• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.49-49
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• 2010

Nanopiezotronics is an emerging area of nanotechnology with a variety of applications that include piezoelectric field-effect transistors and diodes, self-powered nanogenerators and biosystems, and wireless nano/biosensors. By exploiting coupled piezoelectric and semiconducting characteristics, it is possible for nanowires, nanobelts, or nanorods to generate rectifying current and potential under external mechanical energies such as body movement (handling, winding, pushing, and bending) and muscle stretching, vibrations (acoustic and ultrasonic waves), and hydraulic forces (body fluid and blood flow). Fully transparent, flexible (TF) nanogenerators that are operated by external mechanical forces will be presented. By controlling the density of the seed layer for ZnO nanorod growth, transparent ZnO nanorod arrays were grown on ITO/PES films, and a TF conductive electrode was stacked on the ZnO nanorods. The resulting integrated TF nanodevice (having transparency exceeding 70 %) generated a noticeable current when it was pushed by application of an external load. The output current density was clearly dependent on the force applied. Furthermore, the output current density depended strongly on the morphology and the work function of the top electrode. ZnO nanorod-based nanogenerators with a PdAu, ITO, CNT, and graphene top electrodes gave output current densities of approximately $1-10\;uA/cm^2$ at a load of 0.9 kgf. Our results suggest that our TF nanogenerators are suitable for self-powered TF device applications such as flexible self-powered touch sensors, wearable artificial skins, fully rollable display mobile devices, and battery supplements for wearable cellular phones.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.313.1-313.1
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• 2013

현재 결정질 실리콘 태양전지의 전 후면 전극의 형성은 스크린 프린팅 방법이 주를 이루고 있다. 스크린 프린팅 방법은 쉽고 빠르게 인쇄가 가능한 반면 단가가 높고 금속 페이스트에 첨가된 여러 혼합물에 의해서 전극과 기판 사이의 저항이 크다는 단점이 있다. 본 논문에서는 스크린 프린팅 방법으로 태양전지의 seed layer를 인쇄하고, Cu도금을 진행함으로써 태양전지의 전기적 특성을 비교하였다. 주요 전극 형성을 Cu 도금을 사용함으로써 전극과 기판사이의 저항을 감소시키고 값비싼 Ag페이스트를 값싼 Cu로 대체함으로써 가격을 낮출 수 있는 장점이 있다. 실험에 사용된 Si 웨이퍼 특성은 $156{\times}156$ mm2, 200 ${\mu}m$, 0.5-3.0 ${\Omega}{\cdot}cm$ and p-type 웨이퍼를 사용하였다. 웨이퍼는 표면조직화, p-n접합 형성, 반사방지막 코팅을 하였으며 스크린 프린팅 방법을 이용해 전 후면 전극을 인쇄하고 열처리 과정을 통해 전극을 형성하였다. 이 후 전면에 Cu도금을 실행하여 태양전지를 완성하였다. 완성된 태양전지는 솔라 시뮬레이터 및 TLM패턴을 이용하여 전기적 특성을 분석하였으며, SEM과 linescan, 광학현미경 등을 이용하여 전극을 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.202.1-202.1
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• 2013

ZnO nanostructure was fabricated on a Si substrate using two-step growth. The seed layer was grown on the Si substrate by a sol-gel spin-coating. In the first step, ZnO nanorods were grown by a hydrothermal method at $140^{\circ}C$ for 5 min. In the second step, a ZnO thin film was grown on the ZnO nanorods by spin-coating. After growth, these films were annealed at $800^{\circ}C$ for 10 min. Electrical and optical properties of ZnO nanostructures have modified by plasma-assisted molecular beam epitaxy (PA-MBE) regrowth. The carrier concentration and resistivity increased by PA-MBE regrowth. In the photoluminescence, the full width at half maximum and intensity were decreased and increased, respectively, by PA-MBE regrowth.

• Korean Journal of Materials Research
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• v.19 no.6
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• pp.344-348
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• 2009

The electrolyte effects of the electroplating solution in Cu films grown by ElectroPlating Deposition(EPD) were investigated. The electroplated Cu films were deposited on the Cu(20 nm)/Ti (20 nm)/p-type Si(100) substrate. Potentiostatic electrodeposition was carried out using three terminal methods: 1) an Ag/AgCl reference electrode, 2) a platinum plate as a counter electrode, and 3) a seed layer as a working electrode. In this study, we changed the concentration of a plating electrolyte that was composed of $CuSO_4$, $H_2SO_4$ and HCl. The resistivity was measured with a four-point probe and the material properties were investigated by using XRD(X-ray Diffraction), an AFM(Atomic Force Microscope), a FE-SEM(Field Emission Scanning Electron Microscope) and an XPS(X-ray Photoelectron Spectroscopy). From the results, we concluded that the increase of the concentration of electrolytes led to the increase of the film density and the decrease of the electrical resistivity of the electroplated Cu film.

• Journal of the Optical Society of Korea
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• v.19 no.3
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• Progress in Superconductivity and Cryogenics
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• v.10 no.4
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• pp.6-8
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• 2008

$Y_{2}O_{3}$ nanodots have been deposited on top of the substrate surface using rf-sputtering method. This approach was adopted to be able to modulate the substrate surface with nanodots used as a seed for the flux pinning sites in the superconducting films. The nanodot density of $Y_{2}O_{3}$ was controlled mainly using the deposition time, rf-power, and substrate temperature. $Y_{2}O_{3}$ nanodots with ${\sim}\;50\;nm$ in diameter and ${\sim}\;3\;nm$ in height were obtained at rf-sputtering time of about 15 seconds using 400 watts of rf-power and $630^{\circ}C$ of substrate temperature. As deposition time increased up to about 30 seconds, the interconnected islands of $Y_{2}O_{3}$ nanodots formed, which can be clearly observed with AFM surface image. The substrate surface was covered entirely with $Y_{2}O_{3}$ layer above the deposition time of 60 seconds. The modulated surface morphologies and cross section analysis of deposited $Y_{2}O_{3}$ nanodots at various experimental conditions have been examined using AFM and discussed with respect to the flux pinning sites for the practical application.

