• 전자공학회논문지SC
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• 제49권1호
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• pp.80-87
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• 2012

본 논문에서는 열상장비의 광 검출기에서 검출된 미약한 전기적 신호를 영상신호처리를 하기 위한 신호로 증폭을 해 주는 전단 증폭부의 성능 검사용 ATE(Automatic Test Equipment)를 개발하였다. 기존 ATE 장비는 주로 반도체 소자 양품검사 분야에서 활발히 개발되고 있었으나 최근에는 장비의 성능검사 분야에서도 연구되고 있다. 그러나 열상장비 성능검사 분야의 ATE 에 대한 연구는 다른 분야에 비해 미진하여 우리군의 핵심적인 감시 장비인 열상장비는 정비가 제한되었다. 이에 따라 본 논문에서는 새로운 열상장비 분야의 ATE 연구가 필요하여 전단증폭부 및 열상장비의 다른 회로카드의 범용적인 개발이 가능하도록 Matrix Relay를 개발하였다. 개발된 ATE로 전단증폭부의 증폭도를 측정한 결과 증폭 전압은 평균 2.71 Vpp로써 이론적인 분석 범위 내에 있음이 확인되어 개발된 ATE가 우수한 성능임이 검증되었다.

• 한국정보통신학회논문지
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• 제4권3호
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• pp.705-711
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• 2000

반도체 제조공정과 미세가공 기술을 이용하여 $300^{\circ}C$의 동작온도에서 약 60 mW의 전력소모를 갖는 산화물 반도체 박막 가스센서 어레이를 제조하였다. 멤브레인의 우수한 열적 절연은 $0.1\mum\; 두께의\; Si_3N_4와\; 1\mum$ 두께의 PSG의 이중 층에 의한 것으로, 각각 LPCVD(저압화학 기상증착)와 APCVD(대기압 화학 기상증착)에 의해 제조되었다. 센서 어레이의 4가지 산화물 반도체 박막 감지물질로는 1 wt.% Pd가 도핑된 $SnO_2,\; 6 we.% A1_2O_3$가 도핑된 ZnO, $WO_3$, ZnO를 이용하였으며,4가지 감지물질의 베이스라인 저항은 $300^{\circ}C$ 에서 3일 동안의 에이징을 거친 후 안정됨을 보였다. 제조된 초소형 산화물 반도체 박막 가스센서 어레이는 여러 가지 가스의 노출 시 유용한 저항 변화를 나타내었으며 감도는 감지 물질에 강하게 의존함을 알 수 있었다.

• 한국정보통신학회논문지
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• 제6권2호
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• pp.315-322
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• 2002

반도체 제조공정과 미세가공 기술을 이용하여 30$0^{\circ}C$의 동작온도에서 약 60㎽의 전력소모를 갖는 산화물 반도체 박막 가스센서 어레이를 제조하였다. 멤브레인의 우수한 열적 절연은 0.1$\mu\textrm{m}$ 두께의 Si$_3$N$_4$와 1$\mu\textrm{m}$ 두께의 PSG의 이중 층에 의한 것으로, 각각 LPCVD(저압화학 기상증착)와 APCVD(대기압 화학 기상증착)에 의해 제조되었다. 센서 어레이의 4가지 산화물 반도체 박막 감지물질로는 1wt.%Pd가 도핑된 SnO$_2$, 6wt.% $Al_2$O$_3$가 도핑된 ZnO, WO$_3$, ZnO를 이용하였으며, 제조된 초소형 산화물 반도체 박막 가스센서 어레이는 여러 가지 가스의 노출시 유용한 저항 변화를 나타내었고 감도는 감지 물질에 강하게 의존함을 알 수 있었다. 센서 소자의 공정 수율을 증진시키기 위하여 히터 부위를 함몰하는 공정 방법을 취하였으며, 그 결과 월등한 수율 개선을 도모할 수 있었다.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2006년도 추계학술대회 발표 논문집
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• pp.110-114
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• 2006

Dielectric properties of glass-ceramics with fresnoite(Ba2TiSi208) crystals have been investigated in xK20-(33.3-x)BaO-16.7TiO2-50SiO2 ($0{\leq}x{\leq}20mol%$) glasses. The glassy nature was analyzed by differential thermal analyses and glass-ceramics was variable and control table by the processing parameters like time and temperature. Dielectric constant was measured over a temperature from 125K to 425k at frequencies form 100Hz to 1MHz, and laid in the range 16-10. Piezoelectric constant d33 was measured using a YE2703A d33meter and changed from 5.9 to 4.8pCN-1 with x contents. The spontaneous polarization Ps estimated from the hysteresis at ${\pm}1.2kV$ was ${\sim}0.3\;{\mu}C/cm2$ at room temperature.

• IEIE Transactions on Smart Processing and Computing
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• 제3권5호
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• pp.331-337
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• 2014

Ge is becoming an increasingly popular semiconductor material with high Si compatibility for on-chip optical interconnect technology. For a better manifestation of the meritorious material properties of Ge, its surface treatment should be performed satisfactorily before the electronic and photonic components are fabricated. Ex-situ rapid thermal annealing (RTA) processes with different gases were carried out to examine the effects of the annealing gases on the thin-film quality of Ge grown epitaxially on Si substrates. The Ge-on-Si samples were prepared in different structures using the same equipment, reduced-pressure chemical vapor deposition (RPCVD), and the samples annealed in $N_2$, forming gas (FG), and $O_2$ were compared with the unannealed (deposited and only cleaned) samples to confirm the improvements in Ge quality. To evaluate the thin-film quality, room-temperature photoluminescence (PL) measurements were performed. Among the compared samples, the $O_2$-annealed samples showed the strongest PL signals, regardless of the sample structures, which shows that ex-situ RTA in the $O_2$ environment would be an effective technique for the surface treatment of Ge in fabricating Ge devices for optical computing systems.

