Browse > Article
http://dx.doi.org/10.5695/JKISE.2012.45.1.037

Cutting Efficiency and Mechanical Characteristics of Diamond Micro-blades Containing WS2 Lubricant  

Kim, Song-Hee (Department of Advanced Materials Engineering, Kangwon National University)
Jang, Jae-Cheol (Department of Advanced Materials Engineering, Kangwon National University)
Publication Information
Journal of the Korean institute of surface engineering / v.45, no.1, 2012 , pp. 37-42 More about this Journal
Abstract
$WS_2$ powder was added to the Cu/Sn bond metal of diamond micro-blades for machining of semi-conductor and IC chips to improve cutting efficiency. The effect of $WS_2$ additive on cutting efficiency was investigated and compared with the micro-blades with $MoS_2$ developed in previous research. Flexural strength, frictional coefficient, and wear resistance of blades decreased with $WS_2$ but wear depth increased. It was found that the blades including $WS_2$ consumed less momentary energy than the blades containing $MoS_2$ during dicing test. Micro-blades containing $WS_2$ exhibited lower flexural strength than the blades with $MoS_2$ resulting from higher amount of sintering defects relevant to the less effectiveness of $WS_2$ on fluidity. The effect of $WS_2$ and $MoS_2$ on fluidity during sintering was analyzed in terms of mismatching degree between the longitudinal direction of lubricant particles and the perpendicular direction to the compact loading. The blade with 8.1 vol.% of $WS_2$ showed the best cutting efficiency.
Keywords
Diamond micro-blades; $WS_2$; lubricant; Cutting efficiency; Sintering;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 K. Y. Ko, Y. Y. Cha, B. S. Choi, J. Kor. Soc. Pre. Eng., 17 (2000) 70.
2 S. Avagliano, N. Bianco, O. Manca, V. Naso, Int. J. Heat & Mass Trans., 42 (1999) 645.   DOI   ScienceOn
3 Editorial Department of Elec. Res. Inc., Semiconductor & FPD Monthly Kor., Elec. Res. Inc. (1997) 33.
4 S. H. Kim, J. C. Moon, J. Kor. Inst. Surf. Eng., 41 (2008) 335.   DOI
5 S. H. Kim, J. C. Moon, J. Kor. Inst. Surf. Eng., 43 (2010) 41.   DOI
6 P. R. Davis, M. L. Fish, S. Peacock, D. N. Wright, An Indicator System for Saw Grit, Industrial Diamond Review, 56 (1996) 78.
7 P. R. Davis, M. L. Fish, S. Peacock, D. N. Wright, Industrial Diamond Review, 63 (2003) 34.
8 Assembly Technology, "Dicing Saw Cuts Wafer Easily, Accurately", Machine Design, 66 (2000).