• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.373-373
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• 2014

Resistive-change random access memory (ReRAM) device is one of the promising candidates owing to its simple structure, high scalability potential and low power operation. Many resistive switching devices using transition metal oxides materials such as NiO, Al2O3, ZnO, HfO2, $TiO_2$, have attracting increased attention in recent years as the next-generation nonvolatile memory. Among various transition metal oxides materials, HfO2 has been adopted as the gate dielectric in advanced Si devices. For this reason, it is advantageous to develop an HfO2-based ReRAM devices to leverage its compatibility with Si. However, the annealing temperature of these high-k thin films for a suitable resistive memory switching is high, so there are several reports for low temperature process including microwave irradiation. In this paper, we demonstrate the bipolar resistive switching characteristics in the microwave irradiation annealing processed Ag/HfO2/Pt ReRAM device. Compared to the as-deposited Ag/HfO2/Pt device, highly improved uniformity of resistance values and operating voltage were obtained from the micro wave annealing processed HfO2 ReRAM device. In addition, a stable DC endurance (>100 cycles) and a high data retention (>104 sec) were achieved.

• Korean Journal of Materials Research
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• v.20 no.5
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• pp.257-261
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• 2010

A non-volatile resistive random access memory (RRAM) device with a Cr-doped $SrZrO_3/SrRuO_3$ bottom electrode heterostructure was fabricated on $SrTiO_3$ substrates using pulsed laser deposition. During the deposition process, the substrate temperature was $650^{\circ}C$ and the variable ambient oxygen pressure had a range of 50-250 mTorr. The sensitive dependences of the film structure on the processing oxygen pressure are important in controlling the bistable resistive switching of the Cr-doped $SrZrO_3$ film. Therefore, oxygen pressure plays a crucial role in determining electrical properties and film growth characteristics such as various microstructural defects and crystallization. Inside, the microstructure and crystallinity of the Cr-doped $SrZrO_3$ film by oxygen pressure were strong effects on the set, reset switching voltage of the Cr-doped $SrZrO_3$. The bistable switching is related to the defects and controls their number and structure. Therefore, the relation of defects generated and resistive switching behavior by oxygen pressure change will be discussed. We found that deposition conditions and ambient oxygen pressure highly affect the switching behavior. It is suggested that the interface between the top electrode and Cr-doped $SrZrO_3$ perovskite plays an important role in the resistive switching behavior. From I-V characteristics, a typical ON state resistance of $100-200\;{\Omega}$ and a typical OFF state resistance of $1-2\;k{\Omega}$, were observed. These transition metal-doped perovskite thin films can be used for memory device applications due to their high ON/OFF ratio, simple device structure, and non-volatility.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.478-478
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• 2013

Resistance-change Random Access Memory (ReRAM) memory, which utilizes electrochemical control of metal in thin films of solid electrolyte, shows great promise as a future solid state memory. The technology utilizes the electrochemical formation and removal of metallic pathways in thin films of solid electrolyte. Key attributes are low voltage and current operation, excellent scalability, and a simple fabrication sequence. In this work, we investigated the nature of thin films formed by photo doping of Ag+ ions into chalcogenide materials for use in solid electrolyte of Resistance-change RAM devices and switching characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.182-186
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• 2012

Resistance-change Random Access Memory(ReRAM) memory, which utilizes electrochemical control of metal in thin films of solid electrolyte, shows great promise as a future solid state memory. The technology utilizes the electrochemical formation and removal of metallic pathways in thin films of solid electrolyte. Key attributes are low voltage and current operation, excellent scalability, and a simple fabrication sequence. In this work, we investigated the nature of thin films formed by photo doping of $Ag^+$ ions into chalcogenide materials for use in solid electrolyte of Resistance-change RAM devices and switching characteristics according to field-effect.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.8
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• pp.491-496
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• 2014

The resistive switching characteristics of resistive random access memory (ReRAM) based on amorphous $Ge_{0.5}Se_{0.5}$ thin films have been demonstrated by using Ti/Ag nanocrystals/$Ge_{0.5}Se_{0.5}$/Pt structure. Ag nanocrystals (Ag NCs) were spread on the amorphous $Ge_{0.5}Se_{0.5}$ thin film and they played the role of metal ions source. As a result, comparing the conventional Ag/$Ge_{0.5}Se_{0.5}$/Pt structure, this Ti/Ag NCs/$Ge_{0.5}Se_{0.5}$/Pt ReRAM device exhibits the highly uniform bipolar resistive switching (BRS) characteristics, such as the operating voltages, and the resistance values. At the same time, a stable DC endurance(> 100 cycles), and the excellent data retention (> $10^4$ sec) properties were found from the Ti/Ag NCs/$Ge_{0.5}Se_{0.5}$/Pt structured ReRAM device.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.379-379
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• 2011

차세대 저항메모리(resistive switching random access memory; ReRAM)의 개발을 위해 다양한 산화 물질들의 저항 변화 특성이 연구되고 있다. 본 연구에서는 저항 변화 물질로 잘 알려진 ZnO 박막을 이용하여 저항 변화 특성을 평가하였다. ZnO 박막은 Pt/Ti/$SiO_2$/Si 기판 위에 스퍼터링 시스템을 이용하여 약 50 nm 두께로 증착되었다. 증착된 박막 위에 전극을 evaporator를 이용하여 패턴닝함으로써 전극-반도체-전극 구조의 소자를 만들고 이의 전기적 특성을 평가하였다. Compliance current를 설정하여 저항 변화 특성을 측정한 결과 가해진 전압의 극성에 관계 없이 저항이 변화하는, dielectric breakdown에 의해 박막내 전도성 필라멘트라 불리는 전도성 길이 생성되었다가 joule-heating에 의해 필라멘트가 파열되는, 전형적인 unipolar 저항 변화특성이 나타났다. 다기능성 소자 개발을 위해 위 소자 구조를 투명한 고분자 기판위에 형성하고 표면에 초발수성 ZnO 나노막대 구조를 합성하였다. 그 결과 투명하면서 유연하고, 수분에도 안정적인 다기능성 저항 변화 소자 특성을 평가할 수 있었다. 본 결과를 바탕으로 필라멘트 이론에 기초한 저항 변화 메커니즘을 설명하는 모델이 제시되었다.