• 한국재료학회지
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• 제23권8호
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• pp.405-422
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• 2013

Atomic layer deposition(ALD) is a promising deposition method and has been studied and used in many different areas, such as displays, semiconductors, batteries, and solar cells. This method, which is based on a self-limiting growth mechanism, facilitates precise control of film thickness at an atomic level and enables deposition on large and three dimensionally complex surfaces. For instance, ALD technology is very useful for 3D and high aspect ratio structures such as dynamic random access memory(DRAM) and other non-volatile memories(NVMs). In addition, a variety of materials can be deposited using ALD, oxides, nitrides, sulfides, metals, and so on. In conventional ALD, the source and reactant are pulsed into the reaction chamber alternately, one at a time, separated by purging or evacuation periods. Thermal ALD and metal organic ALD are also used, but these have their own advantages and disadvantages. Furthermore, plasma-enhanced ALD has come into the spotlight because it has more freedom in processing conditions; it uses highly reactive radicals and ions and for a wider range of material properties than the conventional thermal ALD, which uses $H_2O$ and $O_3$ as an oxygen reactant. However, the throughput is still a challenge for a current time divided ALD system. Therefore, a new concept of ALD, fast ALD or spatial ALD, which separate half-reactions spatially, has been extensively under development. In this paper, we reviewed these various kinds of ALD equipment, possible materials using ALD, and recent ALD research applications mainly focused on materials required in microelectronics.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.409-412
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• 1998

In this paper, we present an $H^2$ controller design of RTP(rapid thermal processing) systems satisfying robust stability and performance using weighted mixed sensitivity minimization. In industrial fields, RTP system is widely used for improving the oxidation and the annealing in semiconductor manufacturing process. The main control factors are temperature control of wafer and uniformity has been solved by PID control method. Because the reference inputs of RTP are ramp, we improve performance of RTP system by the design of $H^2controller$ using the weighted mixed sensitivity function. Also we compare $H^2controller$ with PID controller in terms of performance. An example is proposed to show the validity of proposed method.

• Journal of information and communication convergence engineering
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• 제1권2호
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• pp.67-69
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• 2003

The experimental studies for the etch properties of the oxide grown on silicon substrate, which is in diluted hydrogen fluoride (HF) solution, are presented. Using different ion implantation dosages, dopants and energies, silicon substrate was implanted. The wet etching in diluted HF solution is used as a mean of wafer cleaning at various steps of VLSI processing. It is shown that the wet etch rate of oxide grown on various implanted silicon substrates is a strong function of ion implantation dopants, dosages and energies. This phenomenon has never been reported before. This paper shows that the difference of wet etch rate of oxide by ion implantation conditions is attributed to the kinds and volumes of dopants which was diffused out into $SiO_2$ from implanted silicon during thermal oxidation.

• 소성∙가공
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• 제28권1호
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• pp.43-48
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• 2019

Aluminum nitride (AlN) is used by the semiconductor industry, and is a compound that is required when manufacturing high thermal conductivity. The AlN films with c-axis orientation and thermal conductivity characteristic were deposited by using the Pulsed Laser Deposition (PLD). The AlN thin films were characterized by changing the deposition conditions. In particular, we have researched the AlN thin film deposited under optimal conditions for growth atmosphere. The epitaxial AlN films were grown on sapphire ($c-Al_2O_3$) single crystals by PLD with AlN target. The AlN films were deposited at a fixed temperature of $650^{\circ}C$, while conditions of nitrogen ($N_2$) pressure were varied between 0.1 mTorr and 10 mTorr. The quality of the AlN films was found to depend strongly on the $N_2$ partial pressure that was exerted during deposition. The X-ray diffraction studies revealed that the integrated intensity of the AlN (002) peak increases as a function the corresponding Full width at half maximum (FWHM) values decreases with lowering of the nitrogen partial pressure. We found that highly c-axis orientated AlN films can be deposited at a substrate temperature of $650^{\circ}C$ and a base pressure of $2{\times}10^{-7}Torr$ in the $N_2$ partial pressure of 0.1 mTorr. Also, it is noted that as the $N_2$ partial pressure decreased, the thermal conductivity increased.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권3호
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• pp.96-100
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• 2004

The Nd： YAG laser is commonly used throughout many fields such as accurate material processing, IC marking, semiconductor annealing, medical operation devices, etc., due to the fact that it has good thermal and mechanical properties and is easy to maintain. In materials processing, it is essential to vary the laser power density for specific materials. The laser power density can be mainly controlled by the current pulse width and pulse repetition rate. It is important to control the laser energy in those fields using a pulsed laser. In this paper we propose the constant-frequency current resonant half-bridge converter and monitoring of capacitor charging voltage. This laser power supply is designed and fabricated to have less switching loss, compact size, isolation with primary and secondary transformers, and detection of capacitor charging voltage. Also, the output stabilization characteristics of this Nd： YAG laser system are investigated. The test results are described as a function of laser output energy and flashlamp arc discharging constant. At the energy storage capacitor charges constant voltage, the laser output power is 2.3％ error range in 600[V].