for higher productivity and measuring performance. The position accuracy of general stage is primarily affected by the geometric errors caused by parasitic motion of stage, misalignments such as perpendicular error, and thermal expansion of structure. In the case of scanning type stage, H type frame is usually used as base stage which is driven by two actuators such as linear motor. In the point view of scanning process, the stage is used in moving motion. Therefore, dynamic variation is added as significant position error source with other parasitic motion error. Because the scanning axis is driven by two actuators with two position detectors, 2 dimensional position errors have different characteristic compared to general tacked type XY stage. In this study 2D position error of scanning stage is analyzed by 1D heterodyne interferometer calibrator, which can measure 1D linear position error, straightness error, yaw error and pitch error, and perpendicular error. The 2D position error is evaluated by diagonal measurement (ISO230-6). The yaw error and perpendicular error are compensated on the base stage of scanning axis. And, the horizontal straightness error is compensated by cross axis compensation. And, dynamic motion error in scanning motion is analyzed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.04b
• /
• pp.1-5
• /
• 2000

As the semiconductor devices are miniaturized, the number of the unit cleaning processes increases. In order to processes by conventional RCA cleaning process, the consumption of volume of liquid chemical and DI water became huge. Therefore, the problem of environmental issues are evolved by the increased consumption of chemicals. To resolve this matter, an advanced cleaning process by Electrolyzed Water was studied in this work. The electrolyzed water was made by an electrolysis equipment which was composed of three chambers of anode, cathode, and middle chambers. In the case of electrolyzed water with electrolytes in the middle chamber, oxidatively acidic water of anode and reductively alkaline water of cathode were obtained. The oxidation/reduction potentials and pH of anode water and cathode water were measured to be +l000mV and 4.8, and -530mV and 6.3, respectively. The Si-wafers contaminated with metallic impurities were cleaning with the electrolyzed water. To analysis the amounts of metallic impurities on Si-water surfaces, ICP-MS(Inductively Coupled Plasma-Mass spectrometer) was introduced. From results of ICP-MS measurements, it was concluded that the ability of electrolyzed water was equivalent to that of the conventional RCA cleaning.

• Journal of electromagnetic engineering and science
• /
• v.13 no.1
• /
• pp.54-61
• /
• 2013

An equivalent model has been developed to estimate the electromagnetic immunity for integrated circuits under a complex electromagnetic environment. The complete model is based on the characteristics of the equipment and physical configuration of the device under test (DUT) and describes the measurement setup as well as the target integrated circuits under test, the corresponding package, and a specially designed printed circuit board. The advantage of the proposed model is that it can be applied to a SPICE-like simulator and the immunity of the integrated circuits can be easily achieved without costly and time-consuming measurements. After simulation, measurements were performed to verify the accuracy of the equivalent model for immunity prediction. The improvement of measurement accuracy due to the added effect of a bi-directional coupler in the test setup is also addressed.

• Proceedings of the KIEE Conference
• /
• 2003.10a
• /
• pp.186-188
• /
• 2003

The ZnO surge arrester is the protective device for limiting surge voltages on equipment by diverting surge current and returning the device to its original status. The occurrence of overvoltage appears in any phase to AC power supply system and it appears in mixing AC and impulse voltages, moreover because HVDC power supply system uses converter in semiconductor, it makes mixed DC and high harmonics voltages. In this study, the various mixed AC and DC voltages was made for investigating the degradation effect of ZnO arrester according to mixed voltage. As a result, the increase of DC component to mixed voltages causes the increase of resistive component of total leakage current to ZnO block. In changing V-I curve for mixed voltages, the cross-over point acts a factor as making the proper capacitor size of an equivalent circuit for ZnO block.

