• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.1-8
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• 2008

Effects of annealing process in a reduction ambient on thermoelectric properties of the $(Bi,Sb)_{2}Te_3$ thin films prepared by thermal evaporation have been investigated. With annealing at $300^{\circ}C$ for 2 hrs in a reduction ambient(50% $H_2$+50% Ar), the crystallinity of the $(Bi,Sb)_{2}Te_3$ thin films were substantially improved with remarkable increase in the grain size. Seebeck coefficients of the $(Bi,Sb)_{2}Te_3$ thin films increased from$\sim90{\mu}V/K$ to $\sim180{\mu}V/K$ with annealing in the reduction ambient due to decrease in the hole concentration. Power factors of the $(Bi,Sb)_{2}Te_3$ thin films were remarkably improved for $5\sim16$ times with annealing in the reduction atmosphere. After annealing in the reduction ambient, a $(Bi,Sb)_{2}Te_3$ evaporated film exhibited a maximum power factor of $18.6\times10^{-4}W/K^{2}-m$.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.1-7
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• 2010

Interfacial reaction characteristics of a Bi-10Cu-20Sb-0.3Ni Pb-free alloy on Cu pad was investigated by reflow soldering at $430^{\circ}C$. The thickness of interfacial reaction layers with respect to the soldering time was also measured. After the reflow soldering, it was observed that a $(Cu,Ni)_2Sb$, a $Cu_4Sb$ intermetallic layer, and a haze layer, which is consisted of Bi and $Cu_4Sb$ phases, were successively formed at the Bi-10Cu-20Sb-0.3Ni/Cu interface. The total thickness of the reaction layers was found to be linearly increased with increasing of the reflow soldering time up to 120 s. As the added Ni element did not participate in the formation of the thickest $Cu_4Sb$ interfacial layer, suppression of the interfacial growth was not observed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.4
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• pp.162-166
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• 2017

Thermoelectric compounds of $Zn_{1-x}Ag_xSb$ with x = 0~0.2 were prepared by vacuum melting and quenching process and their crystal phases and thermoelectric properties were examined. It was found that free metallic Sb phases were formed in the compound with x = 0.05, leading to increasing the electrical conductivities. The power factors were significantly affected by the electrical conductivity rather than Seebeck coefficient. When x > 0.05, the peak intensities of $Ag_3Sb$ phases in XRD patterns were increased and those of free Sb phases were weakened. These changes of second phases resulted in decreasing the electrical conductivities and the power factors and became more obvious in the compound with x = 0.2.

• Journal of the Korean Ceramic Society
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• v.44 no.6 s.301
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• pp.297-302
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• 2007

With aids of square wave voltammetry (SWV) the redox behavior for various combination of polyvalent ions (Sb+Fe, Sb+Zn, Sb+Ce+Ti+Zn) was investigated in alkali-alkaline earth-silica CRT (Cathode Ray Tube) glass melts. The current-potential curve so called voltammogram was produced at temperature range of 1400 to $1000^{\circ}C$ under the scanned potential between 0 and -800 mV at 100 Hz. In the case of the Sb+Fe and Sb+Zn doped melts, peak for $Sb^{3+}/Sb^0$ shown voltammogram was shifted to negative direction comparing to the only Sb doped melts. However, according to voltammogram of Sb+Ce+Ti+Zn doped melt, Ti and Ce except Zn had hardly any influence on the redox reaction of Sb. Based on the temperature dependence of the peak potential, standard enthalpy (${\Delta}H^0$) and standard entropy (${\Delta}S^0$) for the reduction of $Fe^{3+}$ to $Fe^{2+}$, $Sb^{3+}$ to $Sb^0$, $Zn^{2+}$ to $Zn^0$ and $Ti^{2+}$ to $Ti^0$ in each polyvalent ion combination of CRT glass melts were calculated.

• Korean Journal of Materials Research
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• v.27 no.2
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• pp.89-93
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• 2017

A thin film thermoelectric generator that consisted of 5 p/n pairs was fabricated with $1{\mu}m$-thick n-type $In_3Sb_1Te_2$ and p-type $Ge_2Sb_2Te_5$ deposited via radio frequency magnetron sputtering. First, $1{\mu}m$-thick GST and IST thin films were deposited at $250^{\circ}C$ and room temperature, respectively, via radio-frequency sputtering; these films were annealed from 250 to $450^{\circ}C$ via rapid thermal annealing. The optimal power factor was found at an annealing temperature of $400^{\circ}C$ for 10 min. To demonstrate thermoelectric generation, we measured the output voltage and estimated the maximum power of the n-IST/p-GST generator by imposing a temperature difference between the hot and cold junctions. The maximum output voltage and the estimated maximum power of the $1{\mu}m$-thick n-IST/p-GST TE generators are approximately 17.1 mV and 5.1 nW at ${\Delta}T=12K$, respectively.

