• Title/Summary/Keyword: Schottky gate

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Study on DC Analysis of 4H-SiC Recessed-Gate MESFETs using modeling tools (4H-SiC Recessed-gate MESFET의 DC특성 모델링 연구)

  • Park, Seung-Wook;Kang, Soo-Chang;Park, Jae-Young;Shin, Moo-Whan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.238-242
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    • 2001
  • In this paper, the current-voltage characteristics of a 4H-SiC MESFET is simulated by using the Atlas Simulation tool. we are able to use the simulator to extract more information about the new material 4H-SiC, including the mobility, velocity-field Curve and the Schottky barrier height. We have enabled and used the new simulator to investigate breakdown Voltage and thus predict operation limitiations of 4H-SiC device. Modeling results indicate that the Breakdown Voltage is 197 V and Current is 100 mA

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Study on Noise Behavior of GaAs SBGFET (GaAs SBGFET의 잡음동작에 관한 연구)

  • 박한규
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.14 no.3
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    • pp.6-11
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    • 1977
  • The noise behavior of the Schottky Barrier Gate FET has been investigated by the use of noise equivalent circuit. It has been found that an additional noise source has to be taken into account in the GaAs SBGFET's biased in the pinch-off region; the intervalley scattering noise and the hot electron noise. In this paper, a noise equivalent circuit has been used to determine the noise parameter which was taken into account influence of the saturation velocity of carrier and parasitic resistance.

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Study on DC Analysis of 4H-SiC Recessed-Gate MESFETs using modeling tooths (4H-SiC Recessed-gate MESFET의 DC특성 모델링 연구)

  • 박승욱;강수창;박재영;신무환
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.238-242
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    • 2001
  • In this paper, the current-voltage characteristics of a 4H-SiC MESFET is simulated by using the Atlas Simulation tool. we are able to use the simulator to extract more information about the new material 4H-SiC, including the mobility, velocity-field Curve and the Schottky barrier height. We have enabled and used the new simulator to investigate breakdown Voltage and thus predict operation limitations of 4H-SiC device. Modeling results indicate that the Breakdown Voltage is 197 V and Current is 100 mA

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Multiplexer as selector to select different speed (Normal speed, High speed and Super high speed) to display CAR at different speed to color TV system

  • Adhikari, Ganesh
    • International Journal of Advanced Culture Technology
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    • v.10 no.3
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    • pp.332-338
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    • 2022
  • The article presents a concept of designing a Multiplexer circuit which acts as a "Selector" and that becomes capable to select different speed created at different TTL Gate configurations; Standard TTL(Normal Speed), High Speed TTL(High Speed), Schottky TTL(Super High Speed) and further connect the selected Gate speed to the CAR shape created using C-Programming at Computer Graphics and finally CAR shape display at different speed to the color TV. The Multiplexer supporting efficient and more reliable selection criteria using "Logical based selection criteria" and further the output from multiplexer is provided to CAR shape created using c-programming and finally CAR shape is display to color TV system. Basic purposes and assumptions regarding the design and development of this system as well as a description of its operation have been presented.

Cryogenic voltage sampling for arbitrary RF signals transmitted through a 2DEG channel

  • Kim, Min-Sik;Kim, Bum-kyu;Kim, U.J.;Choi, H.K.;Kim, Ju-Jin;Bae, Myung-Ho
    • Progress in Superconductivity and Cryogenics
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    • v.24 no.2
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    • pp.23-26
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    • 2022
  • A lossless transport of an arbitrary waveform in a frequency range of 106-109 Hz through a conduction channel in a cryogenic temperature is of importance for a high-speed operation of quantum device. However, it is hard to use a commercial oscilloscope to directly detect the waveform travelling in a device located in a cryogenic system. Here, we developed a cryogenic voltage sampling technique by using a Schottky barrier gate prepared on a surface of a GaAs/AlGaAs device, which revealed that an incident rectangle waveform can transport through a 1 mm long two-dimensional conduction channel without waveform deformation up to 20 MHz, while further study is needed to increase the detection frequency.

Schottky Barrier Free Contacts in Graphene/MoS2 Field-Effect-Transistor

  • Qiu, Dongri;Kim, Eun Kyu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.209.2-209.2
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    • 2015
  • Two dimensional layered materials, such as transition metal dichalcogenides (TMDs) family have been attracted significant attention due to novel physical and chemical properties. Among them, molybdenum disulfide ($MoS_2$) has novel physical phenomena such as absence of dangling bonds, lack of inversion symmetry, valley degrees of freedom. Previous studies have shown that the interface of metal/$MoS_2$ contacts significantly affects device performance due to presence of a scalable Schottky barrier height at their interface, resulting voltage drops and restricting carrier injection. In this study, we report a new device structure by using few-layer graphene as the bottom interconnections, in order to offer Schottky barrier free contact to bi-layer $MoS_2$. The fabrication of process start with mechanically exfoliates bulk graphite that served as the source/drain electrodes. The semiconducting $MoS_2$ flake was deposited onto a $SiO_2$ (280 nm-thick)/Si substrate in which graphene electrodes were pre-deposited. To evaluate the barrier height of contact, we employed thermionic-emission theory to describe our experimental findings. We demonstrate that, the Schottky barrier height dramatically decreases from 300 to 0 meV as function of gate voltages, and further becomes negative values. Our findings suggested that, few-layer graphene could be able to realize ohmic contact and to provide new opportunities in ohmic formations.