• Transactions on Electrical and Electronic Materials
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• v.15 no.1
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• pp.24-27
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• 2014

In this study, the effects of Mn-doping and the electrode materials on the memory characteristics of $ZnO_xS_{1-x}$ resistive random access memory (ReRAM) devices on plastic are investigated. Compared with the undoped Al/$ZnO_xS_{1-x}$/Au and Al/$ZnO_xS_{1-x}$/Cu devices, the Mn-doped ones show a relatively higher ratio of the high resistance state (HRS) to low resistance state (LRS), and narrower resistance distributions in both states. For the $ZnO_xS_{1-x}$ devices with bottom electrodes of Cu, more stable conducting filament paths are formed near these electrodes, due to the relatively higher affinity of copper to sulfur, compared with the devices with bottom electrodes of Au, so that the distributions of the set and reset voltages get narrower. For the Al/$ZnO_xS_{1-x}$/Cu device, the ratio of the HRS to LRS is above $10^6$, and the memory characteristics are maintained for $10^4$ sec, which values are comparable to those of ReRAM devices on Si or glass substrates.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.3
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• pp.663-669
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• 2014

The electrical characteristics of RRAM with different annealing temperature and thickness have been measured and discussed. The devices with Pt/Ti top electrode of 150nm, Pt bottom electrode of 150nm, $HfO_2$ oxide thickness of 45nm and 70nm have been fabricated. The fabricated device were classified by 3 different kinds according to the annealing temperature, such as non-annealed, annealed at $500^{\circ}C$ and annealed at $850^{\circ}C$. The set and reset voltages and the variation of resistance with temperatures have been measured as electrical properties. From the measurement, it was found that the set voltages were decreased and the reset voltage were increased slightly, and thus the sensing window was decreased with increasing of measurement temperatures. It was remarkable that the device annealed at $850^{\circ}C$ showed the best performances. Although the device with thickness of 45nm showed better performances in the point of the sensing window, the resistance of 45nm devices was large relatively in the low resistive state. It can be expected to enhance the device performances with ultra thin RRAM if the defect generation could be reduced at the $HfO_2$ deposition process.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.15.2-15.2
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• 2011

비휘발성 저항 메모리소자인 resistance random access memory (ReRAM)는 간단한 소자구조와 빠른 동작특성을 나타내며 고집적화에 유리하기 때문에 차세대 메모리소자로써 각광받고 있다. 현재, 이성분계 산화물, 페로브스카이트 산화물, 고체 전해질 물질, 유기재료 등을 응용한 저항 메모리소자에 대한 연구가 활발히 진행되고 있다. 그 중 ZnO를 기반으로 하는 amorphous InGaZnO (a-IGZO) 박막은 active layer 로써 박막트랜지스터 적용 시 우수한 전기적 특성을 나타내며, 빠른 동작특성과 높은 저항 변화율을 보이기 때문에 ReRAM 에 응용 가능한 재료로써 기대되고 있다. 또한 가시광선 영역에서 광학적으로 투명한 특성을 보이기 때문에 투명소자로서도 응용이 기대되고 있다. 본 연구에서는 indium tin oxide (ITO) 투명 전극을 적용한 ITO/a-IGZO/ITO 구조의 투명 소자를 제작하여 저항 메모리 특성을 평가하였다. Radio frequency (RF) sputter를 이용하여 IGZO 박막을 합성하고, ITO 전극을 증착하여 투명 저항 메모리소자를 구현하였고, resistive switching 효과를 관찰하였다. 또한, 열처리를 통해 a-IGZO 박막 내의 Oxygen vacancy와 같은 결함의 정도에 따른 on/off 저항의 변화를 관찰할 수 있었다. 제작된 저항 메모리소자는 unipolar resistive switching 특성을 보였으며, 높은 on/off 저항의 차이를 유지하였다. Scanning electron microscope (SEM)을 통해 합성된 박막의 형태를 평가하였고, X-ray diffraction (XRD) 및 transmission electron microscopy (TEM)을 통해 결정성을 평가하였다. 제작된 소자의 전기적 특성은 HP-4145 를 이용하여 측정하고 비교 분석하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.2
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• pp.81-84
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• 2014

The bipolar resistive switching characteristics of resistive random access memory (ReRAM) based on $HfO_2$ thin films have been demonstrated by using Ag/$HfO_2$/Pt structured ReRAM device. MIcrowave irradiation (MWI) treatment at low temperature was employed in device fabrication with $HfO_2$ thin films as a transition layer. Compared to the as-deposited Ag/$HfO_2$/Pt device, highly improved uniformity characteristics of resistance values and operating voltages were obtained from the MWI treatment Ag/$HfO_2$/Pt ReRAM device. In addition, a stable DC endurance (> 100 cycles) and a high data retention (> $10^4$ sec) were achieved.