• Proceedings of the KIEE Conference
• /
• 1992.07b
• /
• pp.649-652
• /
• 1992

ECR(Electron Cyclotron Resonance) occure at ${\omega}_c$=${\omega}$, ${\omega}_c$:electron cycltron frequency, ${\omega}$:electromagnetic wave frequency. ECR system have several merit, 1) power transefer efficiency 2) low neutral gas pressure (below 1 mTorr) 3) high plasma density($10^{12}$ $cm^{-3}$). It is applicated variously in the field of semiconductor and new materials as the manufacturing equipment. Magnetic field in ECR system contruct resonance layer (${\omega}$=2.45GHz, $B_z$=875 Gauss) and control plasma. Plasma is almost generated at resonance layer. If the distance between substrate and resonance layer is short, uniformity of plasma is related with profile of resonance layer. Plasma have the property "Cold in Field", so directonality of magnetic field is one of the control factors of anisotropic etching. In this study, we calculate B field and flux line distribution, optimize geometry and submagnet current and improve of magnetic field directionality (99.9%) near substrate. For the purpose of calculation, vector potential A(r,z) and magnetic field B(r,z), green function and numerical integration is used. Object function for submagnet optimization is magnetic field directionality on the substrate and Powell method is used as optimization skim.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2007.05a
• /
• pp.448-452
• /
• 2007

Many industrial operations require continuous or nearly-continuous operation of machines, which if interrupted can result in significant financial loss. The condition monitoring of these machines has received considerable attention recent years. Rapid developments in semiconductor, computing, and communication with a remote site have led to a new generation of sensor called "smart" sensors which are capable of wireless communication with a remote site. The purpose of this research is the development of smart sensor using which can on-line perform condition monitoring. This system is addressed to detect conditions that may lead to equipment failure when it is running. Moreover it will reduce condition monitoring expense using low cost MEMS accelerometer. This sensor can receive data in real-time or periodic time from MEMS accelerometer. Furthermore, this system is capable for signal preprocessing task (High Pass Filter, Low Pass Filter and Gain Amplifier) and analog to digital converter (A/D) which is controlled by CPU. A/D converter that converts 10bit digital data is used. This sensor communicates with a remote site PC using TCP/IP protocols. Wireless LAN contain IEEE 802.11i-PSK or WPA (PSK, TKIP) encryption. Developed sensor executes performance tests for data acquisition accuracy estimations.

• Journal of the Korea Computer Industry Society
• /
• v.3 no.12
• /
• pp.1747-1758
• /
• 2002

In order to study the electrical properties of silicone gel due to the curing condition, AC breakdown test is researched. For experiment, we have made up several samples cured during each 30[Min], 1[H], 2[H] at 100[$^{\circ}C$], 125[$^{\circ}C$], 150[$^{\circ}C$], 160[$^{\circ}C$], 170[$^{\circ}C$], 180[$^{\circ}C$]. The equipment for this test can measure the dipole output voltage to 50[kV], with increasing rate of about 3[kV] per second. A material of electrode using to the breakdown test is a copper(purity : 99%), the gap between electrodes is to 1[mm]~3[mm], and it thickness is 0.2[mm]. As a result of the experiment, the electrical properties of specimen cured at 170[$^{\circ}C$] for 2[H] is superior.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.45 no.8
• /
• pp.11-16
• /
• 2008

In this paper, firstly we made of the rapid thermal processor equipment with the specifically useful structure to measure wafer stress. Secondly we made of the laser interferometry to inspect the wafer surface curvature based on the large deformation theory. And then the wafer surface fringe image was obtained by experiment, and the full field stress distribution of wafer surface comes into view by signal processing with thining and pitch mapping. After wafer was ground by 1mm and polished from the back side to get easily deformation, and it was heated by three to four times thermal treatments at about 1000 degree temperature. Finally the severe deformation between wafer before and after the heat treatment was shown.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.15 no.3
• /
• pp.389-396
• /
• 2020

In order to obtain a good quality product, a proper verification of production/test facilities must be preceded before the quality conformity inspection of the product. Among the various production/test facilities, ATE is widely used in the civilian industry such as the automotive industry, aerospace industry, semiconductor industry today. In addition, ATE is actively used in the defense industry production and performance tests. This paper is the result of systematically verifying the Design Conformance of ATS which is ATE of military FM radio set using various methods. And It is expected to be a good reference at the present time when the design conformity verification procedure for ATE for military supplies is not documented.