• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.53-57
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• 2011

In the modern packaging technologies highly condensed metal interconnects are typically formed by highcost processes. These methods inevitably require the precise controls of mutually dependant process parameters, which usually cause the difficulty of the change in the layout design for interconnects of chip to-chip, or chip-to-substrate. In order to overcome these problems, the unique concept and methodology of self-assembly even in micro-meter scale were developed. In this report we focus on the factors which influenced the self-formed bumps by analyzing the phenomenon experimentally. In case of RMA flux, homogenous pattern was obtained in both plain surface and cross-section surface observation. By using RA flux, the phenomena were accelerated although the self-formtion results was inhomogenous. With ussage of moderate RA flux, reaction rate of the self-formation was accelerated with homogeneous pattern.

• Journal of Adhesion and Interface
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• v.18 no.4
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• pp.171-178
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• 2017

Recently, layer-by-layer (LbL) assembly has emerged as a promising fabrication technique in controlling surface wetting properties. LbL assembly technique is eco-friendly versatile technique to control the hierarchical structure and surface properties in nano- and micro-scale by employing a variety of materials (e.g., polymers, surfactants, nanoparticles, etc.). This article reviews recent progress in controlling the surface wetting using LbL technique. In particular, technical trends and research findings on fabrication and the applications of superhydrophobic, superhydrophilc, and superoleophobic/superhydrophilic LbL surfaces are extensively explained. Additionally, basic principles and fabrication methods in emerging areas such as omniphobic, self-healing, intelligent and responsive LbL surfaces are discussed.

• Proceedings of the Korean Fiber Society Conference
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• 2002.04a
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• pp.1-3
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• 2002

고분자전해질의 교대흡착을 통하여 고분자 박막을 제조하는 기법은 고분자 자기조립 (polymer self-assembly)의 새롭고 다양한 분야에 응용될 수 있는 방법이다. 전하를 갖는 여러 종류의 고분자가 이 방법에 사용되어질 수 있으며, 여기에는 일반적으로 알려진 고분자전해질뿐만 아니라, 복잡한 구조의 기능단을 갖는 고분자전해질, DNA와 단백질과 같은 생체고분자 등이 포함되어 있다. (중략)

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.113-114
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• 2009

기존의 습식 및 건식 표면처리 공정의 단점을 극복하고, 마그네슘 합금의 가장 큰 문제점인 내식성개선을 위해 열화학기상증착(thermal Chemical Vapor Deposition)법을 이용하여 자기조직화 유기 단분자막(Self-Assembled organic Monolayer, SAM)을 제작하여 마그네슘 합금(AZ31)의 내식성을 검토하였다.

• Bulletin of the Korean Chemical Society
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• v.32 no.1
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• pp.39-40
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• 2011

• Bulletin of the Korean Chemical Society
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• v.28 no.5
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• pp.867-870
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• 2007

• Bulletin of the Korean Chemical Society
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• v.27 no.11
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• pp.1881-1884
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• 2006

• Smart Structures and Systems
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• v.15 no.3
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• pp.627-643
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• 2015

Negative stiffness, previously emulated by active or semi-active control for cable vibration mitigation, is realized passively using a self-contained highly compressed spring, the negative stiffness device (NSD).The NSD installed in parallel with a viscous damper (VD) in the vicinity of cable anchorage, enables increment of damper deformation during cable vibrations and hence increases the attainable cable damping. Considering the small cable displacement at the damper location, even with the weakening device, the force provided by the NSD-VD assembly is approximately linear. Complex frequency analysis has thus been conducted to evaluate the damping effect of the assembly on the cable; the displacement-dependent negative stiffness is further accounted by numerical analysis, validating the accuracy of the linear approximation for practical ranges of cable and NSD configurations. The NSD is confirmed to be a practical and cost-effective solution to improve the modal damping of a cable provided by an external damper, especially for super-long cables where the damper location is particularly limited. Moreover, mathematically, a linear negative stiffness and viscous damping assembly has proven capability to represent active or semi-active control for simplified cable vibration analysis as reported in the literature, while in these studies only the assembly located near cable anchorage has been addressed. It is of considerable interest to understand the general characteristics of a cable with the assembly relieving the location restriction, since it is quite practical to have an active controller installed at arbitrary location along the cable span such as by hanging an active tuned mass damper. In this paper the cable frequency variations and damping evolutions with respect to the arbitrary assembly location are then evaluated and compared to those of a taut cable with a viscous damper at arbitrary location, and novel frequency shifts are observed. The characterized complex frequencies presented in this paper can be used for preliminary damping effect evaluation of an adaptive passive or semi-active or active device for cable vibration control.

• ETRI Journal
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• v.36 no.2
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• pp.301-308
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• 2014

Three-dimensional integration technology results in area savings, platform power savings, and an increase in performance. Through-silicon via (TSV) assembly and manufacturing processes can potentially introduce defects. This may result in increases in manufacturing and test costs and will cause a yield problem. To improve the yield, spare TSVs can be included to repair defective TSVs. This paper proposes a new built-in self-test feature to identify defective TSV channels. For defective TSVs, this paper also introduces dynamic self-repair architectures using code-based and hardware-mapping based repair.

• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.322.1-322.1
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• 2007