Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 15 Issue 3
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- Pages.1-8
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Efface of Annealing in a Reduction Ambient on Thermoelectric Properties of the $(Bi,Sb)_{2}Te_{3}$ Thin Films Processed by Vacuum Evaporation
환원분위기 열처리가 $(Bi,Sb)_{2}Te_{3}$ 증착박막의 열전특성에 미치는 영향
- Kim, Min-Young (Department of Materials Science and Engineering, Hongik University) ;
- Oh, Tae-Sung (Department of Materials Science and Engineering, Hongik University)
- Published : 2008.09.30
Abstract
Effects of annealing process in a reduction ambient on thermoelectric properties of the
환원분위기 열처리가 진공증착법으로 형성한