• Development and Reproduction
• /
• v.23 no.2
• /
• pp.171-181
• /
• 2019

To produce healthy and stable seed production, we need to obtain information and understand vision that affects behavior of red spotted grouper. We examined their expression and retinal development during the juvenile development. Short-wavelength sensitive opsin (SWS2), a cone photoreceptor, began to be expressed from lens and ear vesicle formation stage and its expression increased until 10 days after hatching (dah). In case of middle-wavelength sensitive opsin (MWS), its expression was detected at 3 dah and reached the highest level at 21 dah. The expression of long-wavelength sensitive opsin (LWS) was first observed from 3 dah and their expression decreased thereafter. Rhodopsin, a rod photoreceptor, was found to be expressed from 2 dah and its expression reached the highest level at 50 dah. The outer nuclear layer (ONL), inner nuclear layer (INL) and ganglion cell layer began to differentiate at 2 dah, while choroid first appeared at 4 dah so that the eyes became black. These results indicate that the development of retina mostly completes around 4 dah. It seems that the development of the retina and the expression of the opsin genes are closely related to the behavior such as hunting prey, considering that the timing of the completion of the development of the retina, the timing of gene expression, and the timing of completion of yolk absorption are similar.

• Korean Journal of Materials Research
• /
• v.29 no.4
• /
• pp.228-232
• /
• 2019

Copper electroplating and electrode patterning using a screen printer are applied instead of lithography for heterostructure with intrinsic thin layer(HIT) silicon solar cells. Samples are patterned on an indium tin oxide(ITO) layer using polymer resist printing. After polymer resist patterning, a Ni seed layer is deposited by sputtering. A Cu electrode is electroplated in a Cu bath consisting of $Cu_2SO_4$ and $H_2SO_4$ at a current density of $10mA/cm^2$. Copper electroplating electrodes using a screen printer are successfully implemented to a line width of about $80{\mu}m$. The contact resistance of the copper electrode is $0.89m{\Omega}{\cdot}cm^2$, measured using the transmission line method(TLM), and the sheet resistance of the copper electrode and ITO are $1{\Omega}/{\square}$ and $40{\Omega}/{\square}$, respectively. In this paper, a screen printer is used to form a solar cell electrode pattern, and a copper electrode is formed by electroplating instead of using a silver electrode to fabricate an efficient solar cell electrode at low cost.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.57-57
• /
• 2009

반도체 device가 고집적화 및 다층화 되어짐에 따라 현재 사용되고 있는 구리 interconnect의 확산방지막인 Ta/TaN은 많은 문제가 발생하고 있다. 고집적화 된 반도체 소자에 적용시키기에는 Ta/TaN 확산 방지막의 고유 저항값이 매우 크고, 구리의 증착에 필요한 seed layer의 크기도 문제화 된다고 보고되어지고 있다. 이러한 이유로 인해 점차 고집적화 되어지는 반도체 기술에 맞추어 새로운 확산 방지막에 대한 연구가 현재 활발히 이루어지고 있다. 이에 새로운 확산 방지막으로써 대두되고 연구되고 있는 재료가 Ruthenium (Ru)이다. Ru은 공기 중에서 매우 안정하고 고유저항 값 또한 $13\;{\mu}{\Omega}\;cm$의 Ta에 비해 $7.1\;{\mu}{\Omega}\;cm$의 매우 작은 고유저항 특성을 가지고 있다. 또한, Ru은 구리와의 우수한 접착성으로 인해 구리의 interconnect의 형성에 있어 seed layer가 필요하지 않을 뿐만 아니라 높은 annealing 온도에서도 무시할 만큼 작은 solid solubility를 가지며 구리와의 계면에서 새로운 화합물을 형성하지 않으며 annealing시 구리의 delamination을 유발시키지도 않는다. 이에 따라, 평탄화와 소자 분리를 위하여 chemical mechanical planarization (CMP) 공정이 필요하게 되었다. 하지만, Ru의 noble한 성질과 Ru 확산방지막 CMP공정 시 노출되는 다른 이종 물질 사이의 최적화 된 selectivity를 구현하는데 많은 어려움이 있다. 이로인해 Ru 확산 방지막을 위한 CMP slurry에 대한 연구는 아직 미흡한 수준이다. 본 연구에서는 Ru이 확산방지막으로 사용되었을 때 이를 위한 CMP slurry에 대한 평가와 연구가 이루어졌다. Slurry 조성과 농도 및 pH에 따른 전기 화학적 분석을 통하여 slurry 내에서 각각의 막질들이 어떠한 상태로 존재하는지 분석해 보았다. 또한, Ru을 비롯한 이종막질들의 etch rate, removal rate와 selectivity에 대한 연구가 진행되었다. 최종적으로 Ru 확산방지막 CMP를 위한 최적화된 slurry를 제안하였다.

