• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.361-365
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• 2022

Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

• Journal of the Semiconductor & Display Technology
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• v.10 no.3
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• pp.61-65
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• 2011

The capabilities of finite elements codes allow now accurate simulations of blanking processes when appropriate materials modelling are used. Over the last decade, numerous numerical studies have focused on the influence of process parameters such as punch-die clearance, tools geometry and friction on blanking force and blank profile. In this study, three dimensional finite element analysis is carried out to design a lead frame blanking die using LS-Dyna3D package. After design of the blanking die, an experiment is also carried out to investigate the characteristics of blanking for nickel alloy Alloy42, a kind of IC lead frame material. In this paper, it has been researched the investigation to examine the influence of process parameters such as clearance and air cylinder pressure on the accuracy of sheared plane. Through the experiment results, it is shown that the quality of sheared plane is less affected by clearance and air cylinder pressure.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.39-44
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• 2022

Using a CFD (computational fluid dynamics) simulation tool, we have offered a design guideline of a slot-die head having a simple T-shaped cavity through an analysis of the fluid dynamics in terms of cavity pressure and outlet velocity, which affect the uniformity of coated thin films. We have visualized the fluid flow with a transparent slot-die head where poly(3,4-ethylenedioxythiophene):poly(4-styrenesulfonate) (PEDOT:PSS) is injected. We have shown that the fluid dynamics inside the slot-die head depends sensitively on the cavity depth, cavity length, land length, and channel gap (i.e., shim thickness). Of those, the channel gap is the most critical parameter that determines the uniformity of the pressure and velocity distributions. A pressure drop inside the cavity is shown to be reduced with decreasing shim thickness. To quantify it, we have also calculated the coefficient of variation (CV). In accordance with Hagen-Poiseuille's laws and electron-hydraulic analogy, the CV value is decreased with increasing cavity depth, cavity length, and land length.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.799-805
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• 2015

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.284-287
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• 1987

In this paper, the design and implementation of a multiprocessor based Die Bonder Machine for the semiconductor will be described. This the partial research result, that is, the 1st year portion of the project to be performed for a period of two years from June, 1986 to May, 1988. The mechanical system consists of the following three subsystems : (i) transfer head unit, (ii) die feeding XY-table unit, and (iii) plunge up unit. The overall control system is designed to be essentially a master-slave type in which each slave is functionally fixed in view of software and also the time shared common bus structure with hardwired bus arbitration scheme is utilized, the control system consists of the following three subsystems each of which employs a 16 bits microprocessor MC 68000 : (i) die bonder processor controller, (ii) visual recognition/inspection and display system, (iii) the servo control system. It is reported that the proposed control system were applied to Working Sample and tested in real system, and the results are successful as a working sample phase.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.65-70
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• 2024

Using a computational fluid dynamics(CFD) simulation tool, we have provided a coating guideline for slot-die coating with a double layer slot die head. We have analyzed the fluid dynamics in terms of the coating speed, flow rate ratio, and viscosity ratio, which are critical for the stability of coating meniscus. We have identified the common coating defects such as break-up, air entrainment, and leakage by varying the coating speeds. The flow rate ratio is the critical parameter determining the wet film thickness of the top and bottom layers. It is shown that when the flow rate ratio exceeds or equals 1.8, air entrainment occurs due to insufficient hydraulic pressure in the bottom layer, even though the total flow rate remains constant. Furthermore, we have found that the flow of the bottom layer is significantly affected by the viscosity of top layer. The viscosity ratio of 4 or higher obstructs the flow of the bottom layer due to the increased hydraulic resistance, resulting in leakage. Finally, we have demonstrated that as the viscosity ratio increases from 0.1 to 10, the maximum coating speed rises from 0.4 mm/s to 1.6 mm/s, and the minimum wet film thickness decreases from 800 ㎛ to 200 ㎛.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.708-714
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• 2016

In today's semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.

• Transactions of Materials Processing
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• v.23 no.4
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• pp.206-210
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• 2014

The metal lead frame, a semiconductor component, has product tolerances in micro units as compared to products made with a larger size mold. Therefore, small deflections of the mold and of the press as well as the press molding process itself have a strong influence on accuracy of the product. Hence, it is necessary for the process design to consider the structural response of the mold and the press during deformation. In the current study, the mold deflection and pressure on the punch is examined using the finite element modeling (FEM) program ABAQUS. The results from the simulation were verified with the dynamic deformation measurement equipment using digital image correlation (DIC).

• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.327-329
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• 2006

In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.