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Interfacial Reaction Characteristics of a Bi-20Sb-10Cu-0.3Ni Pb-free Solder Alloy on Cu Pad  

Kim, Ju-Hyung (Department of Materials Science & Engineering, Seoul National University of Technology)
Hyun, Chang-Yong (Department of Materials Science & Engineering, Seoul National University of Technology)
Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.1, 2010 , pp. 1-7 More about this Journal
Abstract
Interfacial reaction characteristics of a Bi-10Cu-20Sb-0.3Ni Pb-free alloy on Cu pad was investigated by reflow soldering at $430^{\circ}C$. The thickness of interfacial reaction layers with respect to the soldering time was also measured. After the reflow soldering, it was observed that a $(Cu,Ni)_2Sb$, a $Cu_4Sb$ intermetallic layer, and a haze layer, which is consisted of Bi and $Cu_4Sb$ phases, were successively formed at the Bi-10Cu-20Sb-0.3Ni/Cu interface. The total thickness of the reaction layers was found to be linearly increased with increasing of the reflow soldering time up to 120 s. As the added Ni element did not participate in the formation of the thickest $Cu_4Sb$ interfacial layer, suppression of the interfacial growth was not observed.
Keywords
Pb-free solder; Bi-based solder; high-temperature solder; interfacial reaction; intermetallic layer;
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Times Cited By KSCI : 1  (Citation Analysis)
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