• Restorative Dentistry and Endodontics
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• 제41권4호
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• pp.255-261
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• 2016

Objectives: This study aimed to analyze the mineral composition of naturally- and artificially-produced caries-affected root dentin and to determine the elemental incorporation of resin-modified glass ionomer (RMGI) into the demineralized dentin. Materials and Methods: Box-formed cavities were prepared on buccal and lingual root surfaces of sound human premolars (n = 15). One cavity was exposed to a microbial caries model using a strain of Streptococcus mutans. The other cavity was subjected to a chemical model under pH cycling. Premolars and molars with root surface caries were used as a natural caries model (n = 15). Outer caries lesion was removed using a carbide bur and a hand excavator under a dyeing technique and restored with RMGI (FujiII LC, GC Corp.). The weight percentages of calcium (Ca), phosphate (P), and strontium (Sr) and the widths of demineralized dentin were determined by electron probe microanalysis and compared among the groups using ANOVA and Tukey test (p < 0.05). Results: There was a pattern of demineralization in all models, as visualized with scanning electron microscopy. Artificial models induced greater losses of Ca and P and larger widths of demineralized dentin than did a natural caries model (p < 0.05). Sr was diffused into the demineralized dentin layer from RMGI. Conclusions: Both microbial and chemical caries models produced similar patterns of mineral composition on the caries-affected dentin. However, the artificial lesions had a relatively larger extent of demineralization than did the natural lesions. RMGI was incorporated into the superficial layer of the caries-affected dentin.

• 전기화학회지
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• 제13권2호
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• pp.96-102
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• 2010

본 연구에서는 균일부식이 발생하는 저합금강의 노출면적에 따른 부식속도의 변화를 관찰하고 이에 대한 원인을 규명하고자 하였다. 다양한 표면적을 지닌 동일한 저합금강 시편의 부식속도를 전기 화학적 임피던스 분광법, 직선분극저항 측정법, 동전위 분극 시험법을 이용하여 산출하였다. 또한 전자주사현미경, X선 광전자 분광법 및 X선 전자탐침 미량분석을 이용하여 표면분석을 실시하였다. 전기화학적 시험 결과 모든 시험법에서 시편의 크기가 증가할수록 부식속도가 높게 산출되었으며, 표면분석을 통해 망간과 황으로 구성된 화합물이 존재하는 영역에서 우선적으로 부식이 발생하며, 이 화합물과 철 또는 구리 산화물이 소양극-대음극의 미세 갈바닉 셀을 구성함을 확인하였다. 이러한 효과는 시편 크기에 비례하여 증가하였으며, 국부적인 부식이 우선적으로 발생한 후, 부식생성물이 표면을 덮게 되어 점차 균일부식의 형태로 전환하게 된다.

• 폴리머
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• 제36권4호
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• pp.494-499
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• 2012

본 연구에서는 다중벽 탄소나노튜브(MWCNT)의 함량을 1에서 10 wt%까지 달리하여 MWCNT 강화 폴리프로필렌(PP) 나노복합재료의 전자파 차폐효과 및 기계적 특성에 미치는 영향에 대해서 살펴보았다. 전기전도도는 4단자법으로 측정하였고, 전자파 차폐효과는 흡수와 반사방법으로 분석하였다. 기계적 특성은 임계응력세기인자($K_{IC}$) 측정을 통하여 고찰하였으며, 모폴로지는 주사전자현미경(SEM)으로 관찰하였다. 실험결과, MWCNT의 함량이 증가함에 따라 차폐효과가 향상됨을 확인할 수 있었으며, MWCNT의 함량이 전자파 차폐효과를 결정하는 중요한 요소임을 알 수 있었다. $K_{IC}$값도 MWCNT의 함량이 증가할수록 큰 값을 가지는 것을 확인할 수 있었으나 5 wt% 이상에서는 오히려 감소하였다. 이는 과량의 MWCNT가 PP 내에서 서로 뭉침으로 인하여 $K_{IC}$값을 감소시킨 것으로 판단된다.

• 한국전기전자재료학회논문지
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• 제24권9호
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• pp.755-759
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• 2011

$Cu(In_{1-x},Ga_x)Se_2$ thin films have been considered as an effective absorber material for high efficient solar cells. In this paper, the CIGS thin films with varied Ga content were prepared using a co-evaporation process of three stage. We carry out structure and electrical optical property on the thin film in varied Ga content. CIGS thin films have been characterized by X-ray diffraction(XRD), scanning electron microscopy(SEM), energy-dispersive spectroscopy(EDS), four-point probe measurement, and the Hall measurement. To optimize Ga contents, Ga/(In+Ga) ratio were changed from 0.13 to 0.72. At this time the carrier concentrations were varied from $1.22{\times}10^{11}\;cm^{-3}$ to $5.07{\times}10^{16}\;cm^{-3}$, and electrical resistivity were varied from $1.11{\times}10^0\;{\Omega}-cm$ to $1.08{\times}10^2\;{\Omega}-cm$. A strong <220/204> orientation and a lager grain size were obtained at a Ga/(In+Ga) of 0.3. We were able to achieve conversion efficiency as high as 15.95% with a Ga/(In+Ga) of 0.3.

