• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.306-309
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• 2000

In this work, we investigated A1 cluster deposition on Al (100) surface using molecular dynamics simulation. A result of simulations showed that large cluster with low energy was proper for good surfaced-films without craters at the low temperatures. We investigated the maximum substrate temperature and the time taken for substrate temperature to reach its maximum as a function of cluster size in the case of the same total energy and in the case of the same energy Per atom. The correlated collisions play an important role in interaction between energetic cluster and surface, and as cluster size and cluster energy increases, the correlated collisions effect affects interaction between energetic cluster and surface.

• ETRI Journal
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• v.25 no.2
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• pp.65-72
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• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

• Journal of the Korean Ceramic Society
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• v.34 no.12
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• pp.1199-1204
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• 1997

SiC conversion layer was fabricated by the chemical vapor reaction between graphite substrate and silica powder. The CVR process was carried out in nitrogen atmosphere at 175$0^{\circ}C$ and 185$0^{\circ}C$. From the reduction of silica powder with graphite substrate, the SiO vapor was created, infiltrated into the graphite substrate, then, the SiC conversion layer was formed from the vapor-solid reaction of SiO and graphite. In the XRD pattern of conversion layer, it was confirmed that 3C $\beta$-SiC phase was created at 175$0^{\circ}C$ and 185$0^{\circ}C$. Also, in the back scattered image of cross-sectional conversion layer, it was found that the conversion layer was easily formed at 185$0^{\circ}C$, the interface of graphite substrate and SiC layer was observed. It was though that the coke particle size and density of graphite substrate mainly affect the XRD pattern and microstructure of SiC conversion layer. In the oxidation test of 100$0^{\circ}C$, the SiC converted graphites exhibited good oxidation resistance compared with the unconverted graphites.

• Journal of Pharmaceutical Investigation
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• v.37 no.3
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• pp.131-135
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• 2007

A previous report recently demonstrated that ultrasound-induced hyperthermia (USHT:0.4 watts (W)/$cm^2$ at $41^{\circ}C$) could increase cellular uptake of P-glycoprotein (P-gp) substrates in P-gp expressing cancer cell lines. Since P-gp plays a major role in limiting drug permeability in the multi-drug resistant (MDR) cells, studies were conducted to elucidate the mechanism of USHT on cellular accumulation of P-gp and non-P-gp substrate in MDR cells. To accomplish this aim, we studied the effects of USHT on the accumulation of P-gp substrate, R123 and non-P-gp substrate, antipyrine in MDR cells. We demonstrated that USHT increased permeability of hydrophobic molecules (R123 and $[^{14}C]$-antipyrine). The enhanced permeability is reversible and size-dependent as USHT produces a much larger effect on cellular accumulation of $[^{14}C]$-antipyrine (MW 188) than that of R123 (MW 380.8). These results suggest that USHT could affect MDR cells more sensitive than BBMECs. Also, the present results point to the potential use of USHT to increase cellular uptake of P-gp recognized substrates, mainly anti-cancer agents into cancer cells.

• Journal of the Korean Ceramic Society
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• v.39 no.5
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• pp.517-522
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• 2002

In this study, the effect of the processing parameters in PVD process on the size and the distribution of deposited Si quantum dots was quantitatively investigated by computational simulation utilizing Monte Carlo method. The processing parameters, substrate temperature, deposition time, gas pressure and target-substrate distance were selected as variables since those parameters are often selected as variables in PVD experiments. It is predicted that the density of $1{\times}10^{12}cm^{-2}$ Si quantum dots can be deposited on the substrate when the deposition rate is 0.05 nm/sec at the substrate temperature of 490${\circ}$, deposition time of 7 sec, gas pressure of 3 mTorr and target-substrate distance of 8 cm.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.327-331
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• 2008

An in-line wet etch/cleaning system was established for the research and development in wet etch process as a formation of electrode such as metal or transparent conductive oxide layer. A reverse moving system was equipped in the in-line wet etch/cleaning system for the alternating motion of glass substrate in a wet etch bath of the system. Therefore, it was possible for the glass substrate to be moved back and forth and it was possible to reduce the size of the system by using the reversing moving system. For the effect of the alternating motion of substrate on the etch rate in the in-line wet etch bath, indium tin oxide(ITO) patterns were obtained through wet etch process in the in-line system in which the substrate was moved back and forth. From the CD(critical dimension) skews resulted from the ADI CD and ACI CD of the ITO patterns, it was concluded that the alternating motion of glass substrate are possible to be applied to the mass production of wet etch process.