• Clean Technology
• /
• v.17 no.2
• /
• pp.103-109
• /
• 2011

The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.

• Korean Journal of Poultry Science
• /
• v.26 no.4
• /
• pp.217-236
• /
• 1999

Among polyunsaturated fatty acids (PURAs) targeted for manipulation in animal tissues (poultry eggs and meat), omega-3 PUFAs(n-3 PUFAs) are discussed in this review. 3 or 5% dietary menhaden oil (MO) supplemented layer diets was reported to increase docosahexaenoic acid (DHA) and eicosapentaenoic acid (EPA) contents in the egg. MO at 1.5% also increased the deposition of up to 180mg total omega-3 fatty acids / yolk. Utilization of 5% ground flax seed (FS) resulted in similar total omega-3 fatty acid (FA) deposition as 1.5% MO. However, the basic feed formulations used in the Canadian feed industry usually include 10 to 20% FS in the egg laying diets. Recently several studies reported that addition of tocopherols in layer diets increased the tocopherol content more in the egg than any other tissue. One of reports said that 3.5% dietary oil with added tocopherols resulted in increasing tocopherol deposition and FA composition of the egg and other tissues. In the poultry meat, redfish meal (RM;4, 8, 12, 15 and 30% of diet) or redfish oil (RO;2.1 or 4.2% of diet) added to the practical corn-wheat-soybean based diets resulted in an increase in omega-3 FA and docosapentaenoic acid (DPA) contents in broiler meat lipids. Linseed oil (LO;1.0, 2.5, and 5.0% of broiler diet) supplemented in broiler diets also resulted in omega-3 FA and the ratio of omega-6 being significantly higher in poultry meat lipid than MO. Concern about fish flavor resulted in research about fish oil (FO) supplementation in broiler diets. Without the use of antioxidants, no more than 1.5% FO should be fed to broilers due to unacceptable orders from the chicken carcasses. One recent research project found that over 50mg/kg of vitamin E was required for maintaining the stability of unsaturated lipids in the meat. In regards to 'fishy'or 'crabby'taint in the eggs and poultry meat, poultry products remained acceptable when dietary fish oils were stabilized with antioxidants.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.420-420
• /
• 2012

ZnO seed layer were deposited on quartz substrate by sol-gel method and prism-like Al-doped ZnO nanorods (AZO nanorods) were grown on ZnO seed layer by hydrothermal method with various Al concentration ranging from 0 to 2.0 at.%. Structural and optical properties of the AZO nanorods were investigated by field-emission scanning electron microscopy (FE-SEM), X-ray diffraction (XRD), photoluminescence (PL). The diameter of the AZO nanorods was smaller than undoped ZnO nanorods and its diameter of the AZO nanorods decreased with increasing Al concentration. In XRD spectrum, it was observed that stress and full width at half maximum (FWHM) of the AZO nanorods decreased and the 'c' lattice constant increased as the Al concentration increased. From undoped ZnO nanorods, it was observed that the green-red emission peak of deep-level emission (DLE) in PL spectra. However, after Al doping, not only a broad green emission peak but also a blue emission peak of DLE were observed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.7
• /
• pp.575-579
• /
• 2010

The technologies of Ni/Cu plating contact is attributed to the reduced series resistance caused by a better contact conductivity of Ni with Si and the subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading was combined with the lower resistance of a metal silicide contact and an improved conductivity of the plated deposit. This improves the FF (fill factor) as the series resistance is reduced. This is very much requried in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A Selective emitter structure with highly dopeds regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing In this paper the formation of a selective emitter, and the nickel silicide seed layer at the front side metallization of silicon cells is considered. After generating the nickel seed layer the contacts were thickened by Cu LIP (light induced plating) and by the formation of a plated Ni/Cu two step metallization on front contacts. In fabricating a Ni/Cu plating metallization cell with a selective emitter structure it has been shown that the cell efficiency can be increased by at least 0.2%.

