• Journal of Environmental Science International
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• v.14 no.3
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• pp.335-343
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• 2005

The objective of this research is to evaluate a feasibility of wastewater reuse by membrane treatment with vibrating membrane separation equipment. Molecular weight of compounds in wastewater, permeability of membrane and retentate characterization after membrane filtration were investigated in order to determine appropriate membrane pore size and materials for wastewater treatment. Selected membrane was evaluated with vibration membrane separation equipment to optimize operating conditions. The following conclusion are drawn. 1. We got as following test results after the distribution of particles in the semiconductor wastewater, are made up of $1\~20{\mu}m$. Si, gold and Al in turn are contained in semiconductor wastewater. 2. Recovery rate is changeless under increasing recovery rate in operation. Though a value can be if pressure can be changed, the highest value of permeate rate is presented in 150 psi. 3. The AS-100(polysulpone) was selected as the most appropriate membranes for the treatment of semi-conductor wastewater to VSEP system. The fouling almost did not occur during this experiments. The analyses of treated water with VSEP system showed conductivity: 0.059,us/cm, TDS: 40mg/l, COD: 20mg/l, SS : 5mg/l, n-Hexane: 8.3mg/l. Comparing previous systems, operating expenses is decreased by more $50\%$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.2
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• pp.144-151
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• 2012

Polishing is not only one of the most frequently adopted processes in modern industries, but also the most critical one to the surface quality of the products such as semi conductor wafers and LED sapphire wafers. With the required specifications for the wafer surface quality getting more and more strengthened, the manufacturers are spending huge amount of cost to renew the machine to meet the enhanced surface specifications. Surface qualities of the wafers are mostly damaged by the structural vibrations of the polishing machines. In this paper, the dynamic characteristics of a wafer polishing machine have been analyzed through the frequency response test and the computer simulation. And the supporting structure of a polishing machine has been investigated to minimize the vibration transmissions, to improve the stability of the machine and further to reduce the defects of the polished products. The result of the study shows that simple design modifications of the supporting structure without altering the main structure of the machine can substantially suppress the vibrations of the machine with negligible expenses.

• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.37-42
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• 2012

$WS_2$ powder was added to the Cu/Sn bond metal of diamond micro-blades for machining of semi-conductor and IC chips to improve cutting efficiency. The effect of $WS_2$ additive on cutting efficiency was investigated and compared with the micro-blades with $MoS_2$ developed in previous research. Flexural strength, frictional coefficient, and wear resistance of blades decreased with $WS_2$ but wear depth increased. It was found that the blades including $WS_2$ consumed less momentary energy than the blades containing $MoS_2$ during dicing test. Micro-blades containing $WS_2$ exhibited lower flexural strength than the blades with $MoS_2$ resulting from higher amount of sintering defects relevant to the less effectiveness of $WS_2$ on fluidity. The effect of $WS_2$ and $MoS_2$ on fluidity during sintering was analyzed in terms of mismatching degree between the longitudinal direction of lubricant particles and the perpendicular direction to the compact loading. The blade with 8.1 vol.% of $WS_2$ showed the best cutting efficiency.

• Journal of Korean Society for Atmospheric Environment
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• v.23 no.6
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• pp.744-751
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• 2007

Wet scrubber is widely used to remove toxic gaseous contaminants in various industries such as semi-conductor industry, display manufacturing industry and so on. In this study, to optimize a packed bed scrubber as one of typical wet scrubber size while keeping its performance, four different packing materials were investigated at different air flow rates, liquid-gas ratios and pH values. Ammonia, hydrochloric acid and hydrofluoric acid were used as test gases to characterize the scrubber performance. Gas removal efficiency increased as the packing size decreased, which resulted in the increase of specific surface area. The increase of air flow rate led to the decrease of gas removal efficiency, while the increase of liquid-gas ratio led to the increase of gas removal efficiency. For the case of $NH_3$ gas, lower pH, and for the cases of HCl and HF, higher pH contributed to higher gas removal efficiency. Gas removal efficiency of a wet scrubber increased in the order of HCl < $NH_3$ < HF according to its water solubility.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.15-21
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• 2010

Recently, there is a demand for a thermal imaging microscope in the medical field as well as the semi-conductor industry Although the demand of the advanced thermal imaging microscope has been increased, it is very difficult to obtain the technology of developing a thermal camera, because it is used for defense industry. We developed the ${\times}5$ zoom microscope which has $3\;{\mu}m$ spatial resolution to research the design and fabrication of the IR (Infrared) optical system. The optical system of the IR microscope consists of four spherical lenses and four aspheric lenses. We verified individual sensitivity of each optical parameter as the first order approach to the analysis. And we also performed structure and vibration analysis. The optical elements are fabricated using Freeform 700A. The measurement results of surface roughness and form accuracy using NT 2000 and UA3P are Ra 2.36 nm and P-V $0.13\;{\mu}m$. Finally we ascertained resolution power of $3\;{\mu}m$ using USAF (United State Air Force) 1951 IR resolution test chart.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2005.11a
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• pp.37-41
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• 2005

