• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.393-393
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• 2013

나노입자를 포함하는 합성물은 전자소자와 광전소자의 응용 가능성 때문에 많은 연구가 진행되고 있다. 복합층을 사용한 소자의 전기적 성질에 대한 연구는 많이 진행되었으나, SiC/SiNx 다층 복합층 소자에 대한 광학적 특성에 대한 연구는 상대적으로 미흡하다. 본 연구는 SiC/SiNx 다층 복합층을 사용하여 스퍼터링 방법으로 형성하고 열처리를 사용하여 복합층의 미세구조와 광학적 특성을 조사하였다. SiNx층을 p-형 Si 기판 위에 성장한 후 SiC층을 형성하였다. 3번의 주기적인 성장으로 다층구조를 형성하고, 30분 동안 열처리 하였다. 투과전자현미경상은 SiC/SiNx 복합층에 SiC 나노입자가 형성한 것을 확인하였다. 광류미네센스 스펙트럼 결과는 형성한 SiC/SiNx 복합층을 열처리할 때 SiC층에서 나타나는 주된 피크 위치가 변위되는 것을 보였다. 광류 미네센스 스펙트럼 결과에서 나타난 주된 피크가 열치리에 따라 변화하는 원인을 규명하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.44-48
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• 2008

Hole mobility characteristics of two representative biaxially strained SiGe/Si structures with high Ge contents are studied, They are single channel ($Si/Si_{1-x}Ge_x/Si$ substrate) and dual channel ($Si/Si_{1-y}Ge_y/Si_{1-x}Ge_x/Si$ substrate), where the former consists of a relaxed SiGe buffer layer with 60 % Ge content and a tensile-strained Si layer on top, and for the latter, a compressively strained SiGe layer is inserted between two layers, Owing to the hole mobility performance between a relaxed SiGe film and a compressive-strained SiGe film in the single channel and the dual channel, the hole mobility behaviors of two structures with respect to the Si cap layer thickness shows the opposite trend, Hole mobility increases with thicker Si cap layer for single channel structure, whereas it decreases with thicker Si cap layer for dual channel. This hole mobility characteristics could be easily explained by a simple capacitance model.

• Journal of the Korean Ceramic Society
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• v.43 no.10 s.293
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• pp.595-600
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• 2006

The preparation of $\beta$-SiAlON powder by SHS in the system of $Si-Al-SiO_2-NH_4F(\beta-Si_3N_4)$ was investigated in this study. In the preparation of SiAlON powder, the effect of gas pressure, compositions such as Si, $NH_4F$, \beta-Si_3N_4$ and additive in mixture on the reactivity were investigated. At 50 atm of the initial inert gas pressure in reactor, the optimum composition for the preparation of pure $\beta$-SiAlON was $3Si+Al+2SiO_2+NH_4F$. The $\beta$-SiAlON powder synthesized in this condition was a single phase $\beta$-SiAlON with a rod like morphology.

• Journal of the Korean Ceramic Society
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• v.37 no.11
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• pp.1114-1118
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• 2000

Ti 및 C 입자로 이루어진 다공질 성형체에 용융 Si의 침윤 및 반응으로 새로운 Ti$_3$SiC$_2$합성공정이 개발되었다. 용융 Si 침윤에 의한 Ti$_3$SiC$_2$합성공정에서는 이제까지 연구된 합성방법 보다 넓은 조성 범위에서 Ti$_3$SiC$_2$의 합성이 이루어졌다. 용융 Si을 활성 매질로 사용한 Ti$_3$SiC$_2$의 합성에서는 성형체 조성, 원료 입자 크기 및 침윤되는 용융 Si의 양에 따라 합성되는 상 및 각 합성상의 양이 다르게 나타났다. Ti:Si:C=3:1:6 조성을 제외한 모든 조성의 시편에서 Ti$_3$SiC$_2$상이 합성되었으며, 일부 조성을 제외한 모든 조성의 시편에서 Ti$_3$SiC$_2$, TiC 및 SiC가 함께 합성되었다. 작은 Ti 입자로 이루어진 성형체를 사용하여 합성한 시편에서 Ti$_3$SiC$_2$상의 합성이 용이하게 이루어졌으며, 성형체 조성 및 침윤되는 Si의 양이 화학양론적으로 Ti$_3$SiC$_2$에 근접한 조성을 갖는 시편에서 Ti$_3$SiC$_2$를 높은 수율로 합성할 수 있었다.

• Journal of the Korean Vacuum Society
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• v.5 no.3
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• pp.239-244
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• 1996

We firstly report that formation of $SiO_2$ layer on Si surface can be effectively prevented by flowing the $Si_2H_6$ gas during the heating-up procedure for amorphous Si depositions. In this way, amorphously deposited Si layer onto crystalline Si substrates can be grown epitaxially during the post-deposition heat treatments. The suppression of surface $SiO_2$ can be explained in terms of adsorption of SiHx adspecies, instead of oxygen from residual gases in the reactors, to Si surfaces after desorption of hydrogen from H-passivated Si surfaces. Employing $Si_2H_6$ flowing and soild phase epitaxial growth, high-quality epitaxial Si layer can be obtained at low temperatures below $600^{\circ}C$ without conventional high temperature cleaning procedures.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.3
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• pp.386-391
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• 1996

SiC particles (average size is 270 nm) of 0, 10, 20, 30, 40 vol% were dispersed in $Si_{3}N_{4}$, and $Si_{3}N_{4}/SiC$ nanocomposites were fabricated by hot press. After sintering, matrix phase, ${\alpha}-Si_{3}N_{4}$ was transformed to ${\beta}-Si_{3}N_{4}$, and second phase, ${\beta}-SiC$ was not changed. No grain boundary crystalline phase by adding of sintering additives was detected. Grain growth of $Si_{3}N_{4}$ was supressed with increasing of SiC contents, and then fine grain was occurred. The highest fracture strength was obtained at 10 vol% SiC, and fracture toughness was decreased, but hardness was linearly increased with SiC content.