• ETRI Journal
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• v.28 no.1
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• pp.9-16
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• 2006

In this paper, we analyzed and measured the electrical crosstalk characteristics of a 1.25 Gbps triplexer module for Ethernet passive optical networks to realize fiber-tothe-home services. Electrical crosstalk characteristic of the 1.25 Gbps optical triplexer module on a resistive silicon substrate should be more serious than on a dielectric substrate. Consequently, using the finite element method, we analyze the electrical crosstalk phenomena and propose a silicon substrate structure with a dummy ground line that is the simplest low-crosstalk layout configuration in the 1.25 Gbps optical triplexer module. The triplexer module consists of a laser diode as a transmitter, a digital photodetector as a digital data receiver, and an analog photodetector as a cable television signal receiver. According to IEEE 802.3ah and ITU-T G.983.3, the digital receiver and analog receiver sensitivities have to meet -24 dBm at $BER=10^{-12}$ and -7.7 dBm at 44 dB SNR. The electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysis and measurement results, the proposed silicon substrate structure that contains the dummy line with $100\;{\mu}m$ space from the signal lines and 4 mm separations among the devices satisfies the electrical crosstalk level compared to a simple structure. This proposed structure can be easily implemented with design convenience and greatly reduce the silicon substrate size by about 50 %.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.2
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• pp.215-222
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• 2004

Synthesis of multi-walled carbon nanotubes on a nickel-nitrate-deposited substrate using an ethylene fueled inverse diffusion flame was illustrated. The deposition of nickel-nitrate particles on substrates was used for the smaller-diameter nanotubes than those formed in our previous studies. Also the effect of temperature variations on the size of formed nanotubes was investigated. The diameters of formed multi-walled carbon nanotubes were ranging from 15 to 100 nm in the several radial locations. In case of using a nickel-nitrate-deposited substrate, the smaller-diameter carbon nanotubes were synthesized than those in case of using the substrate with melted nickel-nitrate. In the formation region of carbon nanotubes, the diameter of formed nanotubes was tend to be decrease as the radial distance form the flame center was increased, that is the decreased substrate temperature.

• Journal of the Korean institute of surface engineering
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• v.44 no.4
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• pp.165-171
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• 2011

In this work, handling of sapphire substrate for LED by using an electrostatic chuck was studied. The electrostatic chuck consisted of alumina dielectric, which was doped with 1.2 wt% $TiO_2$. As the volume resistivity of alumina dielectric was decreased, the electrostatic force was increased by Johnsen-Rahbek effect. The narrower width and gap size of electrode led to the stronger electrostatic force. When alumina dielectric with $3.20{\times}10^{11}{\Omega}{\cdot}cm$ resistivity and 3 mm width/1.5 mm gap sized electrode was used, the strongest electrostatic force in this work was obtained, which value reached to ~14.46 gf/$cm^2$ at 2.5 kV for 4-inch sapphire substrate. This results show that alumina electrostatic chuck with low resistivity and fine electrode pattern is suitable for handling of sapphire substrate for LED.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.21 no.9
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• pp.2505-2513
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• 1996

This paper presents the analysis of the impedance characteristic of the strip type waveguide mount backed by the dielectric substrate using mode the matching and induced EMF method. The part of the waveguide containing the dielectric substrate is modeled as waveguide partially filled with the dielectric, and a hybrid mode analysis has been conducted for the structure. The electromagnetic scattering problem by the dielectric substrate is solved by the mode matching method using the calculated modal function. The input impedance seen at the mount gap is calculated by the induced EMF method using the calculated results. the calculated results thus obtained has been verified through comparison with the results by other numerical methods. The effect of some structure parameters such as the width of the substrate and the gap size on the mount impedance is investigated.