• 제목/요약/키워드: Scanning speed

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The analysis of arc dispersion and contacts characteristics according to switching of RCD for low voltage (저압용 누전차단기의 스위칭에 따른 아크 비산 및 접점의 특성분석)

  • Kim, Dong-Woo;Kim, Hyang-Kon;Gil, Hyung-Jun;Han, Woon-Ki;Choi, Chung-Seog
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 한국조명전기설비학회 2005년도 춘계학술대회논문집
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    • pp.69-73
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    • 2005
  • The arc dispersion and contacts characteristics were analyzed according to switching off Residual Current Protective Device(RCD) switch. Arc dispersion process was taken by high speed imaging system at a rate of 10,000 frames per second. When RCD was switched from on to off, art was observed and it took about 2.3[ms] from the generation of arc to the extinction of arc. When RCD was switched from off to on, arc was not observed. We repeated switching on and off 1000, 3000 and 6000 times. After repetition, the surface characteristics of contacts were taken by stereo microscope and Scanning Electron Microscope(SEM). From the scattering patterns analysis of arc and the analysis of deteriorated contacts, it could be applicable to the research of electric fire and arc suppression.

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High-Speed Deposition of Diamond Films by DC Plasma Jet (직류 플라즈마 제트를 이용한 고속 다이아몬드 막 증착기술)

  • Kim, Won-Kyu;Whang, Ki-Woong
    • Proceedings of the KIEE Conference
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    • 대한전기학회 1992년도 하계학술대회 논문집 B
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    • pp.949-951
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    • 1992
  • A low pressure DC plasma jet has been used to obtain diamond films from a mixture of $CH_4$ and $H_2$ with high deposition rate (>1$\mu\textrm{m}$/min). The effects of the deposition conditions such as torch geometry, substrate temperature, gas mixing ratio, chamber pressure, axial magnetic field on the diamond film properties such as morphology, purity, uniformity of the film and deposition rate, etc. have been examined with the aid of Scanning Electron Microscopy, X-Ray Diffraction, and Raman Spectroscopy. Both the growth rate and particle size increased rapidly for low methane concentrations but saturated and the morphology changed from octahedral to cubic structure when the concentration exceeded 1.0 %. Higher growth rates (>1.5${\mu}m$/min) can be obtained by applying an axial magnetic field to the DC plasma jet. Diamond obtained from the magnetized plasma jet also shows a sharp peak at 1332.5$cm^{-1}$ in the Raman Spectra and this result implies that higher growth rate with a good quality diamond films can he obtained by applying an external magnetic field to the plasma jet.

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The Effect of Graft using Acrylic Acid on the Detergency for the Nylon 6 Fabric -Improvement of Hemoglobin Removing Rate on Grafted Nylon- (나일론 6 직물의 아크릴산 그라프트 중합과 그라프트 나일론의 세척성 -그라프트 나일론 직물의 헤모글라빈 오구 세척성 향상-)

  • 오수민;김인영;송화순
    • Journal of the Korean Society of Clothing and Textiles
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    • 제23권7호
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    • pp.1064-1072
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    • 1999
  • Nylon fabric was grafted for the purpose of the development of detergency against the hemoglobin as a protein soil. By free-radical producing chemical initiator systems the graft using acrylic acid(AA) as a hydrophilic vinyl monomer was performed to change surface energies in the presence of ammonium persulfate(APS) as an initiator and then acrylic acid grafted Nylon was treated with NaOH solution. The surface morphology for Nylon-g-NaAA with changing graft rate were studied by scanning electron microscopy (SEM) The properties of the Nylon such as diameter tenacity elongation contact angle and the hemoglobin removal were also investigated. The diameter of grafted Nylon fiber increased as the graft ratio increased. The tenacity of grafted Nylon also increased with increasing graft ratio up to 15% The elongation however decreased gradually according to graft, The contact angle decreased after graft and alkaline treatment. The amount of hemoglobin on the grafted Nylon increased in proportion to the graft ratio. Hemoglobin was easily removed from grafted Nylon while it was difficult to be removed from ungrafted Nylon. The detergency of hemoglobin for grafted Nylon decreased when the graft ratio exceeded 15% The removal of hemoglobin increased markedly with increasing hemoglobin content and revolution speed. Therefore the removal of hemoglobin was improved due to graft and alkaline treatment.

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Planar Shock Wave Compaction of Oxidized Copper Nano Powders using High Speed Collision and Its Mechanical Properties (고속 충돌 시 발생하는 평면 충격파를 이용한 산화 나노 분말의 치밀화 및 기계적 특성 평가)

  • Ahn, Dong-Hyun;Kim, Wooyeol;Park, Lee Ju;Kim, Hyoung Seop
    • Journal of Powder Materials
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    • 제21권1호
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    • pp.39-43
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    • 2014
  • Bulk nanostructured copper was fabricated by a shock compaction method using the planar shock wave generated by a single gas gun system. Nano sized powders, average diameter of 100 nm, were compacted into the capsule and target die, which were designed to eliminate the effect of undesired shock wave, and then impacted with an aluminum alloy target at 400 m/s. Microstructure and mechanical properties of the shock compact specimen were analyzed using an optical microscope (OM), scanning electron microscope (SEM), and micro indentation. Hardness results showed low values (approximately 45~80 Hv) similar or slightly higher than those of conventional coarse grained commercial purity copper. This result indicates the poor quality of bonding between particles. Images from OM and SEM also confirmed that no strong bonding was achieved between them due to the insufficient energy and surface oxygen layer of the powders.