• Journal of Welding and Joining
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• v.14 no.4
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• pp.99-108
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• 1996

The microstructure and bond strength are examined on the SiC/SiC and SiC/mild steel joints brazed by the Ag-Ti based alloys with different Ti contents. In the SiC/SiC brazed joints, the thickness of the reaction layers at the bond interface and the Ti particles in the brazing alloy matrices increase with Ti contents. When Ti is added up to 9 at% in the brazing alloy. $Ti_3SiC_2$ phase in addition to TiC and $Ti_5Si_3$ phase is newly created at the bond interface and TiAg phase is produced from peritectic reaction in the brazing alloy matrix. In the SiC/mild steel joints brazed with different Ti contents, the microstructure at the bond interface and in the brazing alloy matrix near SiC varies similarly to the case of SiC/SiC brazed joints. But, in the brazing alloy matrix near the mild steel, Fe-Ti intermetallic compounds are produced and increased with Ti contents. The bond strengths of the SiC/SiC and SiC/mild steel brazed joints are independent on Ti contents in the brazing alloy. There are no large differences of the bond strength between SiC/SiC and SiC/mild steel brazed joints. In the SiC/mild steel brazed joints, Fe dissolved from the mild steel does not affect on the bond strength of the joints. Thermal contraction of the mild steel has nearly no effects on the bond strength due to the wide brazing gap of specimens used in the four-point bend test. The brazed joints has the average bond strength of about 200 MPa independently on Ti contents, Fe dissolution and joint type. Fracture in four-point bend test initiates at the interface between SiC and TiC reaction layer and propagates through SiC bulk. The adhesive strength between SiC and TiC reaction layer seems to mainly control the bond strength of the brazed joints.

• Resources Recycling
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• v.22 no.3
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• pp.28-35
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• 2013

The recycling of the Si/SiC mixture sludge obtained from solar cell industry is very significant, environmentally and economically. The sintering characteristics of Si/SiC mixture sludge was studied for the purpose of recycling. In this study, to understand sintering behavior, SiC content in the Si/SiC mixture was controlled using an air separator. Various Si/SiC mixtures having different SiC contents were sintered using carbon black, clay and aluminum hydroxide as sintering aids. Physical properties of Si/SiC mixture and sintered bodies have been characterized using SEM, XRD, particle size analyzer and apparent density measurement. SEM and particle size analysis result confirmed that the fine particles less than 1 ${\mu}m$ decreased or removed more effectively through the air separator in the case of 95% SiC sample compared than the case of 75% SiC sample or original SiC sample. Further, with addition of the Aluminum Hydroxide, ${\beta}$-cristobalite phase gradually decreased while mullite phase gradually increased. The addition of the carbon black improved the sintering characteristics.

• Journal of Korean Ophthalmic Optics Society
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• v.13 no.1
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• pp.53-58
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• 2008

Purpose: To design and fabricate the small sputter coating system for the Ophthalmic lens. Methods: The design of sputter target was done using macleod program for AR coating and mirror coating of Ophthalmic lens with Si target and then the sputter system was fabricated. Results: The optimum condition of AR coating with Si target was [air|$SiO_2$(81.3)|$Si_3N_4$ (102)|$SiO_2$(19.21)|$Si_3N_4$(15.95)|$SiO_2$(102)|glass], for blue color mirror coating [air|$SiO_2$(56.61)|$Si_3N_4$(135.86)|$SiO_2$(67.64)|$Si_3N_4$(55.4)|$SiO_2$(53.53)|$Si_3N_4$(51.28)|glass], for green color coating [air|$SiO_2$(66.2)|$Si_3N_4$(22.76)|$SiO_2$(56.58)|$Si_3N_4$(140.35)|$SiO_2$(152.35)|$Si_3N_4$(70.16)|$SiO_2$(121.87)|glass], for gold color [air|$SiO_2$(83.59)|$Si_3N_4$(144.86)|$SiO_2$(11.82)|$Si_3N_4$(129.93)|$SiO_2$(90.01)|$Si_3N_4$(88.37)|glass]. Conclusions: In the fabrication of sputtering coating apparatus, Dual cathode with same Ti target were coated at the same time on both sides of Ophthalmic lens to lessen the time of coating on Ophthalmic Lens and save the cost of the lens. The distance of target-substrate of cathode was variable from 12.5 cm to 20 cm. Turbo pump was used to take the whole coating process about 15 min. instead of diffusion pump. The lens holder was made to coat 2 pairs lens every coating and was rotated to get the uniformity of thin film.

• Applied Chemistry for Engineering
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• v.16 no.6
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• pp.768-771
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• 2005

The deposition of silicon nitride ($SiN_x$) thin films was carried out on $SiO_2/Si$ substrate at room temperature by reactive dc magnetron sputtering. The analysis of deposited $SiN_x$ films using x-ray photoelectron spectroscopy indicated that the composition of $SiN_x$ films was Si-rich. The deposited $SiN_x$ thin films were annealed by varying annealing temperature and time. X-ray diffraction (XRD) analysis was performed in order to examine the crystallization of Si in $SiN_x$ thin films. The optical and electrical properties of $SiN_x$ thin films were measured for the observation of Si nanodot. As a result, we observed the XRD peaks that might be the Si crystals. As the annealing time and annealing temperature increased, the photoluminescence intensity of $SiN_x$ films gradually increased. The capacitance-voltage characteristics of $SiN_x$ film measured before and after annealing indicated that the trap effect of electrons or holes occurred due to the existence Si nanodots in the $SiN_x$ thin films.