• Journal of Environmental Science International
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• v.21 no.9
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• pp.1163-1169
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• 2012

Destruction and removal efficiency (DRE) of $SF_6$ was tested with low degrees of ionization. The applied dose of ionization energy varied from 63.70 to 212.34 kGy. The initial concentration and flow rate of $SF_6$ gas were 1,000 ppm and 50L/min, respectively. In order to increase the DRE, injection of conditioning agent ($H_2$) were conducted. The DRE of $SF_6$ increased about 2 times with injection of $H_2$ gas.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.7
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• pp.675-681
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• 2005

$SF_6$ is widely used as gas insulation medium because of having excellent dielectric and arc-quenching properties. However the use of it is getting to be suppressed from the viewpoint of mitigating global warming. For the development of environmentally-benign electric power equipment and system, novel gases or mixture gases are strongly required as the substitute of $SF_6$ gas. In this study the authors constructed an experimental system to investigate insulation properties of the mixed gases composed of negative $gas(SF_6)$ and electron deceleration gases$(N_2\;and\;CO_2)$. Breakdown and prebreakdown characteristics of $SF_6/N_2/CO_2$ mixture gases were investigated using the above mentioned system for different rates and gas pressures.

• Journal of the Korean Vacuum Society
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• v.17 no.1
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• pp.16-22
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• 2008

We studied plasma etching of polycarbonate in $O_2/SF_6$, $O_2/N_2$ and $O_2/CH_4$. A capacitively coupled plasma system was employed for the research. For patterning, we used a photolithography method with UV exposure after coating a photoresist on the polycarbonate. Main variables in the experiment were the mixing ratio of $O_2$ and other gases, and RF chuck power. Especially, we used only a mechanical pump for in order to operate the system. The chamber pressure was fixed at 100 mTorr. All of surface profilometry, atomic force microscopy and scanning electron microscopy were used for characterization of the etched polycarbonate samples. According to the results, $O_2/SF_6$ plasmas gave the higher etch rate of the polycarbonate than pure $O_2$ and $SF_6$ plasmas. For example, with maintaining 100W RF chuck power and 100 mTorr chamber pressure, 20 sccm $O_2$ plasma provided about $0.4{\mu}m$/min of polycarbonate etch rate and 20 sccm $SF_6$ produced only $0.2{\mu}m$/min. However, the mixed plasma of 60 % $O_2$ and 40 % $SF_6$ gas flow rate generated about $0.56{\mu}m$ with even low -DC bias induced compared to that of $O_2$. More addition of $SF_6$ to the mixture reduced etch of polycarbonate. The surface roughness of etched polycarbonate was roughed about 3 times worse measured by atomic force microscopy. However examination with scanning electron microscopy indicated that the surface was comparable to that of photoresist. Increase of RF chuck power raised -DC bias on the chuck and etch rate of polycarbonate almost linearly. The etch selectivity of polycarbonate to photoresist was about 1:1. The meaning of these results was that the simple capacitively coupled plasma system can be used to make a microstructure on polymer with $O_2/SF_6$ plasmas. This result can be applied to plasma processing of other polymers.

• Journal of Climate Change Research
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• v.4 no.3
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• pp.269-278
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• 2013

Sulfur hexafloride($SF_6$) emission to atmosphere is lower than $CO_2$, but $SF_6$ GWP is 22,800 times lager than $CO_2$. In recent years as restriction of $non-CO_2$ gas has been greatly reinforced, development of environment-friendly technology with $SF_6$ removal is becoming to main issue. This study shows that $SF_6$ used insulator electrical equipment has emission characteristics during the each phase(maintenance, use, diposal), and analyzed $SF_6$ emission reduction technology related phase. The major technology applies maintenance and disposal step is that improvment of gas recovery rate($85{\rightarrow}99%$), manufacturing catalysts, internal inspection of circuit breaker using endoscopy. Using those technolgies can reduce $SF_6$ emission in atmosphere.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.6 no.1
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• pp.54-65
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• 1994

Performance of naturally circulating cooling system of $SF_6$ gas charged transformer was simulated and the variations of gas flow rate, maximum coil temperature, gas temperature and cooling air temperature were investigated with respect to the height of radiator, interplates distance and heat generation rate at core. The results show that the height of radiator most significantly affects the performance of natural circulating cooling system of transformer.

• Journal of Korean Society for Atmospheric Environment
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• v.28 no.4
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• pp.446-453
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• 2012

Destruction and removal efficiency (DRE) of $SF_6$ was tested with varying degrees of ionization and initial concentrations of $SF_6$. The applied dose of ionization energy varied from 0 to 400 kGy. The initial concentration of $SF_6$ gas also varied from 1,000 ppm to 2,500 ppm. In order to assess the effect of a residence time on DRE (Destruction and Removal Efficiency, %), experiments were also conducted at different irradiation times of 3, 5, 10, 15, and 20 sec, respectively. The DRE of $SF_6$ increased with an increasing amount of dose and current. Regardless of initial concentration of $SF_6$, 90% level of DRE was achieved by applying over 10 mA of electrical current.