• 한국표면공학회지
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• 제49권1호
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

• 한국산학기술학회논문지
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• 제1권1호
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• pp.37-42
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• 2000

유기금속 화학기상증착기술에 의해 폴리이미드 기판과 질화티탄 기판 위에 구리박막을 형성하였다. 구리박막을 화학기상증착기술에 의해 형성하면 종래의 물리적증착기술에 비하여 증착속도가 빠르고 층덮힘 성질이 좋아 산업체의 제품생산 응용에서 많은 장점이 있다. 이 장점은 제품의 생산성과 신뢰성에 영향을 미친다. 기판의 온도와 구리전구체 증기압력 조건을 변화시키며 반복실험을 실시하였으며, 시편에 따라서는 전기적 성질 향상을 위하여 후속 열처리를 수행하였다. 형성된 구리박막의 미세구조는 전자현미경으로 관찰하였으며, 전기비저항은 4점 프로브를 이용하여 측정하였다. 질화티탄을 기판으로 사용한 경우 구리박막에서는 섭씨 180도의 기판온도에서 만들어진 시편에서 가장 좋은 전기적 성질이 측정되었다. 한편, 폴리이미드 기판을 사용한 경우, 기상과 액상의 혼합상태 전구체를 이용하여 250 nm/min의 매우 높은 증착속도를 얻을 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.381-382
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• 2007

IZO/Ag/IZO (IAI) anode films for flexible organic light emitting diodes (OLEDs) were grown on PC (polycarbonate) substrate using DC sputter (IZO) and thermal evaporator (Ag) systems as a function of Ag thickness. To investigate electrical and optical properties of IAI stacked films, 4-point probe and UV/Vis spectrometer were used, respectively. From a IAI stacked film with 12nm-thick Ag, sheet resistance of $6.9\;{\Omega}/{\square}$ and transmittance of above 82 % at a range of 500-550 nm wavelength were obtained. In addition, structural and surface properties of IAI stacked films were analyzed by XRD (X-ray diffraction) and SEM (scanning electron microscopy), respectively. Moreover, IAI stacked films showed dramatically improved mechanical properties when subjected to bending both as a function of number of cycles to a fixed radius. Finally, OLEDs fabricated on both flexible IAI stacked anode and conventional ITO/Glass were fabricated and, J-V-L characteristics of those OLEDs were compared by Keithley 2400.

• 한국전기전자재료학회논문지
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• 제27권12호
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• pp.820-824
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• 2014

TiNOx multi-layer thin films on aluminum substrates were prepared by DC reactive magnetron sputtering method. 4 multi-layers of $TiO_2$/TiNOx(LMVF)/TiNOx(HMVF)/Ti/substrate have been prepared with ratio of Ar and ($N_2+O_2$) gas mixture. $TiO_2$ of top layer is anti-reflection layer on double TiNOx(LMVF)/TiNOx(HMVF) layers and Ti metal of infrared reflection layer. In this study, the crystallinity and surface properties of TiNOx thin films were estimated by X-ray diffraction(XRD) and field emission scanning electron microscopy(FE-SEM), respectively. The grain size of TiNOx thin films shows to increase with increasing sputtering power. The composition of thin films has been investigated using electron probe microanalysis(EPMA). The optical properties with wavelength spectrum were recorded by UV-Vis-NIR spectrophotometry at a range of 200~1,500 nm. The TiNOx multi-layer films show the excellent optical performance beyond 9% of reflectance in those ranges wavelength.

• 대한금속재료학회지
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• 제47권4호
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• pp.256-260
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• 2009

This study examined the effects of plated temperature on the surface morphology and property of an electrodeposited copper foil. The morphology, crystal structure and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity could be controlled using various temperature of electrolyte. Large particles were observed on the surface of the copper layer electroplated onto the $30^{\circ}C$. However, a uniform surface, lower resistivity and high flexibility were obtained when a $50^{\circ}C$ electrolyte was used.

• 대한금속재료학회지
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• 제47권9호
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• pp.586-590
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• 2009

The effects of additives on the surface morphology and physical properties of copper electrodeposited on polyimide(PI) film were investigated here. Two kinds of additives, an activator(additive A) and a leveler(additive B),were used in this study. Electrochemical experiments, in conjunction with scanning electron microscopy(SEM), X-ray diffraction(XRD) and a four-point probe, were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity could be controlled using various quantities of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated onto the electrolyte with no additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm of additive A and 100 ppm of additive B.