1 |
H. Lee, "Semiconductor Packaging Technology Trends", The magazine of the IEEK, pp. 65-71, December, 2013.
|
2 |
S. M. Yeon, J. H. Park, D. K. Kwag, N. K. Lee, H. J. Lee, J. H. Kim, "Development of Molding Equipment for the Molding Processes of wafer level packaging", the Korean Society of Manufacturing Technology Engineers, pp. 110, April, 2012.
|
3 |
J. H. Lee, S. J. Park, H. J. Lee, J. H. Park, "300mm molded wafer warpage analysis in accordance with die size", the Korean Society of Manufacturing Technology Engineers, pp. 163, April, 2015.
|
4 |
N. Andres, B. C. Jang, "Development of a machine vision system for automotive part car seat frame inspection", Journal of the Korea Academia-Industrial cooperation Society, pp. 1559-1564, April, 2011.
|
5 |
Y. K. Cho, S. J. Ha, J. S. Kim, M. W. Cho, "LED Die Bonder Inspection System Using Integrated Machine Visions", Journal of the Korea Academia-Industrial cooperation Society, pp. 2624-2630, June, 2013.
|
6 |
J. H. Lee, H. J. Lee, J. H. Park, S. J. Park, "Pressure and shear rate in accordance with emc application area in wlp process", the Korean Society of Manufacturing Technology Engineers, pp. 351, April, 2014.
|