• Tribology and Lubricants
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• 제34권6호
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• pp.209-216
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• 2018

Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.47-52
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• 2017

Solar cell industry requires high technologies to stabilize apparatuses for the wafer manufacturing. Vibrations of squaring & grinding machines are one of the most critical factors for causing residual stresses of ingots, which are the main reasons of the breakage in the following processes such as wire sawing, cleaning, and modularity. In this study, the structure of a squaring & grinding machine has been analyzed through experiments and computer simulations to figure out the ways to suppress the vibrations effectively, and further to minimize the breakage of wafers. The result shows that simple design changes of applying a few ribs can improve the stability of the machine.

• Journal of the Korean Wood Science and Technology
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• 제47권1호
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• pp.66-79
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• 2019

본 연구는 톱밥과 농업부산물인 귤박을 이용하여 보드를 제조하고 세라믹화 하여 표면온도 및 원적외선 방사특성을 조사하였다. 세라믹의 표면온도는 경과시간 10분까지는 급속히 상승하였고, 30분 후에는 탄화온도가 높을수록 높았고, 귤박 혼합율별로는 별 영향이 없었다. 원적외선 방사율은 귤박 혼합율에 따라 일정한 경향이 없었고, 탄화온도가 증가할수록 낮은 값을 보였다.

• 감성과학
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• 제11권2호
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• pp.207-214
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• 2008

직물의 결점은 원단손실을 가중시키기 때문에, 검단공정에서 결점부위를 제거한다. 실제공장에서 이뤄지는 검단공정은 육안판정방식과 전자동 방식 중 하나를 채택하는데, 두 방식 나름대로 장단점이 있다. 본 연구에서는 육안판정과 전자동 방식의 장점만을 모아 검출은 사람이 하지만, 결점위치 정보 제공 및 결점정보 기록을 컴퓨터가 하도록 반자동 검단기를 개발하였다. 본 연구에서 개발한 레이저 그리드는 결점의 위치를 검단자가 쉽게 파악하도록 돕는 역할을 하며, 야드미터는 자동으로 결점의 위치를 측정하는 역할을 한다. 컴퓨터는 야드미터로 측정된 직물의 길이와 사람이 검출한 결점의 위치정보를 받아들여 저장하고 직물의 결점정보를 한눈에 보여주는 역할을 한다. 실제 사용되는 직물을 대상으로 특정 패턴으로 재단했을 때의 손실률을 계산하여 개발된 시스템의 성능을 객관적으로 평가하였다.

• Tribology and Lubricants
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• 제32권2호
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• pp.56-60
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• 2016

Sapphire has a high hardness and strength and chemical stability as a superior material. It is used mainly as a material for a semiconductor as well as LED. Recently, the cover glass industry used by a sapphire is getting a lot of attention. The sapphire substrate is manufactured through ingot sawing, lapping, diamond mechanical polishing (DMP) and chemical mechanical polishing (CMP) process. DMP is an important process to ensure the surface quality of several nm for CMP process as well as to determine the final form accuracy of the substrate. In DMP process, the material removal is achieved by using the mechanical energy of the relative motion to each other in the state that the diamond slurry is disposed between the sapphire substrate and the polishing platen. The polishing platen is one of the most important factors that determine the material removal characteristics in DMP. Especially, it is known that the geometric characteristics of the polishing platen affects the material removal amount and its distribution. This paper investigated the material removal characteristics and the effects of the polishing platen groove in sapphire DMP. The experiments were preliminarily carried out to evaluate the sapphire material removal characteristics according to process parameters such as pressure, relative velocity and so on. In the experiment, the monitoring apparatus was applied to analyze process phenomena in accordance with the processing conditions. From the experimental results, the correlation was analyzed among process parameters, polishing phenomena and the material removal characteristics. The material removal equation based on phenomenological factors could be derived. And the experiment was followed to investigate the effects of platen groove on material removal characteristics.

