• 전기학회논문지
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• 제61권11호
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• pp.1646-1649
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• 2012

The $O_2$ annealing technique has considerably suppressed the leakage current of GaN power devices, but this forms NiO at Ni-based Schottky contact with increasing on-resistance. The purpose of the present study was to fabricate 1.5 kV GaN Schottky barrier diodes by improving $O_2$-annealing process and GaN buffer. The proposed $O_2$ annealing performed after alloying ohmic contacts in order to avoid NiO construction. The ohmic contact resistance ($R_C$) was degraded from 0.43 to $3.42{\Omega}-mm$ after $O_2$ annealing at $800^{\circ}C$. We can decrease RC by lowering temperature of $O_2$ annealing. The isolation resistance of test structure which indicated the surface and buffer leakage current was significantly increased from $2.43{\times}10^7$ to $1.32{\times}10^{13}{\Omega}$ due to $O_2$ annealing. The improvement of isolation resistance can be caused by formation of group-III oxides on the surface. The leakage current of GaN Schottky barrier diode was also suppressed from $2.38{\times}10^{-5}$ to $1.68{\times}10^{-7}$ A/mm at -100 V by $O_2$ annealing. The GaN Schottky barrier diodes achieved the high breakdown voltage of 700, 1400, and 1530 V at the anode-cathode distance of 5, 10, and $20{\mu}m$, respectively. The optimized $O_2$ annealing and $4{\mu}m$-thick C-doped GaN buffer obtained the high breakdown voltage at short drift length. The proposed $O_2$ annealing is suitable for next-generation GaN power switches due to the simple process and the low the leakage current.

• 전력전자학회논문지
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• 제21권4호
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• pp.351-355
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• 2016

Welding machines are high-capacity systems used in a low-frequency range using IGBT. As their system is similar to a large transformer, most welding machines suffer a great loss because of hard switching and vast leakage inductance. A voltage-balancing circuit is designed to overcome these shortcomings. This circuit can reduce the transformer size by making it into a high frequency and reducing the input voltage by half and by adopting a serial structure that connects two full-bridges in a series to use a MOSFET with a good property at high frequency. In addition, a Schottky diode is used in the primary rectifier to overcome the low efficiency of most welding machines. To use the Schottky diode with a reliably relatively low withstanding voltage, an active snubber is adopted to effectively limit the ringing voltage of the diode cut-off voltage.

• 센서학회지
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• 제8권6호
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• pp.448-453
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• 1999

Pd-SiC 쇼트키 다이오드를 이용한 수소 가스 센서를 개발하였다. Pd-SiC 쇼트키 다이오드의 수소 가스 감지특성을 I-V 및 ${\Delta}I$-t 분석을 통하여 수소 농도와 온도 함수로서 분석하였다. 또한, 수소 흡착에 의한 Pd-SiC 쇼트키 다이오드의 장벽 높이의 변화를 조사하였다. 수소 원자의 흡착이 다이오드의 장벽 높이의 변화와 관계되는 것을 I-V 분석을 이용하여 정상 상태에서의 가스 반응 속도론에 의하여 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.600-600
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• 2013

We have fabricated Cr nanodot Schottky diodes utilizing AAO templates formed on n-Si substrates. Three different sizes of Cr nanodots (about 75.0, 57.6, and 35.8 nm) were obtained by controlling the height of the AAO template. Cr nanodot Schottky diodes showed a rectifying behavior with low SBHs of 0.17~0.20 eV and high ideality factors of 5.6~9.2 compared to those for the bulk diode. Also, Cr nanodot Schottky diodes with smaller diameters yield higher current densities than those with larger diameters. These electrical behaviors can be explained by both Schottky barrier height (SBH) lowering effects and enhanced tunneling current due to the nanoscale size of the Schottky contact. Also, we have fabricated Cr-Si nanorod Schottky diodes with three different lengths (130, 220, and 330 nm) by dry etching of n-Si substrate. Cr-Si nanorod Schottky diodes with longer nanorods yield higher reverse current than those with shorter nanorods due to the enhanced electric field, which is attributed to a high aspect ratio of Si nanorod.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 추계학술대회 논문집 전기물성,응용부문
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• pp.26-28
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• 2001

