A Study of Material Removal Characteristics by Friction Monitoring System of Sapphire Wafer in Single Side DMP |
Jo, Wonseok
(Korea Institute of Industrial Technology)
Lee, Sangjik (Korea Institute of Industrial Technology) Kim, Hyoungjae (Korea Institute of Industrial Technology) Lee, Taekyung (Korea Institute of Industrial Technology) Lee, Seongbeom (High Safety Vehicle Core Technology Research Center, Inje University) |
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