• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.12
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• pp.1911-1919
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• 2012

In this paper, we focus on a robotic sealing process in which three robots are used. Each robot can be considered as a 7 axis redundant robot of which the first joint is prismatic and the last 6 joints are revolute. In the factory floor, robot path planning is not a simple problem and is not automated. They need experienced operators who can operate robots by teaching and playing back fashion. However, the robotic sealing process is well organized so the relative positions and orientations of the objects in the floor and robot paths are all pre-determined. Therefore by adopting robotic theory, we can optimally plan robot pathes without using teaching. In this paper, we analyze the sealing robot by using redundant manipulator theory and propose three different methods for path planning. For sealing paths outside of a car body, we propose two methods. The first one is resolving redundancy by using pseudo-inverse of Jacobian and the second one is by using weighted pseudo-inverse of Jacobian. The former is optimal in the sense of energy and the latter is optimal in the sense of manipulability. For sealing paths inside of a car body, we must consider collision avoidance so we propose a performance index for that purpose and a method for optimizing that performance index. We show by simulation that the proposed method can avoid collision with faithfully following the given end effector path.

• Korean Journal of Plant Resources
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• v.7 no.2
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• pp.183-186
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• 1994

This study was conducted to investigate desirable storage method to major chinese herbal medicine materials, Moutan Radicis Cortex in different packing materials and sealing degree. The loss in weight of Moutan Radicis Cortex as influenced by packing materials was the lowest at complete sealing treatment with transparent or black polyethylene film. The rot ratio of Moutan Radicis Cortex during the storage period was not difference between packing materials, transparent and black polyethylene film, but rot ratio of complete sealing condition was lower than punch ($\phi$J5mm) on polyethylene film.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2004.11a
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• pp.237-240
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• 2004

Sulfur Hexafluoride, SF6 is widely used for leak detection and as a gaseous dielectric in transformers, condensers and circuit breakers. SF6 gas is also effective as a cleanser in the semiconductor industry. This paper presents a numerical study of the sealing force of disk type seal in SF6 gas safety valve. The sealing force on the disk seal is analyzed by the FEM method based on the Taguch's experimental design technique. Disk seals in SF6 gas safety valve are designed with 9 design models based on 3 different contact length, compressive ratio and gas pressure. The calculated results of Cauchy stress and strain showed that the sealing characteristics of Teflon PTFE is more effective compared to that of FKM(Viton), which is related to the stiffness of the materials. And also, the contact length of the disk seal is important design parameter for sealing the SF6 gas leakage in the safety valve.

• Tribology and Lubricants
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• v.21 no.5
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• pp.201-208
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• 2005

This paper presents the FEM analysis on the contact behavior characteristics of mechanical face seals in a small hydro-power turbine. Especially, the axial displacement and contact normal stress between a seal ring and a seal seat of a primary sealing unit have been analyzed as functions of rotating speed of a hydro-turbine, sealing gap, water and cooling fluid temperature. Those are strongly related to a leakage of water and wear between a seal ring and a seal seat. The FEM computed results present that the rotating speed of a hydro-turbine may be kept less than 800 rpm, and the sealing gap in a primary sealing unit is restricted $0.5\~5$. The coolant temperature in which is most influential parameter to the contact behaviors of a sealing unit may be kept less than $15^{\circ}C$ for a safe operation of a sealing unit without a leakage and wear.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.

• Journal of the Korean Ceramic Society
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• v.43 no.9 s.292
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• pp.544-551
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• 2006

The sealing technique between a glass tube and a copper heat pipe in an evacuated tube solar collector is studied. In this study two different sealing techniques, such as flame method and furnace firing, are examined. After the sealing of a copper to a glass, the oxidation state of the copper and its bonding morphology were examined by SEM and XRD. Its oxidation was retarded by coating of borate solution on the copper, and $Cu_2O(cuprite)$ turned into CuO(tenorite) with increase in a firing temperature and firing time. Porous structure was found in the oxide layer when CuO formed. The best sealing morphology was observed when the thickness of the oxidation layer was less than $20{\mu}m$. The sealing technique performed in a furnace was promising and the satisfactory result was obtained when the sample was fired at $950^{\circ}C$ for 5 min under $N_2$ atmosphere. Annealing procedure is recommended to remove the stress left at the bonding zone.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.819-823
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• 2016