• 한국재료학회지
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• 제22권9호
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• pp.450-453
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• 2012

In crystalline solar cells, the substrate itself constitutes a large portion of the fabrication cost as it is derived from semiconductor ingots grown in costly high temperature processes. Thinner wafer substrates allow some cost saving as more wafers can be sliced from a given ingot, although technological limitations in slicing or sawing of wafers off an ingot, as well as the physical strength of the sliced wafers, put a lower limit on the substrate thickness. Complementary to these economical and techno-physical points of view, a device operation point of view of the substrate thickness would be useful. With this in mind, BC-BJ Si and GaAs solar cells are compared one to one by means of the Medici device simulation, with a particular emphasis on the substrate thickness. Under ideal conditions of 0.6 ${\mu}m$ photons entering the 10 ${\mu}m$-wide BC-BJ solar cells at the normal incident angle (${\theta}=90^{\circ}$), GaAs is about 2.3 times more efficient than Si in terms of peak cell power output: 42.3 $mW{\cdot}cm^{-2}$ vs. 18.2 $mW{\cdot}cm^{-2}$. This strong performance of GaAs, though only under ideal conditions, gives a strong indication that this material could stand competitively against Si, despite its known high material and process costs. Within the limitation of the minority carrier recombination lifetime value of $5{\times}10^{-5}$ sec used in the device simulation, the solar cell power is known to be only weakly dependent on the substrate thickness, particularly under about 100 ${\mu}m$, for both Si and GaAs. Though the optimum substrate thickness is about 100 ${\mu}m$ or less, the reduction in the power output is less than 10% from the peak values even when the substrate thickness is increased to 190 ${\mu}m$. Thus, for crystalline Si and GaAs with a relatively long recombination lifetime, extra efforts to be spent on thinning the substrate should be weighed against the expected actual gain in the solar cell output power.

• Journal of the Korean Wood Science and Technology
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• 제17권2호
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• pp.20-25
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• 1989

This study was carried out in order to investigate the treatment effect of PEG soln which is a common dimensional stabilizer to green log. sawing panel etc, on bonding product including plywood widely-used in secondary processing unit. The 30% concentration of aqueous PEG soln. with molecular weight of 400, 1.000 and 4,000 were prepared respectively, and also dipping the veneer in the PEG soln. spreading the PEG soln. on veneer and mixing the PEG soln. in the adhesive were allowed. Then the ratio of PEG impregnation on veneer, the adhesive strength of plywood were epitomized as follows: The ratio of impregnation by PEG 4,000 at dipping condition was highest. while that by PEG 400 at same condition was lowest. However, the effect of PEG molecular weight on the ratio of impregnation at spreading condition did not occur. 2. The adhesive strength was great in the order of 4,000>400>1,000 in molecular weight of PEG at dipping and spreading conditions. In case of mixing the PEG soln. in the adhesive, the adhesive strength was great in the order of 400>1,000>4,000 in molecular weight of PEG. Throughout three treatment conditions, PEG 400 was relatively favourable with about 10kg/$cm^2$ dry strength. 3. The adhesive strength was great 10 the order of spreading >dipping >mixing condition. 4. Although adhesive strength with the 30% concentration of aqueous PEG soln. was decreased by 35% and over, compared to control (non-treatment) adhesive strength, all types of PEG treatment except mixing the PEG soln. in the adhesive exceeded the standard dry strength for common use panel. 7.5kg/$cm^2$. 5. In warm water-proof test, the adhesive strengths by all PEG treatment conditions were less than the standard wet strength, 7.5kg cot, and also delamination of glue line occured mostly in mixing in the PEG soln. in the adhesive condition.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2004년도 춘계 학술발표회 제16권1호
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• pp.794-797
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• 2004

