• 제목/요약/키워드: Schottky diodes

검색결과 159건 처리시간 0.026초

고전압 Ti/4H-SiC 쇼트키 장벽 다이오드 제작 및 특성분석 (High Voltage Ti/4H-SiC Schottky Rectifiers)

  • 김창교;양성준;이주헌;노일호;조남인;김남균;김은동
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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    • pp.834-838
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    • 2002
  • In this paper, we have fabricated 4H-SiC schottky diodes utilizing a metal-oxide overlap structure for electric filed termination. The barrier height and Ideality factor were measured by current-voltage, capacitance-voltage characteristics. Schottky barrier height(SBH) were 1.41ev for Ni and 1.35eV for Pt, 1.52eV for Pt/Ti at room temperature and Pt/Ti Schottky diode exhibited Ideality factor was 1.06 to 1.4 in the range of $25^{\circ}C{\sim}200^{\circ}C$. To improve the reverse bias characteristics, an edge termination technique is employed for Pt/Ti/4H-SiC Schottky rectifiers and the device show excellent characteristics with higher blocking voltage up to 780V compared with unterminated devices.

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온도에 따른 4H-SiC에 기반한 SBD, PiN 특성 비교 (Temperature-Dependent Characteristics of SBD and PiN Diodes in 4H-SiC)

  • 서지호;조슬기;이영재;안재인;민성지;이대석;구상모;오종민
    • 한국전기전자재료학회논문지
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    • 제31권6호
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    • pp.362-366
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    • 2018
  • Silicon carbide is widely used in power semiconductor devices owing to its high energy gap. In particular, Schottky barrier diode (SBD) and PiN diodes fabricated on 4H-SiC wafers are being applied to various fields such as power devices. The characteristics of SBD and PiN diodes can be extracted from C-V and I-V characteristics. The measured Schottky barrier height (SBH) was 1.23 eV in the temperature range of 298~473 K, and the average ideal factor is 1.17. The results show that the device with the Schottky contact is characterized by the theory of thermal emission. As the temperature increases, the parameters are changed and the Vth is shifted to lower voltages.

필드 플레이트가 설계된 다이아몬드 쇼트키 장벽 다이오드 (Diamond Schottky Barrier Diodes With Field Plate)

  • 장해녕;강동원;하민우
    • 전기학회논문지
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    • 제66권4호
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    • pp.659-665
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    • 2017
  • Power semiconductor devices required the low on-resistance and high breakdown voltage. Wide band-gap materials opened a new technology of the power devices which promised a thin drift layer at an identical breakdown voltage. The diamond had the wide band-gap of 5.5 eV which induced the low power loss, high breakdown capability, low intrinsic carrier generation, and high operation temperature. We investigated the p-type pseudo-vertical diamond Schottky barrier diodes using a numerical simulation. The impact ionization rate was material to calculating the breakdown voltage. We revised the impact ionization rate of the diamond for adjusting the parallel-plane breakdown field at 10 MV/cm. Effects of the field plate on the breakdown voltage was also analyzed. A conventional diamond Schottky barrier diode without field plate exhibited the high forward current of 0.52 A/mm and low on-resistance of $1.71{\Omega}-mm$ at the forward voltage of 2 V. The simulated breakdown field of the conventional device was 13.3 MV/cm. The breakdown voltage of the conventional device and proposed devices with the $SiO_2$ passivation layer, anode field plate (AFP), and cathode field plate (CFP) was 680, 810, 810, and 1020 V, respectively. The AFP cannot alleviate the concentration of the electric field at the cathode edge. The CFP increased the breakdown voltage with evidences of the electric field and potential. However, we should consider the dielectric breakdown because the ideal breakdown field of the diamond is higher than that of the $SiO_2$, which is widely used as the passivation layer. The real breakdown voltage of the device with CFP decreased from 1020 to 565 V due to the dielectric breakdown.

UHF RFID 태그 칩용 저전력, 저면적 256b EEPROM IP 설계 (Design of a Low-Power and Low-Area EEPROM IP of 256 Bits for an UHF RFID Tag Chip)

  • 강민철;이재형;김태훈;장지혜;하판봉;김영희
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2009년도 춘계학술대회
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    • pp.671-674
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    • 2009
  • 본 논문에서는 수동형 UHF RFID 태그 칩에 사용되는 저전력, 저면적 256b 비동기식 EEPROM을 설계 하였다. 먼저 EEPROM의 저전력 특성을 얻기 위해 1.8V의 공급전압을 사용하였고, 저전압 특성을 갖는 N-type Schottky Diode를 사용하여 Dickson Charge pump를 설계하였다. 그리고 주변회로에서의 저면적 설계를 위해 비동기식 인터페이스 방식과 Separate I/O 방식을 사용하였다. 그리고 DC-DC 변환기의 면적을 줄이기 위하여 Schottky Diode를 사용한 Dickson Charge Pump를 설계하였다. $0.18{\mu}m$ EEPROM 공정을 이용하여 설계된 16 행 ${\times}$ 16 열의 어레이를 갖는 256b EEPROM의 레이아웃 면적은 $311.66{\times}490.59{\mu}m^2$이다.