DSSC (dye-sensitized solar cell) is expected to be one of the next-generation photovoltaics because of its environment-friendly and low-cost properties. However, commercialization of DSSC is difficult because of the electrolyte leakage. We propose thermal curable base on silicon resin and apply a unit cell and large area ($200{\times}200mm$) dye-sensitized solar cell. The resin aimed at sealing of DSSC and gives a promising resolution for sealing of practical DSSC. In result, the photoelectric conversion efficiency of the unit cell and the module was 6.63% and 5.49%, respectively. In the durability test result, the photoelectric conversion efficiency of the module during 500, 1,000, 1,500 and 2,000 hours was 0.73%, 0.73%, 1.82% and 2.36% respectively. It was confirmed that the photoelectric conversion efficiency characteristics are constant. We have developed encapsulation material of thermal curing method excellent in chemical resistance. A sealing material was applied to the dye-sensitized solar cell and it solved the problem of durability the dye-sensitized solar cell. Sealing material may be applied to verify the possibility of practical application of the dye-sensitized solar cell.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.32 no.4D
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• pp.377-386
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• 2012

Crack sealing has been widely used in the pavement maintenance due to its advantage of repairing the cracks at the preliminary stages. However, it has been analyzed that the crack sealing work process is dangerous and labor intensive. Moreover, quality and productivity of crack sealing work are highly depended on labor experience and skills. Therefore, various crack sealing machines have been researched but revealed many limitations in practical application. This research analyses conventional crack sealing work process and previously developed crack sealing machines in order to develop an automated pavement crack sealing machine which can be practically and widely applied in the construction fields. This paper develops the previously proposed conceptual design by drawing detailed designs and fabricating the hardware(manipulator and end-effector) of the automated pavement crack sealing machine. The crack sealing machine suggested in this paper overcomes limitations of existing crack sealing machines and designed to meet the domestic road conditions and regulations. It is expected that automating the conventional crack sealing method contributes to the improvement of quality, economy and reduce accidents.

• Journal of the Korean Institute of Gas
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• v.18 no.4
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• pp.51-55
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• 2014

This paper was analyzed for a sealing characteristics of single lip contact type o-ring and multiple lip contact type packing for a swivel joint using the finite element method. According to the FE analysis, a conventional o-ring produces a maximum contact normal stress of 2.5MPa for a supplied LP gas pressure of 1.8MPa, which is related to the sealing performance. But, a sealing performance of newly invented multi-lip packing produces a maximum contact normal stress of 3.01MPa, which is 20.4% higher than that of a conventional o-ring. And an extrusion of a conventional o-ring, which is strongly related to the sealing endurance safety, was occurred at a supplied gas pressure of 1.62MPa. But, a multi-lip packing does not produce up to the gas pressure of 1.8MPa. This means that a new type of multi-lip packing may have excellent sealing characteristics because of no extrusion for high gas pressure. Thus, multi-lip packing with multiple lip contacts may be useful for high sealing and endurance safety compared to that of the conventional o-ring with a single lip contact.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.181-185
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• 2016

One of the important issues for fabricating the microelectronic display devices such as FED, PDP, and VFD is to obtain a high vacuum level inside the panel. In addition, sustaining the initial high vacuum level permanently is also very important. In the conventional packing technology using a tabulation method, it is not possible to obtain a satisfiable vacuum level for a proper operation. In case of FED, the poor vacuum level results in the increase of operating voltage for electron emission from field emitter tips and an arcing problem, resultantly shortening a life time. Furthermore, the reduction of a sealing process time in the PDP production is very important in respect of commercial product. The most probable method for obtaining the initial high vacuum level inside the space with such a miniature and complex geometry is a vacuum in-line sealing which seals two glass plates within a high vacuum chamber. The critical solution for the vacuum sealing is to develop a frit glass to avoid the bubbling or crack problems during the sealing process at high temperature of about $400^{\circ}C$ under the vacuum environment. In this study, the suitable frit power was developed using a mixture of vitreous and crystalline type frit powders, and a vacuum sealed CNT FED with 2 inch diagonal size was fabricated and successfully operated.