• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 1998년도 춘계학술대회논문집; 용평리조트 타워콘도, 21-22 May 1998
• /
• pp.302-307
• /
• 1998

In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of exactness and accuracy, because this is used as basic data for the design of building structure and structural dynamics of equipment. The study on the evaluation of the factors affecting the permissible vibration criteria is required to design the efficient isolation system of the semiconductor manufacturing of equipment. This paper deals with the properties of the effected factor for vibration criteria of high sensitive equipment.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2008년도 춘계학술대회논문집
• /
• pp.569-574
• /
• 2008

Nowadays, the equipment for a semiconductor process is required to raise accuracy and productivity. Therefore, the natural frequency of the equipment has been lowered because it has been precise, rapid, large, and light. In order to improve the efficiency of production, it is necessary for the equipment to increase the operation speed, which causes inevitable vibration problems. In this paper, influence analysis of ball-screw in the equipment and evaluation method for the vibration on the base are presented based on the analyses of dynamic characteristics for the mechanical structure through the modal test.

• 반도체디스플레이기술학회지
• /
• 제2권3호
• /
• pp.13-18
• /
• 2003

A remote monitoring system of the semiconductor equipment is used to monitor or control operations of the equipment. Most of the conventional monitoring systems are based on the client-server model with the general purpose PC. Basically, it implies the difficulties in the system reliability and cost down due to its size and complexity. To overcome these difficulties, we suggest an embedded web server which is based on the low-cost microprocessor. It is designed for the monitoring or controlling a dedicated equipment only. To evaluate the feasibility of the suggested embedded web server, we have implemented a test-board with ATMega103 and programmed the basic modules using the AVR-GCC. Finally, we have tested its operations on the MS Explorer 6.0 environment.

• 반도체디스플레이기술학회지
• /
• 제19권1호
• /
• pp.67-72
• /
• 2020

This study analyzes the method of adhesion and improvement between heat.er and RF filter in PE-CVD equipment through TRIZ method and proposes a solution. TRIZ Solution such as function analysis, 9-window matrix, ASIT, and Root cause analysis were used. The contact temperature between the heater and the RF filter was 20% and the surface temperature was lowered to 5.7℃, suggesting an improvement method for the thermal expansion of the PE-CVD equipment hot zone.

• 반도체디스플레이기술학회지
• /
• 제20권1호
• /
• pp.25-31
• /
• 2021

The semiconductor and display equipment demands an ultra-fine precision of several nm to several ㎛, and the scale is getting smaller due to the explosive development. The manufacturing process equipment for such products with ultra-fine precision is very sensitive to ultra-small vibrations flowing from the floor, resulting in problems of production defects and yield degradation. The vibration criteria are a standard that regulates the vibration environment of the floor where such precision process equipment will be installed. The BBN vibration criteria defined the allowable vibration velocity level in the frequency domain with a flat and inclined line and presented a rating according to it. However, the actual vibration criteria have appeared with various magnitudes in the frequency domain according to the dynamic characteristics of individual equipment. In this study, the relationship between the relative motion of two major points in the equipment and the vibration magnitude of the floor is presented using the frequency response function of a simple 3-DOF model. It is describing the magnitudes according to the frequency of the floor vibration that guarantees the allowable relative motion and this can be used as the vibration criteria. In order to obtain the vibration criteria experimentally a method of extracting through a modal test was introduced and verified analytically. It provides vulnerable frequency and magnitude to floor vibration in consideration of the dynamic characteristics of individual equipment. And it is possible to know necessary to improve the dynamic characteristics of the equipment, and it can be used to check the vibration compatibility of the place where the equipment will be installed.

• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2008년도 춘계학술대회
• /
• pp.41-41
• /
• 2008

• 반도체디스플레이기술학회지
• /
• 제18권4호
• /
• pp.92-95
• /
• 2019

Automation control and the data for control of industrial equipment for the diagnosis and prediction is a key to success in the 4th industrial revolution. It increases process efficiency and productivity through data collection, realtime monitoring, and the data analysis. However, university and research environment are still suffering from logging the data in manual way, and we occasionally loss the equipment data logging due to the lack of automatic data logging system. State variable presents the current condition of the equipment operation which is closely related to process result, and it is valuable to monitor and analyze the data for the equipment health monitoring. In this paper, we demonstrate the collection of equipment state variable data via programmable logic controller (PLC) and the visualization of the collected data over the Web access supervisory control and data acquisition (SCADA). Test vehicle for the implementation of the suggested SCADA system is a relay switched physical vapor deposition system in the university environment.

• 대한산업공학회지
• /
• 제34권3호
• /
• pp.296-307
• /
• 2008

A semiconductor production system has sophisticated manufacturing operations and needs high capital investment for its expensive equipment, which warrants efficient real-time flow control for wafers. In the bay, we consider material handling equipment that can handle multiple carriers of wafers. The dispatching logic first determines the transportation time of each carrier to its destination by each unit of transportation equipment and uses this information to determine the destination machine and target carrier. When there is no available buffer space at the machine tool, the logic allows carriers to stay at the buffer of a machine tool and determine the delay time, which is used to determine the destination of carriers in URL. A simulation study shows this dispatching logic performs better than the procedure currently in use to reduce the mean flow time and average WIP of wafers and increase efficiency of material handling equipment.

• 반도체디스플레이기술학회지
• /
• 제1권1호
• /
• pp.1-7
• /
• 2002

Modem technology depends on the reliability of extremely high precision equipments. In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Therefore, this high technology equipments require very strict environmental vibration criteria because it is used as basic data for the design of building structure and structural dynamics of equipment. In this paper, the new approach is proposed to investigate the mismatch problem of time and frequency domain for vibration criteria of sensitive equipment. The proposed approach is based on a vibration measurement data and a relative transfer function which can be obtained by experiment or analysis.

• 한국기계가공학회지
• /
• 제11권3호
• /
• pp.182-186
• /
• 2012

This paper aims to analyze the vibration characteristics of the test equipment that inspects any defects in manufactured semiconductor chips and classifies defective chips. This type of equipment should be robust against any vibrations because such vibrations can cause disruption in the process that requires higher precision. 3D model of the structure of the equipment has been used to configure vibration simulation model. Model analysis have been carried out to analyze which part of the equipment is weak against vibration. To minimize the vibration effect of the equipment, the thickness of the plate consist of the equipment and weights are modified. The results show that thicker plate and higher weight in the equipment can decrease vibration effect.