• Journal of Life Science
• /
• v.9 no.2
• /
• pp.127-135
• /
• 1999

Gentiana scabra Bunge var buergeri Max, can be widely used such as cut-flower, ornamental and medicinal plant among the native plants. Microscopic and Scanning electron microscopic observation plant were carried out to estimates the characteristics correlated with germinability and germination process, and the results were as follows. The seeds were germinated just after harvest, and it means that there is no or little dormancy of the seeds. Matured seeds showed higher germinability than those of immatured. As the storage period was longer, immatured seeds showed shorter longevity than those of matured. The average longevity was about 190 days. According to the observation results of morphological changes during the germination, seed coat was expanded with water absorption immediately after seeding, and radicals were observed 2 days after seeding. Root hairs were formed behind the growing tip of the root on 4 days after seeding and cotyledon were unfolded on 6 days after seeding. In the microscopic observation of leaf tissues, it could be easily distinguished between midrib, and leaf blade, and also observed upper epidermis, palisade parenchyma and spongy parenchyma consisted as a sing1e layer. Palisade parenchyma was consisted of a single layer of cell. Stomata were restricted lower surface, arranged as anamocytic type, and surrounded by guard cells. In the microscopic anatomy of stem were consisted of cortical layer, forming a single layer of epidermis and parenchyma, and vascular bundle which was consisted of continuous cylinder of vascular tissues.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.18 no.5
• /
• pp.475-480
• /
• 2017

In this paper, the conductivity of the fine pattern is improved in the insulating substrate by laser-induced forward transfer (LIFT) process. The high laser beam energy generated in conventional laser induced deposition processes induces problems such as low deposition density and oxidation of micro-patterns. These problems were improved by using a polymer coating layer for improved deposition accuracy and conductivity. Chromium and copper were used to deposit micro-patterns on silicon wafers. A multi-pulse laser beam was irradiated on a metal thin film to form a seed layer on an insulating substrate(SiO2) and electroless plating was applied on the seed layer to form a micro-pattern and structure. Irradiating the laser beam with multiple scanning method revealed that the energy of the laser beam improved the deposition density and the surface quality of the deposition layer and that the electric conductivity can be used as the microelectrode pattern. Measuring the resistivity after depositing the microelectrode by using the laser direct drawing method and electroless plating indicated that the resistivity of the microelectrode pattern was $6.4{\Omega}$, the resistance after plating was $2.6{\Omega}$, and the surface texture of the microelectrode pattern was uniformly deposited. Because the surface texture was uniform and densely deposited, the electrical conductivity was improved about three fold.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.79-84
• /
• 2010

Formation of TSV (Through-Si-Via) with an Au seed layer and Cu filling to the via, simplification of bumping process for three dimensional stacking of Si dice were investigated. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process using $SF_6$ and $C_4F_8$ plasmas alternately. The vias were 40 ${\mu}m$ in diameter, 80 ${\mu}m$ in depth, and were produced by etching for 1.92 ks. On the via side wall, a dielectric layer of $SiO_2$ was formed by thermal oxidation, and an adhesion layer of Ti, and a seed layer of Au were applied by sputtering. Electroplating with pulsed DC was applied to fill the via holes with Cu. The plating condition was at a forward pulse current density of 1000 mA/$dm^2$ for 5 s and a reverse pulse current density of 190 mA/$dm^2$ for 25 s. By using these parameters, sound Cu filling was obtained in the vias with a total plating time of 57.6 ks. Sn bumping was performed on the Cu plugs without lithography process. The bumps were produced on the Si die successfully by the simplified process without serious defect.