• Journal of Electrical Engineering and Technology
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• v.7 no.5
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• pp.765-771
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• 2012

$SF_6$ gas has been used as arc quenching and insulating medium for high and extra high voltage switching devices due to its high dielectric strength, its excellent arc-quenching capabilities, its high chemical stability and non toxicity. Despite of its significant contributions, the gas was classified as one of the greenhouse gas in the Kyoto Protocol. Thus, many researches are conducted to find out the replacement materials and to develop the $SF_6$ gas useless electrical equipment. This paper describes experiments on the temperature change-related breakdown characteristics of $SF_6$ gas ($SF_6$) and $SF_6$ liquid ($LSF_6$) in a model GIS(Gas-Insulated Switchgear) chamber in order to show the possibility of more stable and safe usages of $SF_6$ gas. The breakdown characteristics are classified into three stages, namely the gas stage of $SF_6$ according to Paschen's law, the coexisting stage of $SF_6$ gas with liquid in considerable deviation at lower temperature, and the stage of $LSF_6$ and remaining air. The result shows that the ability of the $LSF_6$ insulation is higher than the high-pressurized $SF_6$. Moreover, it reveals that the breakdown characteristics of $LSF_6$ are produced by bubble-formed $LSF_6$ evaporation and bubbles caused by high electric emission and the corona. In addition, the property of dielectric breakdown of $LSF_6$ is determined by electrode form, electrode arrangement, bubble formation and movement, arc extinguishing capacity of the media, difficulty in corona formation, and the distance between electrodes. The bubble formation and flow separation phenomena were identified for $LSF_6$. It provides fundamental data not only for $SF_6$ gas useless equipment but also for electric insulation design of high-temperature superconductor and cryogenic equipment machinery, which will be developed in future studies.

• Journal of the Korean Vacuum Society
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• v.18 no.2
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• pp.85-91
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• 2009

There has been a rapid progress for flexible polymer-based MEMS(Microelectromechanical Systems) technology. Polycarbonate (PC) and Poly Methyl Methacrylate (PMMA), so-called acrylic, have many advantages for optical, non-toxic and micro-device application. We studied dry etching of PC and PMMA as a function of % gas ratio in the $O_2/SF_6/CH_4$ temary plasma. A photoresist pattern was defined on the polymer samples with a mask using a conventional lithography. Plasma etching was done at 100 W RIE chuck power and 10 sccm total gas flow rate. The etch rates of PMMA were typically 2 times higher than those of PC in the whole experimental range. The result would be related to higher melting point of PC compared to that of PMMA. The highest etch rates of PMMA and PC were found in the $O_2/SF_6$ discharges among $O_2/SF_6$, $O_2/CH_4$ and $SF_6/CH_4$ and $O_2/SF_6/CH_4$ plasma composition (PC: ${\sim}350\;nm/min$ at 5 sccm $O_2/5$ sccm $SF_6$, PMMA: ${\sim}570\;nm/min$ at 2.5 sccm $O_2/7.5$ sccm $SF_6$). PC has smoother surface morphology than PMMA after etching in the $O_2/SF_6/CH_4$ discharges. The surface roughness of PC was in the range of 1.9$\sim$3.88 nm. However, that of PMMA was 17.3$\sim$26.1 nm.

• Journal of the Korean Vacuum Society
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• v.21 no.4
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• pp.199-204
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• 2012

$SF_6$ gas is widely used for dry etching process of semiconductor and display fabrication process. But $SF_6$ gas is considered for typical greenhouse gas for global warming. So it is necessary to research relating to $SF_6$ alternatives reducing greenhouse effect in semiconductor and display. $C_3F_6$ gas is one of the promising candidates for it. We studied about etch characteristics by performing Reactive Ion Etching process of dry etching and reduced gas element exhausted on etching process using absorbent Zeolite 5A. $Si_3N_4$ thin film was deposited to 500 nm with Plasma Enhanced Chemical Vapor Deposition and we performed Reactive Ion Etching process after patterning through photolithography process. It was observed that the etch rate and the etched surface of $Si_3N_4$ thin film with Scanning Electron Microscope pictures. And we measured and compared the exhausted gas before and after the absorbent using Gas Chromatograph-Mass Spectrophotometry.

• Journal of Electrical Engineering and Technology
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• v.10 no.3
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• pp.1181-1187
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• 2015

Sulfur hexafluoride (SF₆) gas is used widely in electric power equipment such as Gas Insulated Switchgear (GIS), Gas Insulation transmission Line (GIL), and Gas Circuit Breaker (GCB). But applications of SF₆ should be restricted because SF6 gas is one of the greenhouse effect gases. To reduce use of SF₆ gas, a study on eco-friendly alternative insulation medium is needed. In this paper, we investigated lightning impulse (LI) breakdown of dry-air which is attracting attention as an ecofriendly alternative gas and the LI breakdown of hybrid insulation combined with dry-air and solid insulation (Room-Temperature Vulcanizing Silicone Rubber-RTV SIR) and dry-air in inhomogeneous fields according to gap distance and pressure. The experiment results showed that the LI breakdown strength of hybrid insulation system was higher than that of dry-air insulation system. It was verified that the development of technology related to eco-friendly power apparatus compact such GIS, GCB and GIL can be used as basic research data.