In this study, tensile adhesive strength(TAS) test was carreid out for evaluated the effects of temperature conditions (-20, -10, 0, 5, 10, 20, 30, $40^{\circ}C$) on the tensile adhesive characteristics about 4 type waterproofing membranes which were commercially used in bridge decks. And, failure appeariences of waterproofing systems in each temperature after TAS test were observed the sawing surfaces of waterproofing systems for whether or not damaged of waterproofing membranes. Also, correction coefficient of TAS with temperature were calculated using 4 type waterproofing membrane. It could be shown that the higher TAS and shear adhesive strength, the lower temperature, regardless of the type of waterproofing membrane. Temperature sensibility of TAS was especially remarkable in epoxy membrane. Failure type was occurred the ductile failure in $30^{\circ}C\;and\;40^{\circ}C$. From these results, it was shown that if ambient temperature above $30^{\circ}C$ maintains for a long time, waterproofing membrane will be deformed by softening. Otherwise, waterproofing membrane in temperature below $20^{\circ}C$ shown that occurred the brittle failure. From the results of visual observation of cutting surface for specimen, the thin waterproofing membranes shown indented by hot aggregate of the asphalt mixtures. Therefore, it could be known that the specification of waterproofing membrane thickness is necessary by waterproofing membrane type. As temperature change varied with pavement depth, the interface temperature was more important than ambient temperature in TAS test. Now, TAS test results were limited only in $-10^{\circ}C\;and\;20^{\circ}C$ temperature, but correction coefficient of TAS by ambient temperature could be used as a solution to deal with this problem.

• 한국의상디자인학회지
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• 제12권3호
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• pp.57-71
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• 2010

This study is to understand the actual condition of design and material of peanut-shaped diaper with looking at the types and characteristics of baby cloth diapers and domestic peanut-shaped diapers registered in the Patent Office. Furthermore, it is to suggest the basic data for designing more functional and comfortable cloth diapers. Here are the research result on the actual condition of design and material of baby cloth diapers. Firstly, 11 cloth diapers registered in the Patent Office can be divided into panty-shaped and straight line-shaped diapers. There are 7 kinds of panty-shaped cloth diapers which satisfy both the convenience of a disposable diaper and sanitation of a cloth diaper, and 4 kinds of straight line-shaped cloth diapers that minimize the weaknesses of existing cloth diapers. Secondly, domestic peanut-shaped cloth diapers can be divided into peanut-shaped, inserted, winged, velcro-attached diapers. Among 23 kinds of peanut-shaped cloth diapers from 16 companies, there are 12 kinds of peanut-shaped diapers which consist of layers of cloth to make peanut shape. There are 6 kinds of inserted diapers that insert extra diapers or handkerchiefs in between two sheets of cloth diapers and 3 kinds of winged diapers designed to shorten drying time with sawing only one side of several layered sheets. Also, there are 2 kinds of velcro-attached diapers that are removable according to the amount of excreta. Commonly used materials are cotton woven of diamond jacquard and knit of diamond Hole Stitch or Plain Stitch. And for handing the edge of diaper, the method of wrapping up the edge with cotton woven or knit bias is used.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2008년도 춘계학술대회논문집
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• pp.904-908
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• 2008

As the various industrial production machinery has come into being by development of industrial technology, the productivity of the basic industrial production machinery has improved and the international competitiveness of the one of Korea has strengthened. However, at the same time, noise from various industrial production machinery disturbs the quiet environment. There are 35 kinds of the noise emission machinery defined in the noise and vibration control act according to the horse power and the number of machinery. These were classified in 1992 through investigation from 1990 to 1991, and the characteristic of the noise emission machinery may be different from the past one. So we need to investigate the characteristics of the noise emitted by machinery to control it rightly. Also we need to investigate the new noise emission machinery which has come into being recently. In this survey, we measured sound intensity of 32 noise emission machinery to calculate the sound power levels of those and investigated the characteristic of the sound power level of those according to the frequency. From the survey, we found that the forging machine, concrete pipe and pile making machine, sawing machine, etc. are the noisy machinery. And the automatic packing machine, sewing machine, centrifuge, etc. are the silent machinery. Also the generator, the concrete pipe and pile making machine, the printing machine, etc. emit the low frequency noise, and the molding machine, the stone cutter, the metal cutter, etc. emit the high frequency noise. Lastly, we intented to propose the proper guide line of classifying noise emission machinery.