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$RuO_2$ Related Schottky contact for GaN/AlGaN device

  • Jung, Byung-Kwon;Kim, Jung-Kyu;Lee, Jung-Hee;Hahm, Sung-Ho
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2002.11a
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    • pp.85-90
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    • 2002
  • $RuO_2$/GaN and related contacts were investigated for Schottky contacts in GaN-Based optical and electronic devices. We demonstrated that an $RuO_2$ film forms a stable Schottky contact on a GaN layer with a barrier height (${\Phi}_B$) of 1.46 eV and transmittance of 70% in the visible and near UV region. $RuO_2$/GaN Schottky diode showed a breakdown at over -50V and leakage current of only 0.3 nA at -5V. The $RuO_2$/GaN Schottky type photodetector had the UV/Visible rejection ratio of over $10^5$ and the responsivity of 0.23 A/W at 330 nm. The $RuO_2$ gate AlGaN/GaN EFET exhibited high drain current ($I_d$) of 689.3 mA/mm and high transconductance ($g_m$) of 197.4 mS/mm. Cut-Off frequency ($f_t$) and maximum operating frequency ($f_{max}$) were measured as 27.0 GHz and 45.5 GHz, respectively.

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UV Responsive Characteristics of n-Channel Schottky Barrier MOSFET with ITO as Source/Drain Contacts

  • Kim, Tae-Hyeon;Lee, Chang-Ju;Kim, Dong-Seok;Sung, Sang-Yun;Heo, Young-Woo;Lee, Jung-Hee;Hahm, Sung-Ho
    • Journal of Sensor Science and Technology
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    • v.20 no.3
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    • pp.156-161
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    • 2011
  • We fabricated a schottky barrier metal oxide semiconductor field effect transistor(SB-MOSFET) by applying indium-tin-oxide(ITO) to the source/drain on a highly resistive GaN layer grown on a silicon substrate. The MOSFET, with 10 ${\mu}M$ gate length and 100 ${\mu}M$ gate width, exhibits a threshold gate voltage of 2.7 V, and has a sub-threshold slope of 240 mV/dec taken from the $I_{DS}-V_{GS}$ characteristics at a low drain voltage of 0.05 V. The maximum drain current is 18 mA/mm and the maximum transconductance is 6 mS/mm at $V_{DS}$=3 V. We observed that the spectral photo-response characterization exhibits that the cutoff wavelength was 365 nm, and the UV/visible rejection ratio was about 130 at $V_{DS}$ = 5 V. The MOSFET-type UV detector using ITO, has a high UV photo-responsivity and so is highly applicable to the UV image sensors.

Schottky barrier Thin-Film-Transistors crystallized by Excimer laser annealing and solid phase crystallization method (ELA 결정화와 SPC 결정화를 이용한 쇼트키 장벽 다결정 실리콘 박막 트랜지스터)

  • Shin, Jin-Wook;Choi, Chel-Jong;Cho, Won-Ju
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.129-130
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    • 2008
  • Polycrystalline silicon (poly-Si) Schottky barrier thin film transistors (SB-TFT) are fabricated by erbium silicided source/drain for n-type SB-TFT. High quality poly-Si film were obtained by crystallizing the amorphous Si film with excimer laser annealing (ELA) or solid phase crystallization (SPC) method. The fabricated poly-Si SB-TFTs have a large on/off current ratio with a low leakage current. Moreover, the electrical characteristics of poly-Si SB TFTs are significantly improved by the additional forming gas annealing in 2 % $H_2/N_2$, because the interface trap states at the poly-Si grain boundaries and at the gate oxide/poly-Si channel decreased.

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Schottky Barrier Thin Film Transistor by using Platinum-silicided Source and Drain (플레티늄-실리사이드를 이용한 쇼트키 장벽 다결정 박막 트랜지스터)

  • Shin, Jin-Wook;Chung, Hong-Bay;Lee, Young-Hie;Cho, Won-Ju
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.6
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    • pp.462-465
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    • 2009
  • Schottky barrier thin film transistors (SB-TFT) on polycrystalline silicon(poly-Si) are fabricated by platinum silicided source/drain for p-type SB-TFT. High quality poly-Si film were obtained by crystallizing the amorphous Si film with excimer laser annealing (ELA) or solid phase crystallization (SPC) method, The fabricated poly-Si SB-TFTs showed low leakage current level and a large on/off current ratio larger than 10), Significant improvement of electrical characteristics were obtained by the additional forming gas annealing in 2% $H_2/N_2$ ambient, which is attributed to the termination of dangling bond at the poly-Si grain boundaries as well as the reduction of interface trap states at gate oxide/poly-Si channel.