• Title/Summary/Keyword: Semiconductor equipment

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Development of an Occupational Safety and Health (OSH) Guide for Safely Cleaning Contaminated Machinery, Equipment, and Parts Used in the Electronics Manufacturing Process (전자산업 공정에서 사용한 부품, 기계류 세정(cleaning) 작업 안전보건 가이드)

  • Seunghee Lee;Soyeon Kim;Kyung Ehi Zoh;Yeong Woo Hwang;Kyong-Hui Lee;Kwang Jae Chung;Dong-Uk Park
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.33 no.4
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    • pp.419-426
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    • 2023
  • Objectives: This study aims to develop an Occupational Safety and Health (OSH) guide for the safe cleaning of contaminated machinery, equipment, and parts used in the electronics manufacturing process. Methods: A literature review, field investigations, and discussions were conducted. An initial draft of an OSH guide was developed and reviewed by experts with significant experience in maintenance work in the electronics manufacturing process in order to refine the guide. Results: Workers involved in cleaning processes with chemicals, solvents, and abrasive blasting can face exposure to a wide range of chemicals, abrasives, and noise. Identifying potential risks associated with each cleaning technique was an essential first step toward enhancing safety measures. The OSH guide comprises approximately eleven to twelve sections spanning 20-25 pages. It includes engineering and administrative protocols systematically organized to address the necessary actions before, during, and after cleaning tasks, depending on the technique. It is recommended that airline respirator masks be used in conjunction with an air purification system to ensure adherence to air quality standard "D" for atmosphere level. The use of an oil-free air compressor is advised, preferably a stationary model that does not rely on fuel sources like diesel. Conclusions: This OSH guide is designed to protect workers involved in maintenance activity in the electronics industry and aligns with global standards, such as those from the International Organization for Standardization (ISO) and Semiconductor Equipment and Material International, ensuring a higher level of safety and compliance.

On the Sealing Force of Perfluoroelastomer O-rings Including Temperature Effects (온도를 고려한 FFKM O-링의 밀봉력에 관한 연구)

  • 김청균;조승현
    • Tribology and Lubricants
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    • v.20 no.5
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    • pp.278-283
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    • 2004
  • O-ring seal is widely used for sealing pressure vessels and oil containers in various applications of mechanical equipments. The doughnut shape of the O-ring is very important components in most of the system assembly of mechanical apparatus. This paper presents the sealing force of a pressurized perfluoroelastomer O-ring, which is very important contact seal in sealing the semiconductor equipment. The sealing pressure is measured by experimental method and analyzed numerically by using the non-linear MARC finite element program. The seal tester is made to measure the contact force and displacement of the O-ring with an automatic control system of the working temperature. The results show the reasonable agreements between the computed FEM results and measured ones when the operating temperature is moderate temperature. But the compared values between the computed and tested results show a difference because of the increased temperature, which is related to the non-linear parameter of the O-ring material.

A Study on the Grinding Force of Silicon (실리콘 연삭력에 관한 연구)

  • Lee, Choong-Seok;Chae, Seung-Su;Kim, Jong-Pyo;Lee, Jong-Chan;Choi, Hwan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.5 no.1
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    • pp.33-38
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    • 2006
  • Silicon has been widely used in electronic parts as a semiconductor equipment. It, however, requires much effort to grind without microcrack and chipping because of its high hardness and brittleness. So far, many studies for the grinding of engineering ceramics have been done, but not for the grinding of silicon. In this paper, a theoretical analysis on the grinding forces is introduced. Grinding experiments were performed at various grinding conditions including grinding directions (Up grinding and Down grinding), table speeds and depth of cuts. The grinding forces were measured to compare at various grinding conditions. The experimental values agree well with theoretical ones.

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VME bus based control system for step & scan exposure tool (VME bus를 이용한 Step & Scan형 노광장비의 Control System 구성)

  • 최용만;오병주;김도훈;정해빈
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.672-675
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    • 1997
  • This paper proposes a structure of the control system for the step & scan exposure tool. The step & scan exposure tool is used for the manufacturing process of the semiconductor DRAM memory of giga bit. The control system employs the VME bus instead of the conventional ISA bus so that all control signals and data can be managed separately by the 4 VME-PCs for fast and fault-free flow of signals for multi-tasking. A high speed I/O card is equipped for the real-time monitoring and control of the sub module equipment. Then all the subsystems are integrated and aligned for the operation of the step & scan exposure tool with the VME bus and, I/O card.

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Analysis on Industrial Competitiveness for the Promotion of Trade Relations between Korea and China (한국과 중국 간의 교역관계 증진을 위한 산업경쟁력 분석)

  • Lee, Sung-Min;Kim, Chang-Beom
    • International Commerce and Information Review
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    • v.11 no.3
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    • pp.145-165
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    • 2009
  • Nowadays, economic growth of China has become an important issue. Due to the demographic position and the market size, China-Korea trade relationship has grown tremendously and significantly. The Chinese relationship with the Korean industry has considerably increased over the years. Various trade competitiveness indices such as TSI, MRCAI, and IITI have been applied to measure the competitive advantage and the complementary of market structure between these two countries. For this purpose, the dataset from the year 2000 to 2008 provided by KITA were used. The MRCAI result show that Korea has specialized in the product of semiconductor, communication equipment, precision machine, automobile, and nonferrous metal. The intra-industry trade level of Korean manufacturing industry is rising in line with the dominance of vertical intra-industry trade(VIIT) trend.