• Korean Journal of Materials Research
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• v.16 no.7
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• pp.435-438
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• 2006

The hot pressing was employed to prepare Fe-doped $CoSb_3$ skutterudites and their thermoelectric properties were investigated. Single phase ${\delta}-CoSb_3$ was successfully obtained by the hot pressing under 60MPa at 773 K for 2 hrs. Iron atoms acted as electron acceptors by substituting cobalt atoms. Thermoelectric properties were remarkably improved by the appropriate doping. $Co_{0.7}Fe_{0.3}Sb_3$ was found as an optimum composition for the best thermoelectric property in this work.

• Korean Journal of Materials Research
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• v.8 no.5
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• pp.413-418
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• 1998

Electrical and Thermoelectric Properties of$ SbI_{3}$-doped 85% 85% $BiTe_{2}$$Se_{3}$ 단결정에서 전하 이동에 대한 살란인자는 0.1이었으며, 전자이동도와 정공이동도의 비($\mu_{e}$ /$\mu_{h}$ )는 1.45이었다. $SbI_{3}$의 첨가량이 증가할수록 전자 농도의 증가로 Seebek 계수와 전기비저항이 감소하며, Seebeck 계수와 전기비저항이 최대값을 나타내는 온도가 고온으로 이동하였다. $SbI_{3}$를 첨가한 85%$Bi_{2}$$Te_{3}$단결정에서 성능지수의 최대값은 $SbI_{3}$를 0.1 wt%첨가한 조성에서 $2.0 x 10^{-3}$ K이었다.

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.3
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• pp.433-438
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• 1987

The current-voltage characteristics of the ZnO varisor with and without Sb2O3 which were fabricated with the various calcination and sintering temperature were discussed by comparing the results of SEM-microstructures and X-ray diffraction analysis. The samples were calcined at the temperature up to 800\ulcorner for 2 hours and they were sintered at 1200-1300\ulcorner for 1 hour. Then, we applied the power up to dc 200 volt to the samples and measured the output current up to 100mA. The samples without Sb2O3 had lower nonlinear resistances at the all calcination and sintering temperatures due to the large grains because of not forming Spinel phase. The other samples contained Sb2O3 could form Pyrochlore and Spinel phases at the all calcination temperatures by X-ray diffraction phase analysis. We found that the Spinel phases which were formed at the calcination process inhibit growth of ZnO grain and give rise to the change of nonlinear resistances by SEM-microstructures. And we found that the base of ZnO grain growth control is strongly dependent on the behavior of Sb2O3 in calcination process.

• Tribology and Lubricants
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• v.14 no.3
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• pp.17-23
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• 1998

Friction materials with three different formulations containing different solid lubricants were investigated to study the role of lubricants on the friction performance. The three friction materials contained graphite 10 vol.%, graphite 7 vol.%+$MoS_2$ 3 vol.%, and graphite 7 vol.%+$Sb_2S_3$ 3 vol.%, respectively, with the same amount of other ingredients. Results of this work showed that each formulation with different lubricants had unique advantages and disadvantages. The friction materials containing graphite 7 vol.%+$MoS_2$ 3 vol.% and graphite 7 vol.%+$Sb_2S_3$ 3 vol.% showed better resistance to fading and improved friction stability compared to the friction materials containing graphite only as a lubricant. However, the friction materials with two lubricants (graphite+$MoS_2$ or $Sb_2S_3$) showed disadvantages on DTV generation and rotor wear.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.77-82
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• 2010

Effects of evaporation processes and a reduction annealing on thermoelectric properties of the Sb-Te thin films prepared by thermal evaporation have been investigated. The thin film evaporated by using the powders formed by crushing a $Sb_2Te_3$ ingot as an evaporation source exhibited a power factor of $2.71{\times}10^{-4}W/m-K^2$. The thin film processed by evaporation of the mixed powders of Sb and Te as an evaporation source showed a power factor of $0.12{\times}10^{-4}W/m-K^2$. The thin film fabricated by coevaporation of Sb and Te dual evaporation sources possessed a power factor of $0.73{\times}10^{-4}W/m-K^2$. With a reduction annealing at $300^{\circ}C$ for 2 hrs, the power factors of the films evaporated by using the $Sb_2Te_3$ ingot-crushed powders and coevaporated with Sb and Te dual evaporation sources were remarkably improved to $24.1{\times}10^{-4}W/m-K^2$ and $40.2{\times}10^{-4}W/m-K^2$, respectively.