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Pentacene을 이용한 diode의 제작 및 전기적 특성 (Fabrication and Electrical Characterization of Pentacene-based diodes)

  • 김대식;이용수;박재훈;최종선;강도열
    • 한국진공학회지
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    • 제9권4호
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    • pp.379-381
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    • 2000
  • Organic materials have potential advantages to be utilized as semiconductors in field effect transistors and light emmiting diodes. Gold, Aluminium, Silver, Chromium and Indium are used by electrodes. Gold is ohmic contact and the others are schottky contact. In this study, Pentacene and various electrode materials were deposited by Organic Molecular Beam Deposition (OMBD) and vacuum evaporation respectively. Those films were photolithographically patterned for measurements. These devices showed no degration after a 15 days of storage in laboratory environment.

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Modification of Schottky Barrier Properties of Ti/p-type InP Schottky Diode by Polyaniline (PANI) Organic Interlayer

  • Reddy, P.R. Sekhar;Janardhanam, V.;Jyothi, I.;Yuk, Shim-Hoon;Reddy, V. Rajagopal;Jeong, Jae-Chan;Lee, Sung-Nam;Choi, Chel-Jong
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제16권5호
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    • pp.664-674
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    • 2016
  • The electrical properties of Ti/p-type InP Schottky diodes with and without polyaniline (PANI) interlayer was investigated using current-voltage (I-V) and capacitance-voltage (C-V) measurements. The barrier height of Ti/p-type InP Schottky diode with PANI interlayer was higher than that of the conventional Ti/p-type InP Schottky diode, implying that the organic interlayer influenced the space-charge region of the Ti/p-type InP Schottky junction. At higher voltages, the current transport was dominated by the trap free space-charge-limited current and trap-filled space-charge-limited current in Ti/p-type InP Schottky diode without and with PANI interlayer, respectively. The domination of trap filled space-charge-limited current in Ti/p-type InP Schottky diode with PANI interlayer could be associated with the traps originated from structural defects prevailing in organic PANI interlayer.

Pd/다결정 3C-SiC 쇼트키 다이오드형 수소센서의 제작 (Fabrication of Pd/poly 3C-SiC Schottky diode hydrogen sensors)

  • 정동용;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.236-236
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    • 2009
  • This paper describes the fabrication and characteristics of Schottky micro hydrogen sensors for high temperatures by using polycrystalline(poly) 3C - SiC thin film grown on Si substrates with thermal oxide layer using APCVD. Pd/poiy 3C-SiC Schottky diodes were made and evaluated by I-V and C-V measurements. Electric current density and barrier height voltage were $2\times10^{-3}\;A/cm^2$ and 0.58 eV, respectively. These devices could operate stably at about $400^{\circ}C$. According to $H_2$ concentrations, their barrier height($\Phi_{Bn}$) were changed 0.587 eV, 0.579 eV, 0.572 eV and 0.569 eV, respectively. the current was increased. Characteristics of implemented sensors have been investigated in terms of sensitivity, linearity of response, response rate and response time. Therefore, from these results, Pd/poly 3C-SiC Schottky devices have very high potential for high temperature chemical sensor applications.

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Epitaxial $CoSi_2$접촉 p+/n 접합의 I-V 특성 (I-V Characteristics of Epitaxial $CoSi_2$-contacted p+/n Junctions)

  • 구본철;김시중;김주연;배규식
    • 한국전기전자재료학회논문지
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    • 제13권11호
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    • pp.908-913
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    • 2000
  • CoSi$_2$/p+/n diodes(bilayer diodes) were fabricated by using epitaxial CoSi$_2$grown from Co/Ti bilayer as a diffusion source. The I-V characteristics of p+/n diodes were measured and compared with those of diode made from Co monolayer (monolayer diode). Monolayer diodes showed typical p+n junction characteristics with the leakage current of as low as 10$^{-12}$ A and forward current 6-orders higher than the leakage current, when drive-in annealed at 90$0^{\circ}C$ for 20 sec.. On the other hand, bilayer diodes showed the Schottky-like behaviors with forward currents rather higher than those of monolyer diodes, but with too high leakage currents, when drive-in annealed at $700^{\circ}C$ or higher. However, when the annealing temperature was lowered to $700^{\circ}C$ and annealing time was increased to 60 sec., the leakage current was reduced to 10$^{-11}$ A and thus sho3wed typical diode characteristics. The high leakage currents for diodes annealed at $700^{\circ}C$ or higher was attributed to Shannon contacts formed due to unremoved Co-Ti-Si precipitates. But when annealed at 50$0^{\circ}C$, B ions diffused in the direction of the surface layer, and thus the leakage currents were reduced by removing Shannon contacts.

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동기 정류기를 이용한 클램프 모드 포워드 다중 공진형 컨버터 (Clamp mode forward multi-resonant conveter with synchronous rectifier)

  • 안강순;김희준
    • 전자공학회논문지S
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    • 제34S권2호
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    • pp.112-120
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    • 1997
  • The clamp mode (CM) forward zero voltage switching multi resonant converter (ZVS-MPC) with self-driven synchronous rectifier is studied. The loss at the synchronous rectification stage of the converter is analyzed using MOSFET piecewise linear model and is compared with the loss at the conventional schottky diode rectification stage of th econverter. From the results of the analysis, it is known that the use fo MOSFETs as a synchronous rectifier reduces the loss at the rectification stage overthe whole load range comparing the use of schottky diodes as a conventional rectifier in the converter. In order to verify the validit of the analysis, we have built a 33W(3.3V/10A) CM forward ZVS-MRC with self-driven synchronous rectifier, in which switching frequency is 1MHz, and tested. FRom the experimental results, it is known that the synchronous rectification achieved about 1W improvement in the loss at the rectification stage and about 3% in the efficiency at the converter as compared with the conventional schottky diode rectification.

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