A Trench schottky diode with guard ring is proposed to improve the forward current density and reverse breakdown voltage. The simulation results by Silvaco have shown that the reverse breakdown voltage of the proposed device was found to be 22.1V while that of conventional trench device was 17.25V. The breakdown voltage of the proposed structure was 28.1% higher than that of the conventional trench structure.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2002년도 동계연구발표회 논문개요집
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• pp.170-171
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• 2002

최근에 스핀트로닉스 주요 관심 소자의 하나인 자성체와 반도체 하이브리드형 쇼트키 장벽 다이오드 (Schottky Barrier Diode; SBD) 소자는 금속과 반도체간의 장벽전압에 의해 다수 전자가 이동하는 현상을 이용한 것으로서 과거에 신호 검파용으로 사용하던 금속 접촉 다이오드와 유사한 구조와 원리를 가진다. 내부 저항이 작고 동작속도가 빨라서 PC의 전원 장치와 같이 고속, 고효율을 요구하는 환경에 많이 사용된다. 쇼트키 장벽 소신호 다이오드와 쇼트키 장벽 정류기의 구분은 불분명하며 보통 0.5 A를 기준으로 구분한다. (중략)

• Journal of Electrical Engineering and Technology
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• 제11권5호
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• pp.1367-1371
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• 2016

• 대한전자공학회논문지SD
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• 제43권5호
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• pp.25-33
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• 2006

전달 행렬 방법과 capacitance-voltage 특성, 그리고 측정된 광응답 스펙트럼을 이용하여 Schottky 다이오드 UV-A와 B 광검출기에 사용되는 GaN, $Al_{0.2}Ga_{0.8}N$ 등의 반도체 및 Schottky 접촉 금속 Ni의 물질특성인 흡수계수(absorption coefficient)를 추출하였다. 입사된 빛이 반도체의 공핍영역에서 흡수되는 양을 구하고, 이로부터 각 파장에서의 광응답 특성을 얻는 과정을 컴퓨터 프로그램으로 구현하였다. 그리고, 계산 값을 측정치와 비교하여 각 파장에서 GaN, $Al_{0.2}Ga_{0.8}N$, Ni의 흡수계수를 얻을 수 있었다. 추출된 흡수계수를 이용하여 자외선 광검출기의 광응답을 높이는 설계 방안을 모색하였다. Ni의 흡수계수가 크기 때문에 광응답을 결정하는 주요 요소는 Ni 전극의 두께이다. 따라서 Schottky 접촉 금속 Ni의 두께를 줄이고, 공핍 영역의 크기를 늘릴 수 있다면 광응답 특성이 더욱 향상된 광검출기의 실현이 가능해질 것이다.

• 센서학회지
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• 제10권4호
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• pp.207-213
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• 2001

A Schottky type GaN ultraviolet photodetector with a mesa structure was fabricated by depositing an Al ohmic contact on an $n^+$-GaN layer and a Pt Schottky contact on a GaN layer. The undoped GaN(0.5um)/$n^-$-GaN(0.1 um)/$n^+$-GaN(1.5 um) multi-layer structure was grown on a sapphire substrate using MOCVD. The Schottky contact properties were characterized for different passivation conditions. The leakage current of the fabricated Schottky diode was 2 nA at a reverse voltage of 5V. Plus the photocurrent was 120uA using a hydrargyrum lamp with an optical power of 1mW at a wavelength of 365 nm. The diode exhibited an ultraviolet-visible rejection ratio of $10^2$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.236-236
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• 2009

This paper describes the fabrication and characteristics of Schottky micro hydrogen sensors for high temperatures by using polycrystalline(poly) 3C - SiC thin film grown on Si substrates with thermal oxide layer using APCVD. Pd/poiy 3C-SiC Schottky diodes were made and evaluated by I-V and C-V measurements. Electric current density and barrier height voltage were $2\times10^{-3}\;A/cm^2$ and 0.58 eV, respectively. These devices could operate stably at about $400^{\circ}C$. According to $H_2$ concentrations, their barrier height($\Phi_{Bn}$) were changed 0.587 eV, 0.579 eV, 0.572 eV and 0.569 eV, respectively. the current was increased. Characteristics of implemented sensors have been investigated in terms of sensitivity, linearity of response, response rate and response time. Therefore, from these results, Pd/poly 3C-SiC Schottky devices have very high potential for high temperature chemical sensor applications.