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CMOS Single Supply Op Amp IC Layout Design (CMOS 단일 전원 OP AMP IC 레이아웃 설계)

  • Jarng, Sun-Suk;Kim, Yu-Ri-Ae
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.909-912
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    • 2005
  • According to miniaturization trend of rehabilitation medical equipment such as hearing aid, study to replace previous complex system with semiconductor SOC (System-on-Chip) chip becomes lively. In this study, after investigating of existent hearing aid performance in circuit design approach, low electric power consuming, single power supply (1.4V battery) CMOSS OP AMP was designed. Analog circuit design tools such as Hspice and Cadence were used for circuit simulation and implementing layout design. This study shows technical methods particularly for layout design. The work is done in pmos and nmos active element layout design in addition to passive element design such as resister, capacitor and inductor.

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Low Complexity Synchronizer Using Common Autocorrelator for DVB-S2 System

  • Park, Jang-Woong;SunWoo, Myung-Hoon;Kim, Pan-Soo;Chang, Dae-Ig
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.9 no.4
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    • pp.181-186
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    • 2009
  • This paper presents an efficient synchronizer architecture using a common autocorrelator for Digital Video Broadcasting via Satellite, Second generation (DVB-S2). To achieve the required performance under the worst channel condition and to implement the efficient H/W resource utilization of functional synchronization blocks, we propose a new efficient common autocorrelator structure. The proposed architecture can decrease about 92% of multipliers and 81% of adders compared with the direct implementation. Moreover, the proposed architecture has been thoroughly verified in XilinxTM Virtex IV and R&STM SFU (Signaling and Formatting Unit) broad-cast test equipment.

A Study on Communication Protocol Inter-conversion between Semiconductor Process Equipment (반도체 공정장비 간 통신 프로토콜 상호 변환에 대한 연구)

  • Lee Jin-Su;Kim Young-Deuk;Hwang In-Su;Kim Woo-Sung
    • Proceedings of the Korea Information Processing Society Conference
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    • 2006.05a
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    • pp.1175-1178
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    • 2006
  • 반도체 공정 자동화를 위해 SEMI에서 제창한 표준 규약인 SECS Protocol은 메시지 전송을 위한 규약인 SECS-I과 HSMS, 실제 통신되는 메시지에 대한 규약인 SECS-II로 구성된다. 하지만 SECS-I에서는 통신속도가 느리고, 근거리 통신만 가능하고, 호스트 컴퓨터와 설비간의 연결이 1:1로 이루어져야 하는 등 여러 가지 문제점도 있고 요즘에는 TCP/IP 기반의 HSMS Protocol 장비가 나오기 때문에 SECS-I을 HSMS로 변환시켜 주는 장치가 필요하다. 본 논문에서는 SECS-I 지원용으로 제작된 설비라도 HSMS를 지원할 수 있도록 하여 HSMS가 갖는 여러 가지 장점을 갖도록 하는 SECS-I/HSMS 변환방법에 관해 살펴본다.

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Characteristic Analysis of Homopolar Magnetic Bearing (호모폴라형 자기베어링의 특성 해석)

  • Jang, Seok-Myeong;Kwon, Jeong-Ki;Cho, Han-Wook;Yoo, Dae-Joon
    • Proceedings of the KIEE Conference
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    • 2003.10b
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    • pp.119-121
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    • 2003
  • The magnetic bearing is an important element for high-speed system, such as semiconductor equipment and machine tools. Particularly, The homopolar magnetic bearing has the advantages of lower power losses, more space for heat dissipation and coil winding. This paper deals with analysis and comparison of the homopolar magnetic bearing according to four different PM structures. On the basis of these results, we find one homopolar magnetic bearing superior to the others. finally, this paper derive force characteristic equation for this model and deals with comparison of between analytical and FE results.

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Development of On-Line Type Voltage Sag Compensation Systems by Using a Supercapacitor (수퍼커패시터를 이용한 상시가동형 순시전압강하 보상시스템의 개발)

  • Shon, Jin-Geun
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.58 no.2
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    • pp.101-107
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    • 2009
  • This paper deal with development of on-line type voltage sag compensation system using supercapacitor EDLC to solve the voltage sag problems which are considered to be dominant disturbances affecting the power quality. With the wide use of semiconductor devices in electrical equipment, modem-type loads are becoming increasingly sensitive to the voltage sags and the disturbances prove to be costly to industries. Supercapacitor EDLC is employed to compensate dynamically for the voltage sag of system with sensitive loads. This capacitor has higher energy density than the electrolytic capacitor. Also, this capacitor has a lot of advantage such as no maintenance, longer life cycle and faster charge-discharge time than the battery system. Therefore, in this paper, the energy design scheme of supercapacitor and the configuration technique of on-line type voltage sag compensation systems are newly introduced. According to the results of experimental of prototype 5[kVA] system, it is verified that the developed system has effectiveness of voltage sag compensation by using a supercapacitor EDLC.