When screen size of the Flat Panel Display (FPD) becomes larger, the traditional photo-lithography using photomasks and UV lamps might not be possible to make patterns on Photo Resist (PR) material due to limitation of the mask size. Though the maskless photo-lithography using UV lasers and scanners had been developed to implement large screen display, it was very slow to apply the process for mass-production systems. The laser exposure system using 405 nm semi-conductor lasers and Digital Micromirror Devices (DMD) has been developed to overcome above-mentioned problems and make more than 100 inches FPD devices. It makes very fine patterns for full HD display and exposes them very fast. The optical engines which contain DMD, Micro Lens Array (MLA) and projection lenses are designed for 10 to 50 ${\mu}m$ bitmap pattern resolutions. The test patterns for LCD and PDP displays are exposed on PR and Dry Film Resists (DFR) which are coated or laminated on some specific substrates and developed. The fabricated edges of the sample patterns are well-defined and the results are satisfied with tight manufacturing requirements.

• Proceedings of the KIEE Conference
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• 2000.07b
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• pp.1327-1329
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• 2000

The thyristor among the power-semi-conductor elements, which has large current capacity and high voltage, is used widely nowadays. When the thyristor was being used to the long time, this element may be able to arise the system trip caused by changing the characteristic and dropping the performance. Therefore, it would be necessary to analyze the characteristic of element to maintain the stable operation of the system. In oder to analyze this characteristic, it would be need to test forward direction, reverse direction and leakage current by supplying the half-sine wave voltage. Among these testing, transient current condition is generated from the testing of leakage current. This transient current may be the main factor of the error in the precise measurement of leakage current. Therefore, this paper analyzes the relationship between supply voltage and transient current in measuring leakage current of the SCR, and then suggests the condition and cause of transient current as appearing the leakage current in the testing the leakage current.

• Journal of the Korean Electrochemical Society
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• v.4 no.4
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• pp.160-165
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• 2001

The eletrochemical charateristics of mercapto compound additives on the copper electroplating for semi conductor metalization were investigated. Mercapto compounds including sulfur atom is known that they activate deposition rate in eletroplating. Four different types of mercapto compounds were chosen with different concentration and both the characteristics of plating and throwing power were investigated by electrochemical experiments such as Hull cell test, Haring-Blum cell, cathodic polarization, EQCM(Electrochemical Quartz Crystal Microbalance). 3-Mercapto-1-propanesulfonic acid among 4 different mercapto compounds was regarded as the most proper activator with the results of the mass change of Cu metal deposited on eletrode by cathodic polarization and EQCM. The overpotential was more shifted to 100 mV in the concentration of 20 ppm than the solution with only $Cl^-$ in cathodic scan.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.3
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• pp.61-71
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• 2014

As the occupancy rate of the flash memory increases in the storage media market for the embedded system and the semi-conductor industry grows, the demand and supply of flash memory is increasing by a big margin. They are especially used in large quantity in the smart phones, tablets, PC, SSD and Soc(System on Chip) etc. The flash memory is divided into the NOR type and NAND type according to the cell arrangement structure and the NAND type is divided into the SLC(Single Level Cell) and MLC(Multi Level Cell) according to the number of bits that can be stored in each cell. Many tests have been performed on NOR type such as BIST(Bulit-In Self Test) and BIRA(Bulit-In Redundancy Analysis) etc, but there is little study on the NAND type. For the case of the existing BIST, the test can be proceeded using external equipments like ATE of high price. However, this paper is an attempt for the improvement of credibility and harvest rate of the system by proposing the BIST for the MLC NAND type flash memory of Finite State Machine structure on which the pattern test can be performed without external equipment since the necessary patterns are embedded in the interior and which uses the MLC NAND March(x) algorithm and pattern which had been proposed for the MLC NAND type flash memory.

• Journal of the Korean Vacuum Society
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• v.12 no.2
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• pp.93-104
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• 2003

For evaluation of durability of low vacuum pumps, it is required to examine the performance and degradation of low vacuum pumps. Pump degradation may result from abnormalities associated with the performance in many areas of pump operation. The diagnostics method can be used to monitor the pump performance in the semi-conductor process line. Based on the mechanical defect of the pump, the dynamic response and reliability of the system for performance test, and the dynamic characteristics of the pump were experimentally assessed. The theoretical work rate for the compression process in the pump was calculated, and then the efficiency of the pump associated with the power consumption was evaluated. This analysis will be useful in detecting pump degradation with increasing the power consumption. To determine the predominant factors of pump degradation, it is important to evaluate the entire pumping system. We studied vibration, dynamic pressure, pumping speed, and power consumption of low vacuum pumps. Our results can be utilized for the future research on the evaluating technology of durability of low vacuum pumps.