Struvite Crystallization of Anaerobic Digestive Fluid of Swine Manure Containing Highly Concentrated Nitrogen

  • Lee, Eun Young;Oh, Min Hwan;Yang, Seung-Hak;Yoon, Tae Han
    • Asian-Australasian Journal of Animal Sciences
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    • 제28권7호
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    • pp.1053-1060
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    • 2015
  • In this study, the optimal operation factors for struvite crystallization for removing and recovering nitrogen and phosphorus from anaerobic digestive fluid of swine manure containing highly concentrated nitrogen was determined. Every experiment for the struvite crystallization reaction was conducted by placing 1,000 mL of digestion fluid in a 2,000 mL Erlenmeyer flask at various temperatures, pH, and mixing speed. Except for special circumstances, the digestion fluid was centrifuged (10,000 rpm, 10 min) and then the supernatant was used for the experiment at room temperature and 100 rpm. The optimal mole ratio of $PO_4{^{3-}}:Mg^{2+}$ was 1:1.5, and the pH effect ranging from 9 to 11 was similar, when mixed for 1 hour. Under this condition, the removal efficiency of $NH_4{^+}-N$ and $PO_4{^{3-}}-P$ was 40% and 88.6%, respectively. X-shaped crystal was observed by light and scanning electron microscopy. In addition, struvite crystal structure was confirmed through X-ray diffraction analysis.

High-Speed SD-OCT for Ultra Wide-field Human Retinal Three Dimensions Imaging using GPU (병렬처리 그래픽 기술 기반의 Spectral Domain-Optical Coherence Tomography를 이용한 3차원 광 대역 망막 촬영)

  • Park, Kibeom;Cho, Nam Hyun;Wijesinghe, Ruchire Eranga Henry;Kim, Jeehyun
    • Journal of Biomedical Engineering Research
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    • 제34권3호
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    • pp.135-140
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    • 2013
  • We have developed an ultra wide-field of view Optical Coherence Tomography(OCT) which has capability to 2D and 3D views of cross-sectional structure of in vivo human retina. Conventional OCT has a limitation in visualizing the entire retina due to a reduced field of view. We designed an optical setup to significantly improve the lateral scanning range to be more than 20 mm. The entire human retinal structure in 2D and 3D was reported in this paper with the developed OCT system. Also, we empirically searched an optimized image size for real time visualization by analyzing variation of the frame rate with different lateral scan points. The size was concluded to be $1024{\times}2000{\times}300$ pixels which took 9 seconds for visualization.

An investigation on dicing 28-nm node Cu/low-k wafer with a Picosecond Pulse Laser

  • Hsu, Hsiang-Chen;Chu, Li-Ming;Liu, Baojun;Fu, Chih-Chiang
    • Journal of the Microelectronics and Packaging Society
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    • 제21권4호
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    • pp.63-68
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    • 2014
  • For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.

Laser Micro Soldering and Soldering Factors (레이저 마이크로 솔더링과 솔더링 인자)

  • Hwang, Seung Jun;Hwang, Sung Vin;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • 제27권3호
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    • pp.1-8
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    • 2020
  • In this paper, the principles, characteristics and recent studies of the laser micro soldering are reviewed. The factors which influence laser micro welding and soldering are also included. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled laser beam. In recent electronics industry, the demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro-joint. In laser soldering, there are several important factors like laser absorption, laser power, laser scanning speed, and etc, which affect laser solderability. The laser absorption ratio depends on materials, and each material has different absorption or reflectivity for the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance, and these are also reviewed.

CAD Model Generation from Point Clouds using 3D Grid Method (Grid 방법을 이용한 측정 점데이터로부터의 CAD모델 생성에 관한 연구)

  • 우혁제;강의철;이관행
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.435-438
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    • 2001
  • Reverse engineering technology refers to the process that creates a CAD model of an existing part using measuring devices. Recently, non-contact scanning devices have become more accurate and the speed of data acquisition has increased drastically. However, they generate thousands of points per second and various types of point data. Therefore, it becomes a major issue to handle the huge amount and various types of point data. To generate a CAD model from scanned point data efficiently, these point data should be well arranged through point data handling processes such as data reduction and segmentation. This paper proposes a new point data handling method using 3D grids. The geometric information of a part is extracted from point cloud data by estimating normal values of the points. The non-uniform 3D grids for data reduction and segmentation are generated based on the geometric information. Through these data reduction and segmentation processes, it is possible to create CAD models autmatically and efficiently. The proposed method is applied to two quardric medels and the results are discussed.

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Structure and Properties of Polymer Infiltrated Alumina Thick Film via Inkjet Printing Process

  • Jang, Hun-Woo;Koo, Eun-Hae;Hwang, Hae-Jin;Kim, Jong-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.207-207
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    • 2008
  • Modern industry has focused on processing that produce low- loss dielectric substrates used complex micron-sized devices using tick film technologies such as tape casting and slip casting. However, these processes have inherent disadvantages fabricating high density interconnect with embedded passives for high speed communication electronic devices. Here, we have successfully fabricated porous alumina dielectric layer infiltrated with polymer solution by using inkjet printing process. Alumina suspensions were formulated as dielectric ink that were optimized to use in inkjet process. The layer was confirmed by field emission scanning electron microscope (FE-SEM) for measuring microstructure and volume fraction. In addition, the reaction kinetics and electrical properties were characterized by FT-IR and the impedance analyzer. The volume fraction of alumina in porous dielectric alumina layer is around 70% much higher than that in the conventional process. Furthermore, after infiltration on the dielectric layer using polymer resins such as cyanate ester. Excellent Q factors of the dielectric is about 200 when confirmed by impedance analyzer without any high temperature process.

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