• Progress in Superconductivity and Cryogenics
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• v.12 no.4
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• pp.17-19
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• 2010

In this work, the optimized process condition of chemical solution deposition which is used to planarize the surface of the metal tape (which is used to grow IBAD-MgO texture template) was investigated. $Y_2O_3$ films were dip-coated on the surface of the unpolished metal tape as the seed and barrier layer. The effects of $Y_2O_3$ concentration of the solution (0.5wt.%, 1.3wt.%, 2.8wt.%, 5.6wt.%) and the number of coatings on the surface morphology and barrier capability against the diffusion from the metal tape were examined. The surface morphology and the thickness of the film were observed using the scanning electron microscope and the atomic force microscope. The presence of elements in metal tape on the film surface was analyzed using the auger electron spectroscopy. The $Y_2O_3$ film thickness increases with increasing the $Y_2O_3$ concentration in the solution, and the surface became smoother with increasing the number of coating cycles. The best result was obtained from the $Y_2O_3$ film coated 4 cycles using 2.8wt.% solution.

• Journal of Korean Society of Forest Science
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• v.90 no.4
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• pp.565-572
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• 2001

The spatial genetic structure of Needle fir(Abies holophylla Max.) seedlings on forest gap within a Needle fir forest at Mt. Odae in Korea was analyzed on the basis of ISSR(inter-simple sequence repeats) marker analysis. The gap size was $1,500m^2(50m{\times}30m)$, and we sampled 416 one- or two-year-old seedlings by 2m intervals. Some trees at the upper crown layer except Needle firs and all trees at the middle and lower crown layers were removed, and Needle firs at the upper crown layer showed very weak growth strength or to be withering to death. The results of spatial autocorrelation using 31 polymorphic ISSR markers revealed that it was genetically homogeneous within spatial distance of 15.6m and the randomness of genetic distribution was from 15.6m to 31.2m. The genetic patch size of seedlings in forest gap might be restricted by the density of mother trees, making allow for the average height of adult Needle firs, the seed dispersal area, and the average distance between adults. For the directionality of seedling distribution, we investigated the variography using 'genetic configuration' which was the value of configuration in Multidimensional Scaling by genetic distance. In directional variogram, the increment of spatial distance from East to West direction was inversely proportional to genetic homogeneity. We presumed that this anisotrophy of seedling distribution at this forest gap resulted from the directionality of seed dispersal rather than the difference of fecundity between mother trees or the microhabitat variation, taking the evenness of forest floor condition, a vast seed production and the random distribution of seedlings at the studied site into consideration.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.363-363
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• 2014

Ruthenium (Ru) has attractive material properties due to its promising characteristics such as a low resistivity ($7.1{\mu}{\Omega}{\cdot}cm$ in the bulk), a high work function of 4.7 eV, and feasibility for the dry etch process. These properties make Ru films appropriate for various applications in the state-of-art semiconductor device technologies. Thus, it has been widely investigated as an electrode for capacitor in the dynamic random access memory (DRAM), a metal gate for metal-oxide semiconductor field effect transistor (MOSFET), and a seed layer for Cu metallization. Due to the continuous shrinkage of microelectronic devices, better deposition processes for Ru thin films are critically required with excellent step coverages in high aspect ratio (AR) structures. In these respects, atomic layer deposition (ALD) is a viable solution for preparing Ru thin films because it enables atomic-scale control of the film thickness with excellent conformality. A recent investigation reported that the nucleation of ALD-Ru film was enhanced considerably by using a zero-valent metallorganic precursor, compared to the utilization of precursors with higher metal valences. In this study, we will present our research results on the synthesis and characterization of novel ruthenium complexes. The ruthenium compounds were easy synthesized by the reaction of ruthenium halide with appropriate organic ligands in protic solvent, and characterized by NMR, elemental analysis and thermogravimetric analysis. The molecular structures of the complexes were studied by single crystal diffraction. ALD of Ru film was demonstrated using the new Ru metallorganic precursor and O2 as the Ru source and reactant, respectively, at the deposition temperatures of $300-350^{\circ}C$. Self-limited reaction behavior was observed as increasing Ru precursor and O2 pulse time, suggesting that newly developed Ru precursor is applicable for ALD process. Detailed discussions on the chemical and structural properties of Ru thin films as well as its growth behavior using new Ru precursor will be also presented.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.19-24
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• 2009

Formation of an adhesion/barrier layer and a seed layer by sputtering techniques followed by electroplating has been one of the most widely used methods for the filling of through-Si via (TSV) with high aspect ratio for 3-D packaging. In this research, the adhesion and diffusion-barrier properties of the $TaN_x$ film deposited by reactive sputtering were investigated. The adhesion strength between Cu film and $SiO_2$/Si substrate was quantitatively measured by $180^{\circ}$ peel test and topple test as a function of the composition of the adhesive $TaN_x$ film. As the nitrogen content increased in the adhesive $TaN_x$ film, the adhesion strength between Cu and $SiO_2$/Si substrate increased, which was attributed to the increased formation of interfacial compound layer with the nitrogen flow rate. We also examined the diffusion-barrier properties of the $TaN_x$ films against Cu diffusion and found that it was improved with increasing nitrogen content in the $TaN_x$ film up to N/Ta ratio of 1.4.